A polymer composition may include one or more monomeric units, with an internal crosslinker, internal breaker, scale control additive or a combination thereof.

A polymer composition may include one or more monomeric units, with an internal crosslinker, internal breaker, scale control additive or a combination thereof.

The present invention provides a degradable and recyclable epoxy conductive adhesive, which comprises the following raw materials in percentage by weight: 15% to 30% of epoxy resin, 1% to 10% of a curing agent, 0.1% to 2% of a reaction diluent and 15% to 85% of a conductive filler, wherein the curing agent comprises a breakable molecular structure. According to the epoxy conductive adhesive of the present invention, after the epoxy resin in the conductive adhesive is cured by using the recyclable and degradable epoxy resin curing agent of a specific molecular structure, the conductive adhesive can be degraded in normal pressure, mild and specific conditions, the process is simple and the operation is convenient, no contamination is brought to the environment, the recycling cost is largely reduced, and the recycling of the conductive adhesive has enormous economic and environmental advantages. By using the recyclable and degradable epoxy resin curing agent of a specific molecular structure, the shear strength of the conductive adhesive is greatly increased, and the reliability and the service life of the conductive adhesive are largely improved.

The present invention provides a degradable and recyclable epoxy conductive adhesive, which comprises the following raw materials in percentage by weight: 15% to 30% of epoxy resin, 1% to 10% of a curing agent, 0.1% to 2% of a reaction diluent and 15% to 85% of a conductive filler, wherein the curing agent comprises a breakable molecular structure. According to the epoxy conductive adhesive of the present invention, after the epoxy resin in the conductive adhesive is cured by using the recyclable and degradable epoxy resin curing agent of a specific molecular structure, the conductive adhesive can be degraded in normal pressure, mild and specific conditions, the process is simple and the operation is convenient, no contamination is brought to the environment, the recycling cost is largely reduced, and the recycling of the conductive adhesive has enormous economic and environmental advantages. By using the recyclable and degradable epoxy resin curing agent of a specific molecular structure, the shear strength of the conductive adhesive is greatly increased, and the reliability and the service life of the conductive adhesive are largely improved.

The present invention related to a thermosetting resin composition for high frequency, the composition containing (a) a polyphenylene ether having two or more unsaturated substituent groups selected from the group consisting of the vinyl group and the allyl group at both ends of the molecular chain thereof, or an oligomer of said polyphenylene ether; (b) three or more different types of cross-linking curing agents; and (c) a flame retardant. The present invention may provide a printed circuit board for high frequency which simultaneously exhibits low dielectric loss characteristic and good moisture-absorption heat resistance, low thermal expansion characteristics, excellent thermal stability, excellent processability, and the like.

The present disclosure relates to a flame retardant thermoplastic resin composition having superior thermal stability, and a molded article manufactured from the same. More particularly, the present disclosure provides a flame retardant thermoplastic resin composition exhibiting both superior thermal stability and flame retardancy without harmful gas generation even when injection-molded at high temperature, high pressure, and high speed and a molded article manufactured from the same.

Disclosed herein are a color coating composition for an LED lamp diffuser and a color-coated glass article using the same. The color coating composition is capable of increasing durability and a life of an LED lamp, satisfactorily maintaining an external appearance and a lighting quality thereof for a long time, and realizing various colors, by manufacturing a glass-made diffuser as a means for diffusing light of the LED lamp in a manner of coating the diffuser on various sheets of transparent or translucent glass such as tubes and bulbs so that the diffuser is not deformed and discolored due to light and heat, and has high strength and translucency.

Disclosed herein are a color coating composition for an LED lamp diffuser and a color-coated glass article using the same. The color coating composition is capable of increasing durability and a life of an LED lamp, satisfactorily maintaining an external appearance and a lighting quality thereof for a long time, and realizing various colors, by manufacturing a glass-made diffuser as a means for diffusing light of the LED lamp in a manner of coating the diffuser on various sheets of transparent or translucent glass such as tubes and bulbs so that the diffuser is not deformed and discolored due to light and heat, and has high strength and translucency.

A polyamide resin composition comprising a polyamide resin (A), a copper compound (B), a bromide of an alkali metal and/or a bromide of an alkaline earth metal (C), and at least one phosphorus compound (D) selected from the group consisting of tris(2,4-di-t-butylphenyl)phosphite, bis(2,4-di-t-butylphenyl)pentaerythritol diphosphite, bis(2,6-di-t-butyl-4-methylphenyl)pentaerythritol diphosphite, bis(2,4-dicumylphenyl)pentaerythritol diphosphite, 2,2′,2″-nitrilo(triethyl-tris(3,3′,5,5′-tetra-t-butyl-1,1′-biphenyl-2,2′-diyl))phosphite, tetrakis(2,4-di-t-butylphenyl)-4,4′-biphenylene diphosphonite, tetrakis(2,4-di-t-butylphenyl)-4,3′-biphenylene diphosphonite, and tetrakis(2,4-di-t-butylphenyl)-3,3′-biphenylene diphosphonate, in an amount of 0.01 to 10% by mass with respect to 100% by mass of the polyamide resin composition, at least one fatty acid compound (E), and an inorganic filler (F).

Disclosed is a novel high-density magnetic composite material for an inductor. The material is composed of 6-12% of high-temperature resin glue and 88-94% of magnetic powder body in percentage by weight. An integrated inductor magnetic core is simply prepared by means of the magnetic composite material of the disclosure without a large press, thus saving the device investment. The mold loss in a pressing process is reduced, and the production cost is reduced. The operation is simple, a magnet of a complex shape can be produced, and an oversized magnet can be produced. A closed magnetic circuit is formed, and the EMI effect is good. The magnetic composite material of the disclosure enables the density of a solidified magnet to be high under the action of special high-temperature resin glue, it can be guaranteed that the density is 5.5-6.2 g/cm3, the sensitive quality value for preparing an inductor is high, and the initial permeability can be 14μ or above. The magnetic composite material of the disclosure can bear a higher temperature, and can work at the temperature of 180° C. The magnetic composite material of the disclosure is high in utilization rate, low in scrap rate and low in dust rate, and meets the requirement for environmental protection.