Oriented heat conducting sheet and preparation method thereof, and semiconductor heat dissipating device

Abstract

The present application disclose a method for preparing an oriented heat conducting sheet, which includes the following steps: Step S1, preparing a fluid composition for the heat conducting sheet; Step S2, placing the fluid composition obtained in the step S1 in an orientation molding device, applying a circumferential high-speed shear force to the fluid composition layer by layer to enable thermal conducting fillers in the fluid composition to be oriented along a shear direction to form an oriented thin-layer composition, and collecting the thin-layer composition layer by layer in a die to form a continuous multi-layer aggregate; Step S3, heat curing the multi-layer aggregate to obtain an oriented composition block; and S4, slicing the oriented composition block along the direction perpendicular to an orienting direction of the oriented composition block to obtain an oriented heat conducting sheet.

Claims

1. A method for preparing an oriented heat conducting sheet, comprising the following steps: Step S1, preparing a fluid composition for a heat conducting sheet; Step S2: placing the fluid composition obtained in step S1 in an orientation molding device, applying a circumferential shear force to the fluid composition layer by layer to enable thermal conducting fillers in the fluid composition to be oriented along a shear direction to form an oriented thin-layer composition, and collecting the thin-layer composition layer by layer in a die to form a continuous multi-layer aggregate; Step S3: heat curing the continuous multi-layer aggregate obtained in step S2 to obtain an oriented composition block; and Step S4: slicing the oriented composition block obtained in step S3 along a direction perpendicular to an orienting direction of the oriented composition block to obtain the oriented heat conducting sheet; wherein, the orientation molding device comprises: a cylindrical rotating barrel, wherein a rotating shaft is fixed on a central axis of the cylindrical rotating barrel, and one end of the rotating shaft is provided with a first motor, and the first motor drives the cylindrical rotating barrel to rotate via the rotating shaft; the cylindrical rotating barrel is provided with a loading zone, and a rotating barrel opening is provided at a lower side of the loading zone; a sleeve barrel, wherein the sleeve barrel is sleeved outside the cylindrical rotating barrel, the cylindrical rotating barrel is configured to rotate inside the sleeve barrel, and a sleeve barrel opening with a same size as the rotating barrel opening is arranged at an end of the sleeve barrel opposite to the rotating barrel opening; the die, wherein the die is provided with an inner cavity and an inner cavity opening, and an edge of the inner cavity opening is flush with and next to an edge of the sleeve barrel opening, the edge of the inner cavity opening extends inwardly along a horizontal direction perpendicular to the central axis of the cylindrical rotating barrel to form a side wall of the inner cavity, a piston and a second motor are provided next to the side wall of the inner cavity; the second motor is configured to drive the piston away from the sleeve barrel opening, a starting position of the piston is flush with the sleeve barrel opening; and an electric heating module, wherein the electric heating module is configured to heat the inner cavity of the die; wherein there is a gap of 0.1 to 5 mm between the cylindrical rotating barrel and the sleeve barrel; and wherein the piston is driven by the second motor to leave the sleeve barrel opening intermittently.

2. The method for preparing an oriented heat conducting sheet according to claim 1, wherein the step S1 comprises mixing and defoaming an addition type silicone oil and the thermal conducting fillers to form the fluid composition.

3. The method for preparing an oriented heat conducting sheet according to claim 2, wherein in step S1, the thermal conducting fillers comprise at least one of a fibrous thermal conducting filler or a sheet-like thermal conducting filler, and a spherical thermal conducting filler.

4. The method for preparing an oriented heat conducting sheet according to claim 3, wherein the fibrous thermal conducting filler is one selected from a group consisting of a carbon fiber, a carbon nanotube fiber and a graphene fiber; the sheet-like thermal conducting filler is one selected from a group consisting of a hexagonal boron nitride micro-sheet and a graphite micro-sheet; and the spherical thermal conducting filler is one or more selected from a group consisting of alumina, aluminum nitride and silicon carbide.

5. The method for preparing an oriented heat conducting sheet according to claim 3, wherein in step S1, a mass ratio of the fibrous thermal conducting filler or the sheet-like thermal conducting filler to the addition type silicone oil is 0.5 to 2.5, and the spherical thermal conducting filler accounts for 50 to 80% of a total mass of the fluid composition.

6. The method for preparing an oriented heat conducting sheet according to claim 1, wherein in step S1, the fluid composition has a viscosity of 200,000 to 3,000,000 mPa.Math.s.

