A thermosetting resin composition contains an ethylene-propylene-diene copolymer (A), a terminal-modified polyphenylene ether compound (B), an inorganic filler (C), a styrene-based elastomer (D), and a fibrous filler (E).

A thermosetting resin composition contains an ethylene-propylene-diene copolymer (A), a terminal-modified polyphenylene ether compound (B), an inorganic filler (C), a styrene-based elastomer (D), and a fibrous filler (E).

Provided is a polycarbonate resin composition that can block ultraviolet light as well as light on the visible light side therefrom at wavelengths of 400 to 420 nm, and that is free of the problem of gas generation during molding. The polycarbonate resin composition characteristically comprises, per 100 parts by mass of a polycarbonate resin (A), (i) 0.02 to 1 parts by mass of a sesamol group-containing benzotriazole ultraviolet absorber (B1) having a maximum absorption wavelength of at least 375 nm in the absorption curve determined according to JIS K 7105 using the following formula, or (ii) 0.08 to 1 parts by mass of a sesamol group-containing benzotriazole ultraviolet absorber (B2) having a maximum absorption wavelength of at least 360 nm and less than 375 nm in the absorption curve determined according to JIS K 7105 using the following formula; and 0.01 to 0.5% by mass of a stabilizer (C).

Provided is a polycarbonate resin composition that can block ultraviolet light as well as light on the visible light side therefrom at wavelengths of 400 to 420 nm, and that is free of the problem of gas generation during molding. The polycarbonate resin composition characteristically comprises, per 100 parts by mass of a polycarbonate resin (A), (i) 0.02 to 1 parts by mass of a sesamol group-containing benzotriazole ultraviolet absorber (B1) having a maximum absorption wavelength of at least 375 nm in the absorption curve determined according to JIS K 7105 using the following formula, or (ii) 0.08 to 1 parts by mass of a sesamol group-containing benzotriazole ultraviolet absorber (B2) having a maximum absorption wavelength of at least 360 nm and less than 375 nm in the absorption curve determined according to JIS K 7105 using the following formula; and 0.01 to 0.5% by mass of a stabilizer (C).

A transparent thermoplastic resin composition containing: based on 100 parts by mass of the transparent thermoplastic resin composition, 10 to 60 parts by mass of a graft copolymer (A) obtained by graft copolymerizing a monomer mixture (a) containing at least an aromatic vinyl-based monomer (a1) and a (meth)acrylic acid ester-based monomer (a2) in the presence of a rubbery polymer (R); 40 to 90 parts by mass of a vinyl copolymer (B) obtained by copolymerizing a monomer mixture (b) containing at least an aromatic vinyl-based monomer (b1) and a (meth)acrylic acid ester-based monomer (b2); 100 to 1,000 ppm of a phenolic compound (C); and a dihydrooxaphosphaphenanthrene-based phosphorus compound (D), wherein a molar ratio (P/OH) of a phosphorus atom (P) of the dihydrooxaphosphaphenanthrene-based phosphorus compound (D) to a hydroxyl group (OH) of the phenolic compound (C) is 0.2 to 5.0.

A transparent thermoplastic resin composition containing: based on 100 parts by mass of the transparent thermoplastic resin composition, 10 to 60 parts by mass of a graft copolymer (A) obtained by graft copolymerizing a monomer mixture (a) containing at least an aromatic vinyl-based monomer (a1) and a (meth)acrylic acid ester-based monomer (a2) in the presence of a rubbery polymer (R); 40 to 90 parts by mass of a vinyl copolymer (B) obtained by copolymerizing a monomer mixture (b) containing at least an aromatic vinyl-based monomer (b1) and a (meth)acrylic acid ester-based monomer (b2); 100 to 1,000 ppm of a phenolic compound (C); and a dihydrooxaphosphaphenanthrene-based phosphorus compound (D), wherein a molar ratio (P/OH) of a phosphorus atom (P) of the dihydrooxaphosphaphenanthrene-based phosphorus compound (D) to a hydroxyl group (OH) of the phenolic compound (C) is 0.2 to 5.0.

Provided is a polycarbonate resin composition that can block ultraviolet light as well as light on the visible light side therefrom at wavelengths of 400 to 420 nm, and that is free of the problem of gas generation during molding. The polycarbonate resin composition characteristically comprises, per 100 parts by mass of a polycarbonate resin (A), (i) 0.02 to 1 parts by mass of a sesamol group-containing benzotriazole ultraviolet absorber (B1) having a maximum absorption wavelength of at least 375 nm in the absorption curve determined according to JIS K 7105 using the following formula, or (ii) 0.08 to 1 parts by mass of a sesamol group-containing benzotriazole ultraviolet absorber (B2) having a maximum absorption wavelength of at least 360 nm and less than 375 nm in the absorption curve determined according to JIS K 7105 using the following formula; and 0.01 to 0.5% by mass of a stabilizer (C).

Provided is a polycarbonate resin composition that can block ultraviolet light as well as light on the visible light side therefrom at wavelengths of 400 to 420 nm, and that is free of the problem of gas generation during molding. The polycarbonate resin composition characteristically comprises, per 100 parts by mass of a polycarbonate resin (A), (i) 0.02 to 1 parts by mass of a sesamol group-containing benzotriazole ultraviolet absorber (B1) having a maximum absorption wavelength of at least 375 nm in the absorption curve determined according to JIS K 7105 using the following formula, or (ii) 0.08 to 1 parts by mass of a sesamol group-containing benzotriazole ultraviolet absorber (B2) having a maximum absorption wavelength of at least 360 nm and less than 375 nm in the absorption curve determined according to JIS K 7105 using the following formula; and 0.01 to 0.5% by mass of a stabilizer (C).

A UV light curable adhesive is disclosed, comprising, at least one bi-active monomer, at least one polymerizable oligomer, a primary photoinitiator, and a monomer scavenger, wherein photopolymerization of the at least one bi-active monomer by the primary photoinitiator activates the monomer scavenger, reducing residual monomer content in a cured adhesive formed by the photopolymerization of the bi-active monomer in comparison to an otherwise identical comparative UV adhesive lacking the monomer scavenger. A method for curing the UV light curable adhesive is disclosed, including applying the UV light curable adhesive to a surface and exposing the UV light curable adhesive to UV light, free from heating the UV light curable adhesive other than any autogenous increases in temperature from exothermic polymerization reactions. A device with the UV light cured adhesive is disclosed, including the UV light cured adhesive joining a first surface to a second surface.

A UV light curable adhesive is disclosed, comprising, at least one bi-active monomer, at least one polymerizable oligomer, a primary photoinitiator, and a monomer scavenger, wherein photopolymerization of the at least one bi-active monomer by the primary photoinitiator activates the monomer scavenger, reducing residual monomer content in a cured adhesive formed by the photopolymerization of the bi-active monomer in comparison to an otherwise identical comparative UV adhesive lacking the monomer scavenger. A method for curing the UV light curable adhesive is disclosed, including applying the UV light curable adhesive to a surface and exposing the UV light curable adhesive to UV light, free from heating the UV light curable adhesive other than any autogenous increases in temperature from exothermic polymerization reactions. A device with the UV light cured adhesive is disclosed, including the UV light cured adhesive joining a first surface to a second surface.