Provided is a urea compound-containing epoxy resin curing agent particle that can impart excellent storage stability and heat stability to an epoxy resin composition including a urea compound as a curing agent, while maintaining the solubility of the urea compound during heating and the fluidity after dissolution of the urea compound. The surface of the urea compound-containing epoxy resin curing agent particle is coated with a Group 4 or Group 13 element-containing alkoxide compound, chelate compound, and/or acylate compound.

Provided is a urea compound-containing epoxy resin curing agent particle that can impart excellent storage stability and heat stability to an epoxy resin composition including a urea compound as a curing agent, while maintaining the solubility of the urea compound during heating and the fluidity after dissolution of the urea compound. The surface of the urea compound-containing epoxy resin curing agent particle is coated with a Group 4 or Group 13 element-containing alkoxide compound, chelate compound, and/or acylate compound.

The present application is directed to an adhesive tape comprising: i) a first release liner; and, ii) a pressure sensitive adhesive layer disposed on said first release liner, wherein said pressure sensitive adhesive layer is obtained by curing an adhesive composition comprising: a) an acrylic base copolymer obtained from a monomer mixture comprising at least one C1-C12 alkyl ester of (meth)acrylic acid and at least one acid monomer selected from acrylic acid, methacrylic acid, maleic acid, fumaric acid and itaconic acid; b) a metal chelate cross-linking agent; c) at least one tackifying resin; d) an organic solvent; and, optionally e) additives. The adhesive tape optionally comprises iii) a second release liner which is disposed on that side of said pressure sensitive adhesive layer opposite to said first release liner.

The thermally conductive composition comprises a thermally conductive filler dispersed in a liquid matrix.

Thermally conductive polymer (TCP) resin compositions are described, comprising: 50 to 75% matrix polymer (I) comprising styrenic polymers () such as ABS (acrylonitrile-butadiene-styrene) resins, ASA (acrylonitrile-styrene-acrylate) resins and elastomeric block copolymers of the structure (S-(B/S)).sub.n-S; and 25 to 50% thermally conductive filler material (II) (D.sub.50 0.1 to 200 m), consisting of carbonyl iron powder (11-1) in mixture with multi wall carbon nanotubes, silicon carbide, diamond, graphite, aluminosilicates and/or boron nitride (II-2); wherein the volume ratio of (ll-1)/(ll-2) is 15:1 to 0.1:1. Shaped articles made thereof can be used for materials with antistatic finish, electrical and electronic housings, toys and helmet inlays.

Thermally conductive polymer (TCP) resin compositions are described, comprising: 50 to 75% matrix polymer (I) comprising styrenic polymers () such as ABS (acrylonitrile-butadiene-styrene) resins, ASA (acrylonitrile-styrene-acrylate) resins and elastomeric block copolymers of the structure (S-(B/S)).sub.n-S; and 25 to 50% thermally conductive filler material (II) (D.sub.50 0.1 to 200 m), consisting of carbonyl iron powder (11-1) in mixture with multi wall carbon nanotubes, silicon carbide, diamond, graphite, aluminosilicates and/or boron nitride (II-2); wherein the volume ratio of (ll-1)/(ll-2) is 15:1 to 0.1:1. Shaped articles made thereof can be used for materials with antistatic finish, electrical and electronic housings, toys and helmet inlays.

Thermally conductive polymer (TCP) resin compositions are described, comprising: 50 to 75% matrix polymer (I) comprising styrenic polymers () such as ABS (acrylonitrile-butadiene-styrene) resins, ASA (acrylonitrile-styrene-acrylate) resins and elastomeric block copolymers of the structure (S-(B/S)).sub.n-S; and 25 to 50% thermally conductive filler material (II) (D.sub.50 0.1 to 200 m), consisting of carbonyl iron powder (11-1) in mixture with multi wall carbon nanotubes, silicon carbide, diamond, graphite, aluminosilicates and/or boron nitride (II-2); wherein the volume ratio of (ll-1)/(ll-2) is 15:1 to 0.1:1. Shaped articles made thereof can be used for materials with antistatic finish, electrical and electronic housings, toys and helmet inlays.

A method for preparing an anti-bacterial and anti-ultraviolet multifunctional chemical fiber includes: dissolving several soluble metal salts and a polymer complexing dispersant into water to prepare an aqueous solution; adding into a polymer monomer; reacting under microwave or hydrothermal action to obtain a polymer monomer containing multifunctional nano oxides; adding the polymer monomer with other monomer, catalyst, initiator, stabilizer, and the like into a polymerization reactor; and carrying out esterification, polycondensation or copolymerization to obtain a polymer melt, and carrying out spinning or ribbon casting and granule cutting to obtain an anti-bacterial and anti-ultraviolet multifunctional chemical fiber or masterbatch chips. By generating nano metal oxides in the monomer in situ before the polymerization reaction, small particle sizes and dispersibility of the nano metal oxide are ensured; the chemical fiber has efficient, durable antibacterial and anti-ultraviolet functions and is free of metal ion precipitation.

A method for preparing an anti-bacterial and anti-ultraviolet multifunctional chemical fiber includes: dissolving several soluble metal salts and a polymer complexing dispersant into water to prepare an aqueous solution; adding into a polymer monomer; reacting under microwave or hydrothermal action to obtain a polymer monomer containing multifunctional nano oxides; adding the polymer monomer with other monomer, catalyst, initiator, stabilizer, and the like into a polymerization reactor; and carrying out esterification, polycondensation or copolymerization to obtain a polymer melt, and carrying out spinning or ribbon casting and granule cutting to obtain an anti-bacterial and anti-ultraviolet multifunctional chemical fiber or masterbatch chips. By generating nano metal oxides in the monomer in situ before the polymerization reaction, small particle sizes and dispersibility of the nano metal oxide are ensured; the chemical fiber has efficient, durable antibacterial and anti-ultraviolet functions and is free of metal ion precipitation.

Flexible substrates including a polymer selected from a thermoplastic polymer, a thermoset polymer, and/or a polymer blend, and ferroelectric perovskite-type oxide particles dispersed in the polymer, where the ferroelectric perovskite-type oxide has a dielectric constant that varies with applied voltage. The flexible substrates can be used in tunable electronics.