7. The method for preparing an oriented heat conducting sheet according to claim 1, wherein in step S2, the orientation molding device drives the fluid composition to move circumferentially, so that the circumferential shear force is applied to the fluid composition layer by layer to orient the thermal conducting fillers in the fluid composition along the shear direction, thereby forming the oriented thin-layer composition.

8. The method for preparing an oriented heat conducting sheet according to claim 1, wherein the loading zone is symmetrically arranged around the central axis of the cylindrical rotating barrel; the loading zone comprises two sectorial cylindrical zones symmetrically arranged around the central axis of the cylindrical rotating barrel; and an interlayer is provided in the sleeve barrel, and filled with a cooling medium.

9. An oriented heat conducting sheet obtainable by a method for preparing an oriented heat conducting sheet according to claim 1.

10. A semiconductor heat dissipating device comprising an oriented heat conducting sheet according to claim 9, wherein the oriented heat conducting sheet is sandwiched between a packaged chip and a radiator.

Description

BRIEF DESCRIPTION OF DRAWINGS

(1) The drawings constituting a part of the present application are used to provide further understanding of the present application, and the exemplary embodiments of the present application and their descriptions are used to explain the present application and not to limit the present application.

(2) FIG. 1 is a schematic sectional view of the orientation molding device in Example 1.

(3) FIG. 2 is a schematic top view of the orientation molding device in Example 1.

(4) FIG. 3 is a schematic view of the aggregate after orientation using the orientation molding device in Example 1 in the preparation process of the oriented heat conducting sheet.

(5) FIG. 4 is a schematic view showing a process for preparing the oriented heat conducting sheet obtained by curing and slicing the aggregate using the orientation molding device in Example 1.

(6) FIG. 5 is an electron microscope image of the oriented heat conducting sheet obtained in Example 2 (FIG. A is a planed scanning electron microscope image of the oriented heat conducting sheet, and FIG. B is a partially enlarged scanning electron microscope image of a designated part in FIG. A).

(7) FIG. 6 is a schematic sectional view of a semiconductor heat dissipating device according to Example 7.

DETAILED DESCRIPTION

(8) The present application will be described in detail below with reference to the drawings. The description in this part is only exemplary and explanatory, and should not have any limiting effect on the protection scope of the present application. In addition, according to the description in this document, those skilled in the art can make corresponding combinations of features in the Example s and in different Example s in this document.

Example 1

(9) This Example provides an orientation molding device, referring to FIG. 1 and FIG. 2 , the orientation molding device includes:

(10) a cylindrical rotating barrel 2, in which a rotating shaft 5 is fixed on a central axis of the rotating barrel 2, and one end of the rotating shaft 5 is provided with a first motor 6, and the first motor 6 drives the rotating barrel 2 to rotate via the rotating shaft 5; the rotating barrel 2 is provided with an axisymmetric loading zone 1, and the loading zone 1 is two sectorial cylindrical zones, and the two sectorial cylindrical zones are symmetrically arranged around the central axis of the rotating barrel; and a rotating barrel opening is provided at a lower side of the loading zone 1;

(11) a sleeve barrel 3, in which the sleeve barrel 3 is provided with an interlayer, and the interlayer is filled with a cooling medium 4; the sleeve barrel 3 is sleeved outside the rotating barrel 2, and in this Example, there is a gap 14 between the rotating barrel 2 and the sleeve barre13, and the distance of the gap 14 is 0.1 to 5 mm; the rotating barrel 2 is configured to rotate inside the sleeve barrel 3, and a sleeve barrel opening with a same size as the rotating barrel opening is arranged at an end of the sleeve barrel 3 opposite to the rotating barrel opening;

(12) a die 9, in which the die 9 is provided with an inner cavity and an inner cavity opening, and an edge of the inner cavity opening is flush with and next to an edge of the sleeve barrel opening, and the edge of the inner cavity opening extends inwardly along a horizontal direction perpendicular to the central axis of the rotating barrel 2 to form a side wall of the inner cavity; and the die 9 is provided with a piston 12 and a second motor 11 which are arranged next to the side wall of the inner cavity; the output end of the second motor 11 is a screw 10, the screw 10 is connected with the piston 12, the second motor 11 configured to drive the piston 12 away from the sleeve barrel opening through the screw 10, a starting position of the piston 12 is flush with the sleeve barrel opening; in this embodiment, during the operation of the orientation molding device, the piston intermittently moved away from the sleeve barrel opening, and a interval time of the intermittence is t (min), the t≥π/ω, the ωis a angular velocity (r/min) of the rotating barrel; and a speed of the piston leaving the sleeve barrel opening each time is v (mm/min) which meets the condition of v≤D×ω/2, where the D (mm) is the distance between the rotating barrel and the sleeve barrel, and the w is the angular velocity (r/min) of the rotating barrel; and

(13) an electric heating module 13, in which the electric heating module13 is a configured to heat the inner cavity of the die 9.

