Provided is a resin composition that is capable of producing a cured product having excellent environmental suitability, high strength, and excellent flame retardancy, and that is suitably usable as a matrix resin for fiber-reinforced plastics. A resin composition contains (A) an epoxy resin, (B) a cyanate resin, (C) an aromatic amine curing agent that is liquid at 25 C., and (D) a phosphorus-containing compound represented by formula (1). Preferably, in formula (1), R.sup.1 and R.sup.2 each independently represent an alkyl group or an aryl group, and X and Y are an oxygen atom.

An object is to provide a transfer film that can impart sufficient durability performance to a transfer object surface and can also have excellent peeling stability without causing any transfer failures such as tailing and burr. A transfer film including at least a substrate, a release layer provided on the substrate, an intermediate layer provided on the release layer, and a protective layer provided on the intermediate layer, in which the intermediate layer includes a wax component and a rubber component, and the protective layer includes an active light curing resin.

A concealable film including 10 to 94% by mass of a crystalline polyamide resin, 1 to 40% by mass of an amorphous polyamide resin and 5 to 50% by mass of titanium oxide, with the proviso that the total content of these is 100% by mass.

Disclosed are fluorinated vinyl polymer resin compositions, and prepregs and laminate materials containing the same. The fluorinated vinyl polymer resin composition includes a fluorine-substituted vinyl polymer resin and a functional polymer, where the fluorine-substituted vinyl polymer resin has the chemical structure: ##STR00001## where the maximum particle size is less than about 100 microns, at least one of the substituents R.sub.1, R.sub.2, R.sub.3, and R.sub.4 includes a fluorine atom, and where n is greater than about 100. The fluorinated vinyl polymer resin composition can be incorporated in prepreg and laminate materials.

Disclosed is an assembly comprising an insulation material and a copper foil disposed on the insulation material, wherein the copper foil has a thickness of less than or equal to 6 m, and the insulation material is made from a resin composition comprising oxazolidone epoxy resin, oxydianiline type benzoxazine resin and a curing agent. The assembly achieves desirable balanced properties in peel strength, glass transition temperature, dimensional change after reflow, thermal resistance, and dielectric properties.

Disclosed is a resin composition, comprising the following components: (A) 100 parts by weight of an epoxy resin; (B) 10 to 60 parts by weight of a diamino diphenyl ether type benzoxazine resin having a softening point of 40 C. to 140 C.; (C) 10 to 40 parts by weight of a co-hardener; and (D) 10 to 40 parts by weight of a flame retardant which comprises (d1) a high melting point flame retardant with a melting point of greater than 260 C. or (d2) a metal phosphinate flame retardant, wherein the metal is selected from Group IIIA elements. Also disclosed is an article of manufacture obtained from the resin composition and a use thereof. Accordingly, the demands of high frequency application can be met, and a balance of low thermal expansion, high thermal resistance and low warpage in the system can be struck.

The present invention relates to a resin composition having a high flow property, low thermal expansion characteristics, and excellent mechanical properties, and a prepreg and a metal clad laminate formed from the same.

The present invention relates to a resin composition having high miscibility between internal components, low thermal expansion characteristics, and excellent mechanical properties, and a prepreg and a metal clad laminate formed from the same.

The thermosetting resin composition, a prepreg containing same, a metal foil-clad laminate and a printed circuit board; the resin composition comprises the following components: a combination of a bismaleimide resin and a benzoxazine resin or a prepolymer of a bismaleimide resin and a benzoxazine resin, an epoxy resin and an active ester. A metal foil-clad laminate prepared by using the resin composition provided by the present invention has a high glass transition temperature, a low thermal expansion coefficient, a high high-temperature modulus, a high peel strength, a low dielectric constant, a low dielectric loss factor, as well as good heat resistance and good processability.

A halogen-free resin composition and a prepreg and a laminate prepared therefrom. The halogen-free resin composition comprises the following ingredients in parts by weight: 50-100 parts of an epoxy resin, 20-70 parts of benzoxazine, 5-40 parts of polyphenyl ether, 5-30 parts of styrene-maleic anhydride, 5-40 parts of a halogen-free flame retardant, 0.2-5 parts of a curing accelerator, and 20-100 parts of a filler. The prepreg and the laminate, which are manufactured from the halogen-free resin composition, have the comprehensive properties of low dielectric constant, low dielectric loss, excellent heat resistance, adhesive property and wet resistance and the like, and are suitable for being applied to halogen-free high-frequency multilayer circuit boards.