A golf ball material which includes (A) a resin mixture containing as the base resin an acid copolymer in which from 90 to 100 mol % of the acid groups are neutralized with metal ions, and (B) an oxazoline group-containing polymer has a low hardness and a soft feel, and moreover possesses a high rebound resilience. This golf ball material is particularly useful when formed as the intermediate layer in a golf ball having a core, an intermediate layer and an outermost layer with numerous dimples formed on the surface thereof.

The present invention provides an insulating layer for printed circuit boards having a difference of within 20% between the flexural modulus at 25 C. and the flexural modulus under heat at 250 C.

Technologies are generally described to increase a surface smoothness of a 3D printed article implementing a water-based treatment using layer by layer (LBL) deposition. An initial 3D printed article having an anionic surface may be treated with a first aqueous solution comprising at least one polycation that may bind to the anionic surface to produce a first treated surface, which may be rinsed with water to remove the first aqueous solution. The first treated surface may be treated with a second aqueous solution comprising at least one anionic microparticle that may bind to the polycation to produce a final 3D printed article having a second treated surface, which may be rinsed with water to remove the second aqueous solution. The bound polycation and anionic microparticle may be present as a single layer in the final 3D printed article that may act as a conformal coating to increase the surface smoothness.

Disclosed is a resin composition, which comprises 30 parts by weight to 90 parts by weight of a maleimide resin and 15 parts by weight to 60 parts by weight of a benzoxazine resin. The resin composition may be fabricated into various articles, such as prepregs, prepregs with copper foil, resin films, resin films with copper foil, laminates or printed circuit boards, which possess at least one, more or all of the following properties: high peel strength, high thermal resistance after moisture absorption, high glass transition temperature, low thermal expansion, high thermal resistance, low dielectric constant, low dissipation factor and so on.

The present invention relates to a halogen-free flame retardant resin composition, a prepreg and a copper clad laminate prepared therefrom. The composition of the present invention comprises, based on the weight parts of solid components, (A) from 5 to 80 parts by weight of alkylphenol epoxy resin, (B) from 10 to 80 parts by weight of benzoxazine resin, (C) from 2 to 30 parts by weight of styrene maleic anhydride resin, (D) from 1 to 30 parts by weight of a flame retardant, and (E) from 0.5 to 100 parts by weight of an acidic filler having a pH of 2-6. The present invention further provides a prepreg and a copper clad laminate prepared from the halogen-free flame retardant resin composition. While ensuring a higher glass transition temperature and excellent moisture heat resistance, the halogen-free flame retardant resin composition of the present invention effectively improves the dielectric properties and the peel strength stability of the resin composition, and provides the prepregs and copper clad laminates with excellent comprehensive performances.

A halogen-free resin composition and a prepreg and a laminate prepared therefrom. The halogen-free resin composition comprises the following ingredients in parts by weight: 50-100 parts of an epoxy resin, 20-70 parts of benzoxazine, 5-40 parts of polyphenyl ether, 5-30 parts of styrene-maleic anhydride, 5-40 parts of a halogen-free flame retardant, 0.2-5 parts of a curing accelerator, and 20-100 parts of a filler. The prepreg and the laminate, which are manufactured from the halogen-free resin composition, have the comprehensive properties of low dielectric constant, low dielectric loss, excellent heat resistance, adhesive property and wet resistance and the like, and are suitable for being applied to halogen-free high-frequency multilayer circuit boards.

Disclosed is an assembly comprising an insulation material and a copper foil disposed on the insulation material, wherein the copper foil has a thickness of less than or equal to 6 m, and the insulation material is made from a resin composition comprising oxazolidone epoxy resin, oxydianiline type benzoxazine resin and a curing agent. The assembly achieves desirable balanced properties in peel strength, glass transition temperature, dimensional change after reflow, thermal resistance, and dielectric properties.

A prepreg comprising a layer of impregnated reinforcing fibers comprising at least one layer of reinforcing fibers impregnated by a resin composition comprising at least a thermosetting resin, a curing agent and an accelerator, such that the accelerator has a gradient concentration which is more concentrated in the resin composition in the vicinity of the reinforcing fibers than further away. The resin composition comprising a first resin composition impregnates the reinforcing fibers to provide a layer of impregnated reinforcing fibers and a surface layer comprising a second resin composition is formed on the layer of impregnated reinforcing fibers, wherein the first resin composition has at least one peak exotherm occurring at a time earlier than and/or at a temperature lower than any peak exotherm of the second resin composition. The heat generation from the first resin composition is tailored to initiate or speed up the curing of the second resin composition, leading to a substantial reduction of cure cycle time of the prepreg. Excellent handling and processing abilities of the uncured prepreg and excellent physical, thermal and mechanical properties when cured are achieved.

The invention relates to:anion exchange blend membranes consisting the following blend components:a halomethylated polymer (a polymer with (CH2)xCH2Hal groups, Hal=F, Cl, Br, I; x=0-12), which is quaternised with a tertiary or a n-alkylated/n-arylated imidazole, an N-alkylated/N-arylated benzimidazole or an N-alkylated/N-arylated pyrazol to form an anion exchanger polymer. - an inert matrix polymer in which the anion exchange polymer is embedded and which is optionally covalently crosslinked with the halomethylated precursor of the anion exchanger polymer,a polyethyleneglycol with epoxide or halomethyl terminal groups which are anchored by reacting with NH-groups of the base matrix polymer using convalent cross-linkingoptionally an acidic polymer which forms with the anion-exchanger polymer an ionic cross-linking (negative bound ions of the acidic polymer forming ionic cross-linking positions relative to the positive cations of the anion-exchanger polymer)optionally a sulphonated polymer (polymer with sulphate groups SO2Me, Me=any cation), which forms with the halomethyl groups of the halomethylated polymer convalent crosslinking bridges with sulfinate S-alkylation. The invention also relates to a method for producing said membranes, to the use of said membranes in electrochemical energy conversion processes (e.g. Redox-flow batteries and other flow batteries, PEM-electrolyses, membrane fuel cells), and in other membrane methods (e.g. electrodialysis, diffusion dialysis).

The invention discloses a carbon nanotube/polyetherimide/thermosetting resin dielectric composite and a preparation method therefor. 100 parts by weight of polyetherimide and 1-7 parts by weight of carbon nanotube are mixed uniformly in an Haake torque melt cavity to obtain a carbon nanotubes/polyetherimide composite; 20 parts of the carbon nanotube/polyetherimide composite are dissolved in 100-150 parts of dichloromethane, then the mixed solution is added in 100 parts of molten thermocurable thermosetting resin, mixing, and heat preserving, stirring are performed until a mixture is formed in a uniform state, and curing and post-treating are performed to obtain a carbon nanotube/thermosetting resin dielectric composite, wherein the substrate thereof has a typical reverse phase structure, while the carbon nanotubes are dispersed in a polyetherimide phase. The composite has a relatively low percolation threshold, a high dielectric constant and a low dielectric loss. The preparation method of the present invention has a simple process and is suitable for large-scale production.