(14) The preparation of the oriented heat conducting sheet was carried out by specifically using the orientation molding device of this Example, the specific operation steps were as follows.

(15) A prepared fluid composition was placed in the symmetrical loading zone 1 in the rotating barrel 2 of the orientation molding device, the angular velocity of the rotating barrel 2 is set to be ω for a circumferential motion, and the interlayer in the fixedly arranged sleeve barrel 3 was filled with a circulating cooling medium 4. During the circumferential motion, the fluid composition in the loading zone 1 entered the gap 14 between the rotating barrel 2 and the sleeve barrel 3 from the rotating barrel opening at the lower side of the rotating barrel 2 under the action of a centrifugal force, specifically as shown in FIG. 2. In the gap 14, the fluid composition was sheared at a high speed to form a thin-layer composition 7 in which the carbon fibers were oriented in the direction of the shear force. The interval time of the piston 12 leaving the sleeve barrel opening was set as t, and the speed of the piston 12 leaving the sleeve leaving opening each time was set as v. At this time, referring to FIG. 3, the thin-layer composition 7 was collected layer by layer in the inner cavity of the die 9 through the inner cavity opening to form a continuous multi-layer aggregate 8. In this Example, the fluid composition was composed of a fibrous or sheet-like high thermal conducting filler 15, a spherical thermal conducting filler 16 and a silica gel matrix 17. Referring to the multi-layer aggregate 8 shown in FIGS. 2 and 3, it can be seen that the fibrous or sheet-like high thermal conducting filler 15, the spherical thermal conducting filler 16 and the silica gel matrix 17 were uniformly dispersed in the multi-layer aggregate 8 in the direction of the shear force. After the multi-layer aggregate 8 was formed, the electric heating module 13 was turned on, and the die 9 was electrically heated to an appropriate temperature and time, so that the multi-layer aggregate 8 inside the die 9 was heat cured to obtain an oriented composition block. Next, a slicing process was performed, referring to FIG. 4, the oriented composition block was sliced step by step along the thickness direction using the ultrasonic cutting knife 18, and each step increment was set to obtain a specific thickness of the oriented heat conducting sheet 19.

Example 2

(16) This Example provides a method for preparing an oriented heat conducting sheet, using an orientation molding device in Example 1, and the specific implementation steps are as follows:

(17) Step S1, mixing: 100 g of addition type silicone oil (a mixture of 55 g of vinyl silicone oil, 44.9 g of hydrogen-containing silicone oil and 0.1 g of platinum catalyst), 75 g of carbon fiber powder (with a length of 0.1 mm and a diameter of 15 μm) and 300 g of spherical alumina were mixed and stirred for 30 min. After defoaming in vacuum for 5 minutes, a fluid composition with a viscosity of 200,000 mPa×s was formed;

(18) Step S2, orientation molding: the fluid composition obtained in step S1 was placed in the symmetrical loading zone of the rotating barrel of the orientation molding device, and the angular velocity of the rotating barrel was set to be 70 r/min for a circumferential motion; during the circumferential motion, the composition entered the gap between the rotating barrel and the sleeve barrel from the opening at a lower side of the rotating barrel under the action of centrifugal force, the distance between the rotating barrel and the sleeve barrel was 0.1 mm, the sleeve barrel was filled with a circulating cooling water, and the composition was sheared at high speed to form a thin-layer composition in which the carbon fibers were oriented in the direction of the shear force, the interval time of the piston leaving the sleeve barrel was set to be 3 s, the speed of the piston leaving the sleeve barrel each time was set to be 3 mm/min, and the thin-layer composition was collected in the die layer by layer to form a continuous multi-layer aggregate;

(19) Step S3, curing: the die in step S2 was electrically heated to 120° C., and then kept heating for 30 minutes to heat cure the multi-layer aggregate inside the die to obtain an oriented composition block, which was taken out of the die; and

(20) Step S4, slicing: the oriented composition block obtained in step S3 was sliced step by step along the thickness direction using the ultrasonic cutting knife, and the increment of each step was set to 2 mm to obtain an oriented heat conducting sheet with a thickness of 2 mm.

