C08K5/54

ESTER-TYPE EPOXY FURAN RESIN AND MANUFACTURING METHOD THEREFOR, RESIN COMPOSITION, AND CURED RESIN PRODUCT
20170335053 · 2017-11-23 · ·

The ester-type epoxy furan resin of the present invention is represented by the following general formula (1).

##STR00001##

(In the general formula (1), R.sup.1 is an alkylene group having 2 to 6 carbon atoms optionally containing a hydroxy group; R.sup.2 and R.sup.3 are each an alkyl group having 1 to 4 carbon atoms, and R.sup.2 and R.sup.3 may be bonded to each other to form a cyclic structure; n is 0 to 300; and a plurality of R.sup.1, R.sup.2, and R.sup.3, if present within the molecule, may be mutually the same or different.)

ESTER-TYPE EPOXY FURAN RESIN AND MANUFACTURING METHOD THEREFOR, RESIN COMPOSITION, AND CURED RESIN PRODUCT
20170335053 · 2017-11-23 · ·

The ester-type epoxy furan resin of the present invention is represented by the following general formula (1).

##STR00001##

(In the general formula (1), R.sup.1 is an alkylene group having 2 to 6 carbon atoms optionally containing a hydroxy group; R.sup.2 and R.sup.3 are each an alkyl group having 1 to 4 carbon atoms, and R.sup.2 and R.sup.3 may be bonded to each other to form a cyclic structure; n is 0 to 300; and a plurality of R.sup.1, R.sup.2, and R.sup.3, if present within the molecule, may be mutually the same or different.)

Adhesive and its preparation and application

The present invention relates to an adhesive, a preparation method and application thereof, particularly the application for bonding glass fiber composites, and a bonded article obtained by using the adhesive. The adhesive comprises: a polyisocyanate having an isocyanate functionality of not less than 2; an epoxy-modified polyether polyol; a hydroxyl-containing acrylate; a redox catalyst; a silane coupling agent; optionally a polyol containing bisphenol A structure; and optionally a polymer polyol different from the epoxy-modified polyether polyol. The adhesive according to the present invention has the advantages of being insensitive to moisture, good bonding properties and a long pot life.

Adhesive and its preparation and application

The present invention relates to an adhesive, a preparation method and application thereof, particularly the application for bonding glass fiber composites, and a bonded article obtained by using the adhesive. The adhesive comprises: a polyisocyanate having an isocyanate functionality of not less than 2; an epoxy-modified polyether polyol; a hydroxyl-containing acrylate; a redox catalyst; a silane coupling agent; optionally a polyol containing bisphenol A structure; and optionally a polymer polyol different from the epoxy-modified polyether polyol. The adhesive according to the present invention has the advantages of being insensitive to moisture, good bonding properties and a long pot life.

Curable composition, semiconductor device, and ester bond-containing organosilicon compound

A curable composition including: (A) an ester bond-containing organosilicon compound having two or more addition reactive carbon-carbon double bonds in one molecule, shown by the following general formula (1); (B) a silicon compound having two or more silicon atom-bonded hydrogen atoms in one molecule; and (C) a hydrosilylation reaction catalyst. This provides a curable composition to give a cured product with low gas permeability as well as excellent crack resistance and light transmission property. ##STR00001##

Curable composition, semiconductor device, and ester bond-containing organosilicon compound

A curable composition including: (A) an ester bond-containing organosilicon compound having two or more addition reactive carbon-carbon double bonds in one molecule, shown by the following general formula (1); (B) a silicon compound having two or more silicon atom-bonded hydrogen atoms in one molecule; and (C) a hydrosilylation reaction catalyst. This provides a curable composition to give a cured product with low gas permeability as well as excellent crack resistance and light transmission property. ##STR00001##

COMPOSITE RESIN MOLDED BODY, MANUFACTURING METHOD THEREOF, AND CASING MEMBER USING SAME
20170334105 · 2017-11-23 ·

A composite resin molded body includes a base compound resin and a molten-kneaded mixture which contains an organic fibrous filler, and a dispersing agent. In the composite resin molded body, a content of the organic fibrous filler is at least 5 mass % and at most 70 mass %, and a proportion T of the organic fibrous filler carbonized in the composite resin molded body is equal to or less than 0.1.

COMPOSITE RESIN MOLDED BODY, MANUFACTURING METHOD THEREOF, AND CASING MEMBER USING SAME
20170334105 · 2017-11-23 ·

A composite resin molded body includes a base compound resin and a molten-kneaded mixture which contains an organic fibrous filler, and a dispersing agent. In the composite resin molded body, a content of the organic fibrous filler is at least 5 mass % and at most 70 mass %, and a proportion T of the organic fibrous filler carbonized in the composite resin molded body is equal to or less than 0.1.

INTERLAYER COMPOSITION AND DEVICES MADE THEREFROM

A composition formed from ingredients comprising: an epoxy; a polyvinyl phenol; a cross-linking agent; an epoxy silane; and a solvent is disclosed. A printable medium and other devices made from the composition are also disclosed.

Process for producing rubber composition
09822246 · 2017-11-21 · ·

Process for producing a rubber composition comprising a rubber component (A) comprising at least one selected from natural rubbers and synthetic diene rubbers, a filler containing an inorganic filler (B), a silane coupling agent (C), and at least two kinds of chemical agents (D) and (E) selected from guanidines, sulfenamides, thiazoles, thiurams, dithiocarbamates, thioureas, and xanthates, wherein the rubber composition is kneaded in a plurality of stages wherein, in the first stage (X) of kneading, the rubber component (A), all or a portion of the inorganic filler (B), all or a portion of the silane coupling agent (C), and at least two kinds of the chemical agents (D) and (E) are added and kneaded.