The thermosetting resin composition, a prepreg containing same, a metal foil-clad laminate and a printed circuit board; the resin composition comprises the following components: a combination of a bismaleimide resin and a benzoxazine resin or a prepolymer of a bismaleimide resin and a benzoxazine resin, an epoxy resin and an active ester. A metal foil-clad laminate prepared by using the resin composition provided by the present invention has a high glass transition temperature, a low thermal expansion coefficient, a high high-temperature modulus, a high peel strength, a low dielectric constant, a low dielectric loss factor, as well as good heat resistance and good processability.

A thermoplastic resin composition includes: a polycarbonate resin (I); a specific graft copolymer (II); a vinyl copolymer (III); an inorganic filler (IV); and a phosphate ester compound (V). The vinyl-based copolymer (III) has a weight average molecular weight of 110,000 or less. A ratio of a melt flow rate of the vinyl-based copolymer (III) to a melt flow rate of the polycarbonate resin (I) is 7 or more and 12 or less. A blending amount of the phosphoric acid ester-based compound (V) is 1 to 10 parts by weight with respect to 100 parts by weight of a total amount of (I) to (IV).

An electrochromic device includes one or more flame-retardant agents.

A low-corrosion fire-resistant thermoplastic resin composition comprising a thermoplastic resin, a phosphinic acid salt flame retardant, a reinforced glass fiber, and a rare earth metal salt corrosion inhibitor. The resin composition improves the corrosion resistance and mechanical performance of the metal to a great extent while maintaining the high flame resistance.

The present invention relates to the use of NOR-HALS compounds in flame retardant polymer compositions. These compositions are especially useful for the manufacture of flame retardant compositions based on thermoplastic polymers, especially polyolefin homo- and copolymers, polycondensates, such as polyamines or polyesters and duroplastic polymers, such as polyepoxides.

The present invention relates to the use of NOR-HALS compounds in flame retardant polymer compositions. These compositions are especially useful for the manufacture of flame retardant compositions based on thermoplastic polymers, especially polyolefin homo- and copolymers, polycondensates, such as polyamines or polyesters and duroplastic polymers, such as polyepoxides.

A thermoplastic composition comprises, based on the total weight of the polymers in the thermoplastic composition, a polycarbonatesiloxane-arylate; 2 to 15 wt % or 2 to 8 wt % or 1 to 4 wt % of a core-shell impact modifier; a flame retardant comprising a bromine-containing polymer or oligomer effective to provide 1.5 wt % to 5 wt % of bromine; an aromatic organophosphorus compound, effective to provide 0.1 to 1 wt % of phosphorus, or a combination comprising at least one of the foregoing; and optionally 0 to 80 wt % or 0 to 60 wt % of a polyetherimide.

A thermoplastic composition comprises, based on the total weight of the polymers in the thermoplastic composition, a polycarbonatesiloxane-arylate; 2 to 15 wt % or 2 to 8 wt % or 1 to 4 wt % of a core-shell impact modifier; a flame retardant comprising a bromine-containing polymer or oligomer effective to provide 1.5 wt % to 5 wt % of bromine; an aromatic organophosphorus compound, effective to provide 0.1 to 1 wt % of phosphorus, or a combination comprising at least one of the foregoing; and optionally 0 to 80 wt % or 0 to 60 wt % of a polyetherimide.

The present invention relates to a halogen-free epoxy resin composition, a prepreg and a laminate containing the same. The halogen-free epoxy resin composition comprises 60 parts by weight of epoxy resin, from 15 to 28 parts by weight of benzoxazine resin, and from 10 to 20 parts by weight of styrene-maleic anhydride. The present invention discloses using from 15 to 28 parts by weight of benzoxazine resin and from 10 to 20 parts by weight of styrene-maleic anhydride to cure 60 parts by weight of epoxy resin, to ensure the Df stability of prepregs at different curing temperature conditions while maintaining low dielectric constant and low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

The present invention relates to a halogen-free epoxy resin composition, a prepreg and a laminate containing the same. The halogen-free epoxy resin composition comprises 60 parts by weight of epoxy resin, from 15 to 28 parts by weight of benzoxazine resin, and from 10 to 20 parts by weight of styrene-maleic anhydride. The present invention discloses using from 15 to 28 parts by weight of benzoxazine resin and from 10 to 20 parts by weight of styrene-maleic anhydride to cure 60 parts by weight of epoxy resin, to ensure the Df stability of prepregs at different curing temperature conditions while maintaining low dielectric constant and low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.