A thermoplastic resin (A) including, in its main chain structure, a unit (i) having a biphenyl group, a unit (ii) having a substituent biphenyl group, a unit (iii) having a specific number of atoms in its main chain, and a unit (iv) having a specific number of atoms in its main chain provides a thermoplastic resin which has a low liquid crystal phase transition temperature and a low isotropic phase transition temperature, is highly thermally conductive, and can be processed by molding at a low melting temperature.

A thermoplastic resin (A) including, in its main chain structure, a unit (i) having a biphenyl group, a unit (ii) having a substituent biphenyl group, a unit (iii) having a specific number of atoms in its main chain, and a unit (iv) having a specific number of atoms in its main chain provides a thermoplastic resin which has a low liquid crystal phase transition temperature and a low isotropic phase transition temperature, is highly thermally conductive, and can be processed by molding at a low melting temperature.

Various aspects of the present invention relate to cationic latex emulsions, methods of making the same, various materials including the cationic latex emulsion such as asphalt emulsions, and methods of making the asphalt emulsions. A cationic latex emulsion includes latex particles. The cationic latex emulsion includes an aqueous liquid emulsified with the latex particles. The cationic latex emulsion also includes a cationic surfactant that is a diquaternary ammonium surfactant.

Various aspects of the present invention relate to cationic latex emulsions, methods of making the same, various materials including the cationic latex emulsion such as asphalt emulsions, and methods of making the asphalt emulsions. A cationic latex emulsion includes latex particles. The cationic latex emulsion includes an aqueous liquid emulsified with the latex particles. The cationic latex emulsion also includes a cationic surfactant that is a diquaternary ammonium surfactant.

The thermosetting resin composition of the present invention includes an epoxy resin (A), a curing agent (B), and thermally conductive particles (C), in which the epoxy resin (A) includes a mesogen skeleton and has a softening point of 60° C. or lower, and a thermal conductivity λ.sub.200 of a cured product of the thermosetting resin composition at 200° C. is 12.0 W/(m.Math.K) or higher.

The thermosetting resin composition of the present invention includes an epoxy resin (A), a curing agent (B), and thermally conductive particles (C), in which the epoxy resin (A) includes a mesogen skeleton and has a softening point of 60° C. or lower, and a thermal conductivity λ.sub.200 of a cured product of the thermosetting resin composition at 200° C. is 12.0 W/(m.Math.K) or higher.

Disclosed are an anode for a lithium secondary battery, a lithium secondary battery including the anode, and a manufacturing method thereof. In particular, the anode includes a lithium metal layer and an interfacial layer made of phosphorous-doped graphitic carbon nitride and a single ion conducting polymer.

A composition contains the following components: (a) 15 to 49.8 volume-percent of a first polysiloxane that is has a viscosity in a range of 50 centiStokes to 550 Stokes as determined according to ASTM D4283-98; (b) 0.2 to 5 volume-percent of an organoclay; (c) 50-74 volume-percent roundish or crushed thermally conductive fillers including: (i) 5 to 15 volume-percent small thermally conductive fillers having a median particle size in a range of 0.1 to 1.0 micrometers; (ii) 10 to 25 volume-percent medium thermally conductive fillers having a median particle size in a range of 1.1 to 5.0 micrometers; (iii) 25 to 50 volume-percent large thermally conductive fillers having a median particle size in a range of 5.1 to 50 micrometers; and (d) 0 to 5 volume-percent of an alkoxy functional linear polysiloxane different from the first polysiloxane and/or an alkoxy functional linear silane; where volume-percent values are relative to composition volume.

A composition contains the following components: (a) 15 to 49.8 volume-percent of a first polysiloxane that is has a viscosity in a range of 50 centiStokes to 550 Stokes as determined according to ASTM D4283-98; (b) 0.2 to 5 volume-percent of an organoclay; (c) 50-74 volume-percent roundish or crushed thermally conductive fillers including: (i) 5 to 15 volume-percent small thermally conductive fillers having a median particle size in a range of 0.1 to 1.0 micrometers; (ii) 10 to 25 volume-percent medium thermally conductive fillers having a median particle size in a range of 1.1 to 5.0 micrometers; (iii) 25 to 50 volume-percent large thermally conductive fillers having a median particle size in a range of 5.1 to 50 micrometers; and (d) 0 to 5 volume-percent of an alkoxy functional linear polysiloxane different from the first polysiloxane and/or an alkoxy functional linear silane; where volume-percent values are relative to composition volume.

The present application disclose a method for preparing an oriented heat conducting sheet, which includes the following steps: Step S1, preparing a fluid composition for the heat conducting sheet; Step S2, placing the fluid composition obtained in the step S1 in an orientation molding device, applying a circumferential high-speed shear force to the fluid composition layer by layer to enable thermal conducting fillers in the fluid composition to be oriented along a shear direction to form an oriented thin-layer composition, and collecting the thin-layer composition layer by layer in a die to form a continuous multi-layer aggregate; Step S3, heat curing the multi-layer aggregate to obtain an oriented composition block; and S4, slicing the oriented composition block along the direction perpendicular to an orienting direction of the oriented composition block to obtain an oriented heat conducting sheet.