A thermosetting resin composition having improved flowability and stiffness, and a prepreg using the same. Specifically, three kinds of fillers having different average particle diameters are combined with a binder resin system including an epoxy resin, a bismaleimide resin, a diaminodiphenylsulfone resin, and a benzoxazine resin.

A resin composition and an article made from the resin composition are provided. The resin composition comprises: 30 parts by weight of thermosetting resin; 50 to 125 parts by weight of maleimide resin; and 5 to 35 parts by weight of monofunctional long-chain alkyl acrylate monomer. The resin composition is capable of achieving a proper viscosity and a good filling property whiling maintaining a high glass transition temperature.

The purpose of the present invention is to provide an acrylic resin composition for a film having reduced bleeding and sticking to a roll during formation of an acrylic resin film. The present invention is an acrylic resin composition for a film, the composition comprising: a high-molecular-weight hindered amine-based light stabilizer (A) having a triazine backbone; and an acrylic resin (B). When this acrylic resin composition for a film is used, there is reduced bleeding to a roll surface during film formation, and minimized sticking of the film to the roll.

A thermal-curable resin composition is provided. The thermal-curable resin composition comprises: (A) a thermal-curable resin component, which comprises: (a1) bismaleimide resin; (a2) cyanate ester resin; and (a3) epoxy resin, wherein the cyanate ester resin (a2) and the epoxy resin (a3) are respectively in an amount ranging from 50 parts by weight to 150 parts by weight and from 24 parts by weight to 51 parts by weight per 100 parts by weight of the bismaleimide resin (a1); and (B) a filler,
wherein the filler (B) is in an amount ranging from 40 parts by weight to 55 parts by weight per 100 parts by weight of the dry weight of the resin composition; and
wherein the resin composition has a dynamic viscosity of not higher than 800 Pa.Math.s after being brought into a semi-cured state (B-stage), and the resin composition has a dissipation factor (Df) of not higher than 0.006 at 10 GHz after being cured completely.

Disclosed is a compound useful in a resin composition for fabricating articles such as a prepreg, a resin film, a laminate or a printed circuit board, such that the articles have improved one or more properties including glass transition temperature, ratio of thermal expansion, peel strength, thermal resistance, dielectric constant, dissipation factor and flame retardancy.

Disclosed herein is a prepreg including a woven fabric base and a semi-cured product of a resin composition impregnated into the woven fabric base. The resin composition contains a maleimide resin as Component (A), an acrylic resin as Component (B), and a phenol resin as Component (C). The Component (B) has a weight average molecular weight falling within the range from 200,000 to 850,000.

The present invention provides a prepreg for a coreless substrate and a coreless substrate and a semiconductor package using the prepreg, which can satisfy heat resistance, low thermal expansion, and bonding strength with a metal circuit at a level required for the coreless substrate. Specifically, the prepreg for a coreless substrate contains a thermosetting resin composition containing (a) dicyandiamide, (b) an adduct of a tertiary phosphine and quinones, (c) an amine compound having at least two primary amino groups, and (d) a maleimide compound having at least two primary amino groups having at least two N-substituted maleimide groups. Instead of (c) the amine compound having at least two primary amino groups and (d) the maleimide compound, having at least two N-substituted maleimide groups, (X) an amino-modified polyimide resin obtained by reacting them may be used.

The present invention relates to an epoxy resin composition, comprising the following components: (A) an epoxy resin containing oxazolidinone structure having the structure of the formula (1), (B) an active ester curing agent, and (C) a curing accelerator. The epoxy composition, prepreg, laminate and printed circuit board prepared from such epoxy composition have the following features of low coefficient of thermal expansion, low dielectric loss factor Df less than or equal to 0.0084, low water absorption and excellent moisture and heat resistance.

The invention relates to: anion exchange blend membranes consisting the following blend components: a halomethylated polymer (a polymer with (CH.sub.2).sub.xCH.sub.2Hal groups, Hal=F, Cl, Br, I; x=0-12), which is quaternised with a tertiary or a n-alkylated/n-arylated imidazole, an N-alkylated/N-arylated benzimidazole or an N-alkylated/N-arylated pyrazol to form an anion exchanger polymer. an inert matrix polymer in which the anion exchange polymer is embedded and which is optionally covalently crosslinked with the halomethylated precursor of the anion exchanger polymer, a polyethyleneglycol with epoxide or halomethyl terminal groups which are anchored by reacting with NH-groups of the base matrix polymer using convalent cross-linking optionally an acidic polymer which forms with the anion-exchanger polymer an ionic cross-linking (negative bound ions of the acidic polymer forming ionic cross-linking positions relative to the positive cations of the anion-exchanger polymer) optionally a sulphonated polymer (polymer with sulphate groups SO.sub.2Me, Me=any cation), which forms with the halomethyl groups of the halomethylated polymer convalent crosslinking bridges with sulfinate S-alkylation. The invention also relates to a method for producing said membranes, to the use of said membranes in electrochemical energy conversion processes (e.g. Redox-flow batteries and other flow batteries, PEM-electrolyses, membrane fuel cells), and in other membrane methods (e.g. electrodialysis, diffusion dialysis).

The present invention relates to a halogen-free epoxy resin composition, a prepreg and a laminate containing the same. The halogen-free epoxy resin composition comprises 60 parts by weight of epoxy resin, from 15 to 28 parts by weight of benzoxazine resin, and from 10 to 20 parts by weight of styrene-maleic anhydride. The present invention discloses using from 15 to 28 parts by weight of benzoxazine resin and from 10 to 20 parts by weight of styrene-maleic anhydride to cure 60 parts by weight of epoxy resin, to ensure the Df stability of prepregs at different curing temperature conditions while maintaining low dielectric constant and low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.