Patent classifications
C08K3/10
Sheet and composite sheet
A problem is to provide a sheet having a pre-sintering layer, the thickness of which following sintering is such as to be capable of relieving stresses. Solution means relate to a sheet comprising a pre-sintering layer. Viscosity at 90° C. of the pre-sintering layer is not less than 0.27 MPa.Math.s. Thickness of the pre-sintering layer is 30 μm to 200 μm.
Method for manufacturing quantum dot film comprising encapsulated quantum dots uniformly dispersed therein, quantum dot film manufactured thereby and wavelength conversion sheet and display comprising same
The present invention relates to a method of manufacturing a quantum-dot film having encapsulated quantum dots dispersed therein, in which quantum dots are uniformly dispersed in a matrix resin to thus increase quantum yield and in which deterioration of the quantum dots can be prevented through encapsulation, a quantum-dot film manufactured thereby, and a wavelength conversion sheet and a display including the same.
CATALYST-CONTAINING POLYMER COATINGS FORMED BY CHEMICAL GRAFTING
The present invention relates to coating compositions and methods of forming catalyst-containing coatings on substrates for catalytic heater devices. The coatings are formed by a chemical grafting method, which chemically bonds the coating (and catalysts contained therein) to the substrate. The resulting coatings have high temperature resistance and inhibit or prevent catalyst migration to the substrate, thereby maintaining catalytic activity and desired temperatures over prolonged use.
ANISOTROPIC CONDUCTIVE FILM
An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter.
CATIONIC ELECTRODEPOSITION COATING COMPOSITION
Provided is a cationic electrodeposition coating composition having good anti-cratering performance. A cationic electrodeposition coating composition comprising a coating film-forming resin (A), a metal compound (B) containing a trivalent metal element, and a silicone compound (C), wherein a content of the metal compound (B) is 0.03 parts by mass or more and less than 4 parts by mass in terms of a metal element based on 100 parts by mass of a resin solid content of the coating film-forming resin (A), and a content of the silicone compound (C) is 0.005 parts by mass or more and 4.5 parts by mass or less based on 100 parts by mass of the resin solid content of the coating film-forming resin (A).
THERMAL CONDUCTIVE SILICONE COMPOSITION
A thermally conductive composition comprises: (A) an organopolysiloxane having 2 or more silicon atom-bonded alkenyl groups; (B) an organohydrogenpolysiloxane having 2 or more silicon atom-bonded hydrogen atoms; (C) a thermally conductive filler in an amount of 85 to 95% by mass based on the total mass of the composition; (D) a platinum group metal-based catalyst in an amount of 50 parts by mass or more of a platinum group metal element per 1 million parts by mass total of components (A) and (B); (E) a curing inhibitor having a specific structure, in an amount of 0.3 to 1 part by mass per 100 parts by mass total of components (A) and (B); and (F) a polysiloxane having an (MeViSiO.sub.2/2) structural unit, a silicon atom-bonded alkoxy group.
THERMAL CONDUCTIVE SILICONE COMPOSITION
A thermally conductive composition comprises: (A) an organopolysiloxane having 2 or more silicon atom-bonded alkenyl groups; (B) an organohydrogenpolysiloxane having 2 or more silicon atom-bonded hydrogen atoms; (C) a thermally conductive filler in an amount of 85 to 95% by mass based on the total mass of the composition; (D) a platinum group metal-based catalyst in an amount of 50 parts by mass or more of a platinum group metal element per 1 million parts by mass total of components (A) and (B); (E) a curing inhibitor having a specific structure, in an amount of 0.3 to 1 part by mass per 100 parts by mass total of components (A) and (B); and (F) a polysiloxane having an (MeViSiO.sub.2/2) structural unit, a silicon atom-bonded alkoxy group.
Stable quantum dot compositions
A nano-composite includes a thermoplastic copolymer includes a polycarbonate copolymer including repeating siloxane units and a plurality of quantum dots. A method of making a polymer film includes forming a masterbatch composition by combining (1) a first thermoplastic copolymer including a polycarbonate copolymer including repeating siloxane units and (2) a plurality of quantum dots; combining the masterbatch composition with a second thermoplastic polymer to form a mixture; and forming the polymer film from the mixture. The polycarbonate copolymer has a siloxane content of from 15 wt % to 65 wt %.
Stable quantum dot compositions
A nano-composite includes a thermoplastic copolymer includes a polycarbonate copolymer including repeating siloxane units and a plurality of quantum dots. A method of making a polymer film includes forming a masterbatch composition by combining (1) a first thermoplastic copolymer including a polycarbonate copolymer including repeating siloxane units and (2) a plurality of quantum dots; combining the masterbatch composition with a second thermoplastic polymer to form a mixture; and forming the polymer film from the mixture. The polycarbonate copolymer has a siloxane content of from 15 wt % to 65 wt %.
Indirect additive manufacturing process
A method for indirect additive manufacturing of an object, the method comprising: (i) separately feeding a powder from which said object is to be manufactured and either a difunctional curable monomer according to Formula (I) or an adhesive polymer binder into an additive manufacturing device; (ii) dispensing selectively positioned droplets of said difunctional curable monomer or adhesive polymer binder, from a printhead of said additive manufacturing device, into a bed of said powder to bind particles of said powder with said difunctional curable monomer or adhesive polymer binder to produce a curable preform having a shape of the object to be manufactured; and, in the case of the difunctional curable monomer, (iii) curing said curable preform to form a crosslinked object.