Disclosed are compositions comprising polyesters containing a chain of residue of: diols and diesters along the chain, wherein at least a portion of the diesters are 1, 1-diester-1-alkenes, and the chains have alkene groups incorporated into the chains; the composition comprising one or more of the following: i ether groups derived from alcohols, diols, polyols, or a combination thereof obtained via Michael addition to the alkene groups and a residue of the alkene groups remaining after Michael addition; ii the formed polyesters contain one percent or less of residual 1, 1-diester-1-alkene which are unreacted; iii one or more free radical inhibitors; and iv a stabilizer comprising one or more of: oxo acids phosphorous or esters thereof, aluminum sulfate, stannous pyrophosphate, stannous sulfate, aluminum dihydrogenphosphate or decomposition products thereof. The stabilizer is present in an amount sufficient to enhance stability of the polyester without lowering reactivity of the polyester.

The present invention provides antimicrobial and/or antiviral properties for polymers and synthetic fibers that have stain resistant properties. The synthetic fiber comprises a polymer, such as a copolymer comprising from 85 to 99.5 percent by weight of a polyamide based on the total weight of the fiber and an aromatic sulfonate or a salt thereof present in a range from 0.5 to 10 percent by weight based on the total weight of the fiber, one or more metal compounds or ions thereof dispersed within the copolymer, and a phosphorus compound.

The invention relates to the use of a silyl functional compound b), which silyl functional compound comprises a N—O—Si bond, for improving the flame retardant properties of a composition comprising an organic polymer a), which is one of a thermoplastic polymer or a thermoset polymer or a mixture thereof.

The invention relates to the use of a silyl functional compound b), which silyl functional compound comprises a N—O—Si bond, for improving the flame retardant properties of a composition comprising an organic polymer a), which is one of a thermoplastic polymer or a thermoset polymer or a mixture thereof.

The invention relates to a composition comprising an organic polymer, and a silyl functional compound comprising a N—Si bond.

The invention relates to a composition comprising an organic polymer, and a silyl functional compound comprising a N—Si bond.

A curable organopolysiloxane composition comprises: (A) an epoxy group-containing organopolysiloxane represented by the average composition formula:

X.sub.aR.sup.1.sub.bSiO.sub.(4-a-b)/2

wherein X represents at least one type of epoxy group selected from a glycidoxyalky group, an epoxycycloalkyl alkyl group, and an epoxyalkyl group; R.sup.1 represents a hydrogen atom, an alkyl group, an alkenyl group, an aryl group, an aralkyl group,a hydroxyl group, or an alkoxy group; provided at least two X groups are present in a molecule; and “a” and “b” are numbers satisfying: 0<a<1, 0<b<3, and 0.8<a+b<3; (B) a compound having at least two mercapto groups in a molecule; and (C) an amine compound not having a N—H bond and/or a phosphine compound not having a P—H bond. The composition has favorable curability even at a relatively low temperature, and forms a cured film having excellent bonding with regard to an object to be coated.

A curable organopolysiloxane composition comprises: (A) an epoxy group-containing organopolysiloxane represented by the average composition formula:

X.sub.aR.sup.1.sub.bSiO.sub.(4-a-b)/2

wherein X represents at least one type of epoxy group selected from a glycidoxyalky group, an epoxycycloalkyl alkyl group, and an epoxyalkyl group; R.sup.1 represents a hydrogen atom, an alkyl group, an alkenyl group, an aryl group, an aralkyl group,a hydroxyl group, or an alkoxy group; provided at least two X groups are present in a molecule; and “a” and “b” are numbers satisfying: 0<a<1, 0<b<3, and 0.8<a+b<3; (B) a compound having at least two mercapto groups in a molecule; and (C) an amine compound not having a N—H bond and/or a phosphine compound not having a P—H bond. The composition has favorable curability even at a relatively low temperature, and forms a cured film having excellent bonding with regard to an object to be coated.

The present invention related to a thermosetting resin composition for high frequency, the composition containing (a) a polyphenylene ether having two or more unsaturated substituent groups selected from the group consisting of the vinyl group and the allyl group at both ends of the molecular chain thereof, or an oligomer of said polyphenylene ether; (b) three or more different types of cross-linking curing agents; and (c) a flame retardant. The present invention may provide a printed circuit board for high frequency which simultaneously exhibits low dielectric loss characteristic and good moisture-absorption heat resistance, low thermal expansion characteristics, excellent thermal stability, excellent processability, and the like.

Polymeric compositions, methods of making the compositions, and composites, such as computer chassis containing the compositions are described. The polymeric compositions can contain 20 wt. % to 50 wt. % of a post-consumer mechanical recycled polycarbonate; 10 wt. % to 50 wt. % of a renewably sourced polycarbonate; 10 wt. % to 30 wt. % of a filler containing carbon fibers, wherein at least a portion of the carbon fibers are obtained from a post-industrial recycled source; and 5 wt. % to 15 wt. % of a flame retardant, wherein the polymeric compositions have a total recycled and renewable content of 50 wt. % to 90 wt. %.