A photocurable silicone composition is disclosed. A cured product of the composition is also disclosed. The photocurable silicone composition comprises: (A) an organopolysiloxane having at least one aryl group with 6 to 12 carbons and at least one alkenyl group with 2 to 12 carbons in a molecule; (B) an organic compound having at least two ether bonds and at least one aliphatic carbon-carbon double bond in a molecule; (C) a thiol group-containing organic compound comprising; (C.sub.1) an organic compound having two thiol groups in a molecule, and (C.sub.2) an organic compound having at least three thiol groups in a molecule; and (D) a photoradical initiator. The composition generally suppresses crack and delamination of a cured product laminated between two substrates after thermal aging.

An encapsulant of a photovoltaic module, intended for coating a photovoltaic cell, having a composition which does not include any cross-linking agent and including: an ethylene—alkyl acrylate copolymer, the copolymer making up 70% to 96% of the weight of the composition; a silane, making up 0.1% to 2% of the weight of the composition; wherein the composition also includes a terpolymer of ethylene—acrylic ester—maleic anhydride or glycidyl methacrylate, the terpolymer making up 2% to 29.9% of the weight of the composition. Also relates to the use of such an encapsulant in a photovoltaic module as well as to a photovoltaic module including such an encapsulant.

An encapsulant of a photovoltaic module, intended for coating a photovoltaic cell, having a composition which does not include any cross-linking agent and including: an ethylene—alkyl acrylate copolymer, the copolymer making up 70% to 96% of the weight of the composition; a silane, making up 0.1% to 2% of the weight of the composition; wherein the composition also includes a terpolymer of ethylene—acrylic ester—maleic anhydride or glycidyl methacrylate, the terpolymer making up 2% to 29.9% of the weight of the composition. Also relates to the use of such an encapsulant in a photovoltaic module as well as to a photovoltaic module including such an encapsulant.

An encapsulant of a photovoltaic module, intended for coating a photovoltaic cell, having a composition which does not include any cross-linking agent and including: an ethylene—alkyl acrylate copolymer, the copolymer making up 70% to 96% of the weight of the composition; a silane, making up 0.1% to 2% of the weight of the composition; wherein the composition also includes a terpolymer of ethylene—acrylic ester—maleic anhydride or glycidyl methacrylate, the terpolymer making up 2% to 29.9% of the weight of the composition. Also relates to the use of such an encapsulant in a photovoltaic module as well as to a photovoltaic module including such an encapsulant.

A composition comprising the following components: A) an ethylene/α-olefin/non-conjugated diene interpolymer; B) a peroxide; C) at least one multi-vinyl cyclic siloxane selected from Structure 1 below: Structure 1, wherein n is an integer greater than, or equal to, 1; and each R1 is independently selected from the following: a (C.sub.2-C.sub.4) alkenyl, or a H.sub.2C═C(R.sup.1a)—C(═O)—O—(CH.sub.2).sub.m—, and wherein R.sup.1a is H or methyl, and m is an integer from 1 to 4; and each R2 is independently selected from the following: H, a (C.sub.1-C.sub.4) alkyl, a (C.sub.2-C.sub.4) alkenyl, a phenyl, or a H.sub.2C═C(R.sup.1b)—C(═O)—O—(CH.sub.2).sub.m—, wherein R.sup.1b is H or methyl, and m is an integer from 1 to 4. ##STR00001##

To improve storage stability of a resin composition used for applications such as a semiconductor sealing material. The resin composition is a resin composition that includes (A) an epoxy resin, (B) a curing agent, and (C) a silica filler. The silica filler of component (C) is surface-treated with a basic substance having a conjugate acid dissociation constant (pKa) of 9.4 or more. The resin composition further includes (D) a silane coupling agent, or the silica filler of component (C) is further surface-treated with a silane coupling agent.

To improve storage stability of a resin composition used for applications such as a semiconductor sealing material. The resin composition is a resin composition that includes (A) an epoxy resin, (B) a curing agent, and (C) a silica filler. The silica filler of component (C) is surface-treated with a basic substance having a conjugate acid dissociation constant (pKa) of 9.4 or more. The resin composition further includes (D) a silane coupling agent, or the silica filler of component (C) is further surface-treated with a silane coupling agent.

An ethylenically unsaturated polymer includes at a terminus the radical of an allylic compound that includes a functional group free of active hydrogen atoms that is bonded to the allylic C atom through a S, P, Si or Sn atom and a vinyl aromatic compound. The polymer can be used as a component of a variety of elastomeric compounds used in the production of vulcanizates.

A double-sided tape including: a first adhesive layer including about 100 parts by weight of an acrylic polymer, about 1 to about 2 parts by weight of a silane coupling agent, and about 0.1 to about 0.18 parts by weight of carbon black; a foamed polymer layer disposed on the first adhesive layer, including a urethane foam; an interlayer polymer layer disposed on the foamed polymer layer, including a polyolefin (PO), polyethylene terephthalate (PET), a polyester, or a combination thereof; and a second adhesive layer disposed on the interlayer polymer layer, including about 100 parts by weight of an acrylic polymer, about 1 to about 2 parts by weight of a silane coupling agent, and about 0.1 to about 0.18 parts by weight of carbon black, wherein an overall thickness of the double-sided tape is in a range of about 0.4 millimeters to about 1.3 millimeters.

An embodiment of the present technology is an isocyanate-based adhesive used for a surface-treated crystalline thermoplastic resin base material, the isocyanate-based adhesive having a value represented by (JIS-A hardness)/(strength at break [MPa])×(elongation at break (%))/100 of 2.0 to 70 after being cured by being allowed to stand still under a condition at 23° C. and 50% RH for 3 days, and the crystalline thermoplastic resin base material having a value represented by (δ.sup.d/δ.sup.p+δ.sup.p) of 2.0 to 30.0. δ.sup.p=γ.sup.p−γ.sup.p0 and δ.sup.d=|γ.sup.d−γ.sup.d0|, γ.sup.p0 is a polar term of surface free energy before the surface treatment, γ.sup.p is a polar term of surface free energy after the surface treatment, γ.sup.d0 is a dispersion term of the surface free energy before the surface treatment, and γ.sup.d is a dispersion term of the surface free energy after the surface treatment.