A thermal-conductive silicone composition containing (A) 0.5 to 2.5 mass % of a crosslinked silicone gel containing (a) an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule, and having a kinematic viscosity at 25° C. of 10,000,000 mm.sup.2/s or more, and (b) an organohydrogenpolysiloxane having two or more silicon-bonded hydrogen atoms per molecule; (B) 12.5 to 19.5 mass % of a hydrolysable organopolysiloxane compound; and (C) 80 to 85 mass % of aluminum nitride particles having an average particle size of 0.5 pm or more and 1.5 pm or less. A content of coarse particles in the aluminum nitride particles is 1.0 volume % or less relative to the whole. The coarse particles are 10 pm or more in a particle size distribution by laser diffraction. A thermal-conductive silicone composition has excellent coating workability and favorable pumping-out resistance, and is capable of attaining low thermal resistance by being thinly compressed.

A thermally conductive silicone composition contains a silicone polymer and a thermally conductive inorganic filler. The thermally conductive inorganic filler is surface treated with a first surface treatment agent and further surface treated with a second surface treatment agent. The first surface treatment agent contains an organic silane compound represented by R.sup.11SiR.sup.12.sub.x(OR.sup.13).sub.3-x (where R.sup.11 is, e.g., a monovalent aliphatic hydrocarbon group having 1 to 18 carbon atoms, a monovalent aromatic hydrocarbon group having 6 to 30 carbon atoms, or a hydrocarbon group having an alkoxysilyl group, R.sup.12 is, e.g., a methyl group, and R.sup.13 is, e.g., a hydrocarbon group having 1 to 4 carbon atoms). The second surface treatment agent contains a silicone polymer that has a kinematic viscosity of 10 to 1000 mm.sup.2/s and does not have a hydrolyzable group. Thus, the present invention provides a thermally conductive silicone composition that has a low slurry viscosity and achieves high extrudability and high moldability, and a method for producing the thermally conductive silicone composition.

A thermally conductive silicone composition contains a silicone polymer and a thermally conductive inorganic filler. The thermally conductive inorganic filler is surface treated with a first surface treatment agent and further surface treated with a second surface treatment agent. The first surface treatment agent contains an organic silane compound represented by R.sup.11SiR.sup.12.sub.x(OR.sup.13).sub.3-x (where R.sup.11 is, e.g., a monovalent aliphatic hydrocarbon group having 1 to 18 carbon atoms, a monovalent aromatic hydrocarbon group having 6 to 30 carbon atoms, or a hydrocarbon group having an alkoxysilyl group, R.sup.12 is, e.g., a methyl group, and R.sup.13 is, e.g., a hydrocarbon group having 1 to 4 carbon atoms). The second surface treatment agent contains a silicone polymer that has a kinematic viscosity of 10 to 1000 mm.sup.2/s and does not have a hydrolyzable group. Thus, the present invention provides a thermally conductive silicone composition that has a low slurry viscosity and achieves high extrudability and high moldability, and a method for producing the thermally conductive silicone composition.

Embodiments of the present invention relate to methods for preparing high optical density solutions of nanoparticle, such as nanoplates, silver nanoplates or silver platelet nanoparticles, and to the solutions and substrates prepared by the methods. The process can include the addition of stabilizing agents (e.g., chemical or biological agents bound or otherwise linked to the nanoparticle surface) that stabilize the nanoparticle before, during, and/or after concentration, thereby allowing for the production of a stable, high optical density solution of silver nanoplates. The process can also include increasing the concentration of silver nanoplates within the solution, and thus increasing the solution optical density.

Embodiments of the present invention relate to methods for preparing high optical density solutions of nanoparticle, such as nanoplates, silver nanoplates or silver platelet nanoparticles, and to the solutions and substrates prepared by the methods. The process can include the addition of stabilizing agents (e.g., chemical or biological agents bound or otherwise linked to the nanoparticle surface) that stabilize the nanoparticle before, during, and/or after concentration, thereby allowing for the production of a stable, high optical density solution of silver nanoplates. The process can also include increasing the concentration of silver nanoplates within the solution, and thus increasing the solution optical density.

A modified aluminum nitride particle comprises an aluminum nitride core and a shell surrounding the aluminum nitride core. The shell comprises a crosslinked organic polymer. Methods of making the modified aluminum nitride particle by admicellar polymerization are also disclosed.

A modified aluminum nitride particle comprises an aluminum nitride core and a shell surrounding the aluminum nitride core. The shell comprises a crosslinked organic polymer. Methods of making the modified aluminum nitride particle by admicellar polymerization are also disclosed.

A nitride-based ceramics resin composite body having thermal conductivity, electrical insulation, and adhesion to adherends equal to conventional products, and having improved heat resistance reliability during the reflow process, and a thermal conductive insulating adhesive sheet using the same are provided. A nitride-based ceramics resin composite body in which a thermosetting resin composition is impregnated in a porous nitride-based ceramics sintered body is provided. The thermosetting resin composition includes a specific epoxy resin and a bismaleimide triazine resin, and a water absorption of the thermosetting resin composition in a completely cured state measured in accordance with method A in JIS K7209 (2000) is 1% by mass or less.

A composition for forming an artificial sold electrolyte interphase (SEI) layer includes a polymer, an artificial SEI forming salt, and a solvent. The polymer and the artificial SEI forming salt are dispersed in the solvent.

A composition for forming an artificial sold electrolyte interphase (SEI) layer includes a polymer, an artificial SEI forming salt, and a solvent. The polymer and the artificial SEI forming salt are dispersed in the solvent.