(21) FIG. 5 is an electron microscope image of the oriented heat conducting sheet obtained in this Example. Among them, FIG. A is a planed scanning electron microscope image of the oriented heat conducting sheet, and FIG. B is a partially enlarged scanning electron microscope image of the designated part in FIG. A. It can be seen that the carbon fibers in the oriented heat conducting sheet obtained in this Example were fully oriented.

Example 3

(22) This Example provides a method for preparing an oriented heat conducting sheet, using an orientation molding device in Example 1, and the specific implementation steps are as follows:

(23) Step S1, mixing: 100 g of reactive silicone oil (a mixture of 55 g of vinyl silicone oil, 44.9 g of hydrogen-containing silicone oil and 0.1 g of platinum catalyst), 120 g of carbon fiber powder (with a length of 0.1 mm and a diameter of 15 μm), 300 g of spherical alumina and 50 g of spherical aluminum nitride were mixed and stirred for 30 min, and defoamed under vacuum for 5 minutes to form a fluid composition with a viscosity of 650,000 mPa.Math.s;

(24) Step S2, orientation molding: the fluid composition obtained in step S1 was placed in the symmetrical loading zone of the rotating barrel of the orientation molding device, and the angular velocity of the rotating barrel was set to be 90 r/min for a circumferential motion. During the circumferential motion, the composition entered the gap between the rotating barrel and the sleeve barrel from the opening at a lower side of the rotating barrel under the action of centrifugal force, the distance between the rotating barrel and the sleeve barrel was 0.2 mm, the sleeve barrel was filled with a circulating cooling water, and the composition was sheared at high speed to form a thin-layer composition in which the carbon fibers were oriented in the direction of the shear force, the interval time of the piston leaving the sleeve barrel was set to be 5 s, the speed of the piston leaving the sleeve barrel each time was set to be 4 mm/min, and the thin-layer composition was collected in the die layer by layer to form a continuous multi-layer aggregate;

(25) Step S3, curing: the die in step S2 was electrically heated to 120° C., and then kept for 30 minutes to heat cure the multi-layer aggregate inside the die to obtain an oriented composition block, which was taken out of the die; and

(26) Step S4, slicing: the oriented composition block obtained in step S3 was sliced step by step along the thickness direction using the ultrasonic cutting knife, and an increment for each step was set to 2 mm to obtain an oriented heat conducting sheet with a thickness of 2 mm.

Example 4

(27) This Example provides a method for preparing an oriented heat conducting sheet, using an orientation molding device in Example 1, and the specific implementation steps are as follows:

(28) Step S1, mixing: 100 g of reactive silicone oil (a mixture of 55 g of vinyl silicone oil, 44.9 g of hydrogen-containing silicone oil and 0.1 g of platinum catalyst), 85 g of boron nitride micro-sheets, 350 g of spherical alumina and 50 g of spherical silicon carbide were mixed and stirred for 30 min. After defoaming in vacuum for 5 minutes, a fluid composition with a viscosity of 1,000,000 mPa.Math.s was formed;

(29) Step S2, orientation molding: the fluid composition obtained in step S1 was placed in the symmetrical loading zone of the rotating barrel of the orientation molding device, and the angular velocity of the rotating barrel was set to be 90 r/min for a circumferential motion; during the circumferential motion, the composition entered the gap between the rotating barrel and the sleeve barrel from the opening at a lower side of the rotating barrel under the action of centrifugal force, the distance between the rotating barrel and the sleeve barrel was 1 mm, the sleeve barrel was filled with a circulating cooling water, and the composition was sheared at high speed to form a thin-layer composition in which the carbon fibers were oriented in the direction of the shear force, the interval time of the piston leaving the sleeve barrel was set to be 5 s, the speed of the piston leaving the sleeve barrel each time was set to be 40 mm/min, and the thin-layer composition was collected in the die layer by layer to form a continuous multi-layer aggregate;

(30) Step S3, curing: the die in step S2 was electrically heated to 120° C., and then kept for 30 minutes to heat cure the multi-layer aggregate inside the die to obtain an oriented composition block, which was taken out of the die; and

(31) Step S4, slicing: the oriented composition block obtained in step S3 was sliced step by step along the thickness direction using the ultrasonic cutting knife, and the increment for each step was set to 2 mm to obtain an oriented heat conducting sheet with a thickness of 2 mm.

