Embodiments of organic peroxide formulations provide significant improvements in surface tackiness (often including tack-free surfaces) when curing elastomers in the presence of oxygen. The peroxide formulations may include, for example, one or more compounds selected from sulfur-containing compounds, organophosphite compounds, HALS (Hindered Amine Light Stabilizer) compounds, aliphatic allyl urethane compounds, and blends comprising nitroxides (e.g., 4-hydroxy-TEMPO) and quinones (e.g., mono-tert-butylhydroquinone).

Various embodiments of the teachings herein include a cationic tape accelerator for use in a process for producing an insulation system by impregnation and/or encapsulation with an anhydride-free impregnating agent. The tape accelerator comprises an ionogenic compound of a sulfonium-containing cation and a hexafluoroantimonate anion.

Various embodiments of the teachings herein include a cationic tape accelerator for use in a process for producing an insulation system by impregnation and/or encapsulation with an anhydride-free impregnating agent. The tape accelerator comprises an ionogenic compound of a sulfonium-containing cation and a hexafluoroantimonate anion.

Provided is a technique suitable for multilayering thin semiconductor elements via adhesive bonding while avoiding wafer damage in a method of manufacturing a semiconductor device, the method in which semiconductor elements are multilayered through laminating wafers in which the semiconductor elements are fabricated. The method of the present invention includes bonding and removing. In the bonding step, a back surface 1b side of a thinned wafer 1T in a reinforced wafer 1R having a laminated structure including a supporting substrate S, a temporary adhesive layer 2, and the thinned wafer 1T is bonded via an adhesive to an element forming surface 3a of a wafer 3. A temporary adhesive for forming the temporary adhesive layer 2 contains a polyvalent vinyl ether compound, a compound having two or more hydroxy groups or carboxy groups and thus capable of forming a polymer with the polyvalent vinyl ether compound, and a thermoplastic resin. The adhesive contains a polymerizable group-containing polyorganosilsesquioxane. In the removing step, a temporary adhesion by the temporary adhesive layer 2 between the supporting substrate S and the thinned wafer 1T is released to remove the supporting substrate S.

Provided is a technique suitable for multilayering thin semiconductor elements via adhesive bonding while avoiding wafer damage in a method of manufacturing a semiconductor device, the method in which semiconductor elements are multilayered through laminating wafers in which the semiconductor elements are fabricated. The method of the present invention includes bonding and removing. In the bonding step, a back surface 1b side of a thinned wafer 1T in a reinforced wafer 1R having a laminated structure including a supporting substrate S, a temporary adhesive layer 2, and the thinned wafer 1T is bonded via an adhesive to an element forming surface 3a of a wafer 3. A temporary adhesive for forming the temporary adhesive layer 2 contains a polyvalent vinyl ether compound, a compound having two or more hydroxy groups or carboxy groups and thus capable of forming a polymer with the polyvalent vinyl ether compound, and a thermoplastic resin. The adhesive contains a polymerizable group-containing polyorganosilsesquioxane. In the removing step, a temporary adhesion by the temporary adhesive layer 2 between the supporting substrate S and the thinned wafer 1T is released to remove the supporting substrate S.

The present invention provides an adhesive composition for a dicing tape, which may prevent the success rate of chip pick-up from decreasing due to an oxygen inhibition phenomenon occurring in a dicing process, and a dicing tape including the same. The adhesive composition for a dicing tape includes an adhesive binder, a reducing agent, and a photoinitiator.

A resist composition including a base component which exhibits changed solubility in a developing solution under action of acid and an acid-generator component (B) which generates acid upon exposure, the base component including a polymeric compound containing a structural unit having an acid decomposable group, the amount of the structural unit having an acid decomposable group, based on the combined total of all structural units contained in the base component being 51 mol % to 59 mol %, and the structural unit having an acid decomposable group includes a structural unit represented by general formula (a1-1) shown below (in which R represents a hydrogen atom, an alkyl group or a halogenated alkyl group; Z represents a single bond or an alkyl group; and C.sub.p is a group represented by general formula (Cp-1) shown below). ##STR00001##

A resist composition including a base component which exhibits changed solubility in a developing solution under action of acid and an acid-generator component (B) which generates acid upon exposure, the base component including a polymeric compound containing a structural unit having an acid decomposable group, the amount of the structural unit having an acid decomposable group, based on the combined total of all structural units contained in the base component being 51 mol % to 59 mol %, and the structural unit having an acid decomposable group includes a structural unit represented by general formula (a1-1) shown below (in which R represents a hydrogen atom, an alkyl group or a halogenated alkyl group; Z represents a single bond or an alkyl group; and C.sub.p is a group represented by general formula (Cp-1) shown below). ##STR00001##

Provided is an antifouling coating composition, which can form a coating film having good hardness and good physical properties and having a wear degree appropriate for expressing a long-term antifouling effect, has a viscosity not being excessively high, and makes it possible to reduce a content of volatile organic compounds, and a polymer-containing composition which is suitable for obtaining the antifouling coating composition. The polymer-containing composition contains a (meth)acryl-based copolymer (A-1), in which the (meth)acryl-based copolymer (A-1) contains a constitutional unit (U11) or a constitutional unit (U12) having carboxylate forming an ionic bond with a divalent metal atom, and has a weight-average molecular weight of 1,000 to 5,000, and the polymer-containing composition has a coating film hardness (Martens hardness) equal to or higher than 2.5 N/mm.sup.2.

Provided is an antifouling coating composition, which can form a coating film having good hardness and good physical properties and having a wear degree appropriate for expressing a long-term antifouling effect, has a viscosity not being excessively high, and makes it possible to reduce a content of volatile organic compounds, and a polymer-containing composition which is suitable for obtaining the antifouling coating composition. The polymer-containing composition contains a (meth)acryl-based copolymer (A-1), in which the (meth)acryl-based copolymer (A-1) contains a constitutional unit (U11) or a constitutional unit (U12) having carboxylate forming an ionic bond with a divalent metal atom, and has a weight-average molecular weight of 1,000 to 5,000, and the polymer-containing composition has a coating film hardness (Martens hardness) equal to or higher than 2.5 N/mm.sup.2.