A polymer composition is provided with improved stress whitening resistance, having at least one thermoplastic polymer material and a dielectric liquid. A process for preparing the polymer composition, a cable having at least one electrically insulating layer obtained from the polymer composition, and a process for preparing the cable are also provided.

A polymer composition is provided with improved stress whitening resistance, having at least one thermoplastic polymer material and a dielectric liquid. A process for preparing the polymer composition, a cable having at least one electrically insulating layer obtained from the polymer composition, and a process for preparing the cable are also provided.

A polymer composition is provided with improved stress whitening resistance, having at least one thermoplastic polymer material and a dielectric liquid. A process for preparing the polymer composition, a cable having at least one electrically insulating layer obtained from the polymer composition, and a process for preparing the cable are also provided.

A textile printing ink jet ink composition includes a dioxazine pigment, a resin particle, and a lubricant, wherein the content of the dioxazine pigment is 0.5 to 1.5 mass % based on the total amount of the ink composition.

A textile printing ink jet ink composition includes a dioxazine pigment, a resin particle, and a lubricant, wherein the content of the dioxazine pigment is 0.5 to 1.5 mass % based on the total amount of the ink composition.

There is provided a resin composition exhibiting excellent dielectric properties, high adhesion to a low-roughness surface, heat resistance, and excellent water resistance. This resin composition includes (a) a polymer having a polyphenylene ether backbone and a butadiene backbone in one molecule and having at least one selected from the group consisting of a vinyl group, a styryl group, an allyl group, an ethynyl group and a (meth)acryloyl group and at least any one of (b) a polymer including a styrene butadiene backbone and (c) a polymer including a cycloolefin backbone, wherein the content is the component (a) of 15 to 60 parts by weight and the total content of the component (b) and the component (c) is 40 to 85 parts by weight, based on 100 parts by weight of the total content of the component (a), the component (b), and the component (c).

There is provided a resin composition exhibiting excellent dielectric properties, high adhesion to a low-roughness surface, heat resistance, and excellent water resistance. This resin composition includes (a) a polymer having a polyphenylene ether backbone and a butadiene backbone in one molecule and having at least one selected from the group consisting of a vinyl group, a styryl group, an allyl group, an ethynyl group and a (meth)acryloyl group and at least any one of (b) a polymer including a styrene butadiene backbone and (c) a polymer including a cycloolefin backbone, wherein the content is the component (a) of 15 to 60 parts by weight and the total content of the component (b) and the component (c) is 40 to 85 parts by weight, based on 100 parts by weight of the total content of the component (a), the component (b), and the component (c).

A protective film forming agent that, in dicing of a semiconductor wafer, is used to form a protective film on the surface of the semiconductor wafer, can form a protective film that has excellent laser processability, and has excellent solubility of a light-absorbing agent; and a method for producing a semiconductor chip using the protective film forming agent. The protective film forming agent includes a water-soluble resin, a light-absorbing agent, a basic compound, and a solvent. The basic compound is an alkylamine, an alkanolamine, an imidazole compound, ammonia, or an alkali metal hydroxide. The light-absorbing agent content of the protective film forming agent is 0.1-10 mass % (inclusive).

A sound attenuation material includes a plurality of particles, each having a core and an elastic or compliant coating around the core, and a matrix surrounding the plurality of particles, the matrix being less dense than the core. A method of manufacturing sound attenuating materials includes adding an elastic or compliant coating to core particles and drying and/or curing the coating, mixing the coated core particles into a matrix material, and pouring the mixture into a mold. The core particles are denser than the matrix material.

A sound attenuation material includes a plurality of particles, each having a core and an elastic or compliant coating around the core, and a matrix surrounding the plurality of particles, the matrix being less dense than the core. A method of manufacturing sound attenuating materials includes adding an elastic or compliant coating to core particles and drying and/or curing the coating, mixing the coated core particles into a matrix material, and pouring the mixture into a mold. The core particles are denser than the matrix material.