Patent classifications
C08K3/10
DUST CORE AND ELECTRONIC DEVICE
A dust core includes a binder and magnetic particles. The binder includes an epoxy resin. The magnetic particles are dispersed in the binder. The epoxy resin has at least two or more mesogenic skeletons between two epoxy bonds adjacent along a molecular chain.
POLYMER COMPOSITION WITH IMPROVED CRYSTALLIZATION SPEED, AND METHOD FOR PREPARING SAME
The present invention relates to a novel polyaryletherketone (PAEK) polymer composition with a significantly increased crystallization rate, and preferably, to a polyetherketoneketone (PEKK) polymer composition. According to the present invention, there is provided a polymer composition including a liquid crystal polymer (LCP), an inorganic nucleating agent, a reinforcing agent, and a filler in polyaryletherketone (PAEK). Therefore, the present invention provides an effect of improving a crystallization rate of the polymer composition and improving molding processability, thereby improving productivity, shape, dimensional stability, or the like of products.
POLYMER COMPOSITION WITH IMPROVED CRYSTALLIZATION SPEED, AND METHOD FOR PREPARING SAME
The present invention relates to a novel polyaryletherketone (PAEK) polymer composition with a significantly increased crystallization rate, and preferably, to a polyetherketoneketone (PEKK) polymer composition. According to the present invention, there is provided a polymer composition including a liquid crystal polymer (LCP), an inorganic nucleating agent, a reinforcing agent, and a filler in polyaryletherketone (PAEK). Therefore, the present invention provides an effect of improving a crystallization rate of the polymer composition and improving molding processability, thereby improving productivity, shape, dimensional stability, or the like of products.
SURFACE PROTECTION COMPOSITION AND TERMINAL FITTED ELECTRIC WIRE
A surface protection composition contains (a) a phosphorus compound represented by formula (1), (b-1) a metal-containing compound or (b-2) an amine compound, (c) a (meth)acrylate having a hydrocarbon chain having 4 or more carbon atoms, (d-1) an acylphosphine oxide photopolymerization initiator and (d-2) an α-aminoacetophenone photopolymerization initiator. Further, the composition has the compound (d-1) in an amount of 0.1 to 3.0 mass % with respect to the total amount of the composition, compound (d-2) in an amount of 0.1 to 3.0 mass % with respect to the total amount of the composition and a total amount of the compound (d-1) and (d-2) is less than 5.0 mass % with respect to the total amount of the composition.
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In the above formula, R.sup.1 represents a hydrogen atom, R.sup.2 represents a hydrocarbon group having 4 to 30 carbon atoms, and R.sup.3 represents a hydrogen atom or a hydrocarbon group having 4 to 30 carbon atoms.
BINDER COMPOSITION FOR METAL POWDER INJECTION MOLDING
The present invention relates to a binder composition for metal powder injection molding, and more specifically, to a binder composition for metal powder injection molding, which can be promptly debound, facilitates the setting of flow conditions in an injection process, and enables the minimization of poor debinding such as swelling, carbonization of low-molecular-weight binders, and other internal defects, during a debinding process.
The binder composition for metal powder injection molding of the present invention contains 10 to 50 wt % of a high-viscosity polyoxymethylene polymer and 50 to 90 wt % of a low-viscosity polyoxymethylene polymer.
By containing polyoxymethylenes alone, which has been produced with different viscosities, without feeding of other monomers in the polymerization process of polyoxymethylene, the binder composition for metal powder injection molding according to the present invention is more economical through low manufacturing costs compared with a conventional technique in which the rate of decomposition by a gas-phase acid is controlled by viscosity adjustment in a polymerization process, and has excellent injection characteristics and debinding/sintering characteristics compared with a technique in which polyoxymethylene and other polymer resins, such as polyolefins and polyamides, are used together.
BINDER COMPOSITION FOR METAL POWDER INJECTION MOLDING
The present invention relates to a binder composition for metal powder injection molding, and more specifically, to a binder composition for metal powder injection molding, which can be promptly debound, facilitates the setting of flow conditions in an injection process, and enables the minimization of poor debinding such as swelling, carbonization of low-molecular-weight binders, and other internal defects, during a debinding process.
The binder composition for metal powder injection molding of the present invention contains 10 to 50 wt % of a high-viscosity polyoxymethylene polymer and 50 to 90 wt % of a low-viscosity polyoxymethylene polymer.
By containing polyoxymethylenes alone, which has been produced with different viscosities, without feeding of other monomers in the polymerization process of polyoxymethylene, the binder composition for metal powder injection molding according to the present invention is more economical through low manufacturing costs compared with a conventional technique in which the rate of decomposition by a gas-phase acid is controlled by viscosity adjustment in a polymerization process, and has excellent injection characteristics and debinding/sintering characteristics compared with a technique in which polyoxymethylene and other polymer resins, such as polyolefins and polyamides, are used together.
Anisotropic conductive film
An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter.
THERMAL STABILIZER FOR POLYESTER
Polymeric composition comprising a thermoplastic polyester and a rare earth compound selected from the group consisting of lanthanum hydroxide, cerium oxide hydrate and mixtures thereof, characterized in that the amount of the thermoplastic polyester in the polymeric composition is more than 50 wt. %, preferably more than 70 wt. %.
THERMAL STABILIZER FOR POLYESTER
Polymeric composition comprising a thermoplastic polyester and a rare earth compound selected from the group consisting of lanthanum hydroxide, cerium oxide hydrate and mixtures thereof, characterized in that the amount of the thermoplastic polyester in the polymeric composition is more than 50 wt. %, preferably more than 70 wt. %.
ANTI-CORROSION COATINGS
A corrosion resistant coating including a matrix, corrosion resistant particles dispersed throughout the matrix, and a glass-forming additive is disclosed. The glass-forming additive and one or more materials in the matrix form a glassy-phase when cured. Coated gas turbine engine components and methods for coating components are also disclosed.