Example 5

(32) This Example provides a method for preparing an oriented heat conducting sheet, using an orientation molding device in Example 1, and the specific implementation steps are as follows:

(33) Step S1, mixing: 100 g of reactive silicone oil (a mixture of 55 g of vinyl silicone oil, 44.9 g of hydrogen-containing silicone oil and 0.1 g of platinum catalyst), 150 g of carbon fiber powder (with a length of 0.1 mm and a diameter of 15 μm) and 400 g of spherical alumina were mixed and stirred for 30 min. After defoaming in vacuum for 5 minutes, a fluid composition with a viscosity of 200,000 mPa.Math.s was formed;

(34) Step S2, orientation molding: the fluid composition obtained in step S1 was placed in the symmetrical loading zone of the rotating barrel of the orientation molding device, and the angular velocity of the rotating barrel was set to be 150 r/min for a circumferential motion; during the circumferential motion, the composition entered the gap between the rotating barrel and the sleeve barrel from the opening at a lower side of the rotating barrel under the action of centrifugal force, the distance between the rotating barrel and the sleeve barrel was 2 mm, the sleeve barrel was filled with a circulating cooling water, and the composition was sheared at high speed to form a thin-layer composition in which the carbon fibers were oriented in the direction of the shear force, the interval time of the piston leaving the sleeve barrel was set to be 2 s, the speed of the piston leaving the sleeve barrel each time was set to be 140 mm/min, and the thin-layer composition was collected in the die layer by layer to form a continuous multi-layer aggregate;

(35) Step S3, curing: the die in step S2 was electrically heated to 120° C., and then kept for 30 minutes to heat cure the multi-layer aggregate inside the die to obtain an oriented composition block, which was taken out of the die; and

(36) Step S4, slicing: the oriented composition block obtained in step S3 was sliced step by step along the thickness direction using the ultrasonic cutting knife, and the increment of each step was set to 2 mm to obtain an oriented heat conducting sheet with a thickness of 2 mm.

Example 6 Performance Test

(37) In this Example, the thermal conductivity performance test of the oriented heat conducting sheets prepared in Examples 2-5 was carried out. The test method of thermal conductivity was to use the thermal steady state method, and the test standard is ASTM D5470. The steps are as follows: a heat conducting gasket with a thickness of 2 mm was cut into a square piece of 26×26 mm, then the square piece was placed in a Ruiling LW-9389 thermal conductivity tester, the pressure was set to 10 psi and the thermal conductivity was measured. The results are shown in the following table.

(38) TABLE-US-00001 Example Example Example Example 2 3 4 5 Addition type silicone oil (g) 100 100 100 100 Carbon fiber powder (g) 75 120 0 150 Boron nitride microflakes (g) 0 0 75 0 Alumina (g) 300 300 350 400 Aluminum nitride (g) 0 50 0 0 Silicon carbide (g) 0 0 50 0 Viscosity of the fluid 200,000 650,000 1,000,000 2,000,000 composition (mPa .Math. s) Angular velocity of the 70 90 90 150 rotating barrel (r/min) Thickness of the oriented heat 2 2 2 2 conducting sheet (mm) Thermal conductivity 13 17 7 23 (W/m .Math. k)

(39) It can be seen that the oriented heat conducting sheet prepared by the method of the present application has high thermal conductivity.

Example 7

(40) This Example provides a semiconductor heat dissipation device using the oriented heat conducting sheets obtained in Examples 2 to 5, in which the heat conducting sheet 19 was fixed between the opposite surfaces of the radiator 20 and the packaged chip 21, as shown in FIG. 6. The semiconductor heat dissipation device was disposed on the chip 21 packaged by the circuit board 23, and the semiconductor heat dissipation device includes the heat conducting sheet 19 disposed on the chip 21, the radiator 20 disposed on the oriented heat conducting sheet 19, and the side surface of the packaged chip 21 is provided with the pins 22.

(41) The above are only the preferred embodiments of the present application. It should be pointed out that for those skilled in the art, without departing from the principles of the present application, several improvements and modifications can be made. It should be regarded as the protection scope of the present application.