Hot melt processable adhesive compositions to mask electronic components include at least one block copolymer, at least one tackifying resin, at least one semi-crystalline polyolefin polymer, at least one plasticizer, and at least one anti-oxidant. The adhesive composition is a hot melt processable pressure sensitive adhesive composition that is thermally stable, such that the composition when disposed on a surface withstands heating to 260° C. without degradation or flowing, remains optically transparent, and after heating to 260° C. remains cleanly removable.

The invention pertains to a composition based on a fluoroelastomer comprising nitrile or carboxylate-type cure sites and including a curing agent and a Br-containing marker having reactivity towards the said cure-sites, which can be cured so as to deliver cured parts maintaining chemically bound bromine atoms; this material, when submitted to wear/damage would hence release Br-containing contaminants, which can easily spotted via notably an on-line mass spectrometer, so as to monitor and anticipate critical failures of sealing materials based there upon.

The invention pertains to a composition based on a fluoroelastomer comprising nitrile or carboxylate-type cure sites and including a curing agent and a Br-containing marker having reactivity towards the said cure-sites, which can be cured so as to deliver cured parts maintaining chemically bound bromine atoms; this material, when submitted to wear/damage would hence release Br-containing contaminants, which can easily spotted via notably an on-line mass spectrometer, so as to monitor and anticipate critical failures of sealing materials based there upon.

The presently claimed invention provides a continuous process for preparing a polyurethane composition which behaves as a rheology modifier upon addition to paint and coating formulations. The present process employs mixers for homogenization of highly viscous polyurethane polymers and by adjusting the process parameters and reactor conditions in specified ranges obtained a polyurethane composition. The polyurethane composition obtained from the process of the present invention is used as thickener in water-borne paint and coating formulations.

A transparent adhesive composition including an epoxy resin (A), an epoxy resin-curing agent (B), and a phenoxy resin (C), wherein the epoxy resin-curing agent (B) satisfies the following (1) and (2): (1) the epoxy resin-curing agent (B) is in a powdery form and has a particle diameter (d90) at 90% cumulative distribution frequency of 2.0 μm or less; and (2) the epoxy resin-curing agent (B) has solubility in 100 g of methyl ethyl ketone at 25° C. of 0.1 g or less; a film-shaped transparent adhesive processed therefrom; a method of producing a transparent adhesive cured layer-attached member by using the film-shaped transparent adhesive; a method of producing an electronic component; and an electronic component.

Provided herein is an asphalt binder composition, and more particularly, an amine-containing asphalt binder composition capable of improving mixability between an asphalt binder and an aggregate, and compactibility and water resistance of an asphalt paving mixture. More particularly, the present invention relates to an asphalt binder composition capable of being used in hot mix asphalt for improving workability and/or stripping-resistance, warm-mix asphalt, recycling of reclaimed asphalt pavement, or the like.

Provided herein is an asphalt binder composition, and more particularly, an amine-containing asphalt binder composition capable of improving mixability between an asphalt binder and an aggregate, and compactibility and water resistance of an asphalt paving mixture. More particularly, the present invention relates to an asphalt binder composition capable of being used in hot mix asphalt for improving workability and/or stripping-resistance, warm-mix asphalt, recycling of reclaimed asphalt pavement, or the like.

Disclosed is a carboxy group-containing aqueous resin composition containing a carboxy group-containing aqueous resin and a polycarbodiimide compound (X) represented by the following general formula (1): ##STR00001##
wherein R.sup.1 represents a residue obtained by removing a functional group capable of reacting with an isocyanate from a hydrophilic compound having the functional group capable of reacting with an isocyanate; R.sup.2 represents a divalent residue obtained by removing isocyanate groups from a diisocyanate compound; R.sup.3 represents a divalent residue obtained by removing hydroxy groups from a glycol compound; X represents a group to be formed through a reaction between the hydrophilic compound and the diisocyanate compound; n1 represents a number of 1 to 10; n2 represents a number of 1 to 10; m represents a number of 1 to 5; and plural R.sup.1's may be the same or different and plural R.sup.2's may be the same or different.

A resin composition includes: a polyphenylene ether compound having at least one of groups expressed by formulas (1) and (2), a curing agent reactable with the polyphenylene ether compound, a styrene-based polymer having structural units expressed by formulas (3) and (4); and an inorganic filler containing boron nitride, wherein a content of the inorganic filler is 100 to 320 parts by mass relative to 100 parts by mass of a total of the polyphenylene ether compound, the curing agent, and the styrene-based polymer.

A resin composition includes: a polyphenylene ether compound having at least one of groups expressed by formulas (1) and (2), a curing agent reactable with the polyphenylene ether compound, a styrene-based polymer having structural units expressed by formulas (3) and (4); and an inorganic filler containing boron nitride, wherein a content of the inorganic filler is 100 to 320 parts by mass relative to 100 parts by mass of a total of the polyphenylene ether compound, the curing agent, and the styrene-based polymer.