C08K5/55

PHOTOCONTROLLED DYNAMIC COVALENT LINKERS FOR POLYMER NETWORKS
20220306816 · 2022-09-29 ·

Reversibly crosslinkable polymeric networks, including reversibly crosslinkable hydrogel networks are provided. Also provided are methods of making the polymeric networks and methods of using the hydrogel networks in tissue engineering applications. The reversibly crosslinkable polymeric networks are composed of polymer chains that are covalently crosslinked by azobenzene boronic ester bonds that can be reversibly formed and broken by exposing the polymeric networks to different wavelengths of light.

PHOTOCONTROLLED DYNAMIC COVALENT LINKERS FOR POLYMER NETWORKS
20220306816 · 2022-09-29 ·

Reversibly crosslinkable polymeric networks, including reversibly crosslinkable hydrogel networks are provided. Also provided are methods of making the polymeric networks and methods of using the hydrogel networks in tissue engineering applications. The reversibly crosslinkable polymeric networks are composed of polymer chains that are covalently crosslinked by azobenzene boronic ester bonds that can be reversibly formed and broken by exposing the polymeric networks to different wavelengths of light.

STORAGE STABLE EPOXY RESIN COMPOSITION

The present invention relates to the use of boronic acids to increase the storage stability of epoxy resin compositions and epoxy resin compositions comprising an epoxy resin, a curing agent, a curing accelerator and a boronic acid.

STORAGE STABLE EPOXY RESIN COMPOSITION

The present invention relates to the use of boronic acids to increase the storage stability of epoxy resin compositions and epoxy resin compositions comprising an epoxy resin, a curing agent, a curing accelerator and a boronic acid.

STORAGE STABLE EPOXY RESIN COMPOSITION

The present invention relates to the use of boronic acids to increase the storage stability of epoxy resin compositions and epoxy resin compositions comprising an epoxy resin, a curing agent, a curing accelerator and a boronic acid.

Curable acrylate or methacrylate compositions

A curable composition based on a curable acrylate or methacrylate component; an organoborane initiator component; a vinyl ether component; and an activator for the organoborane component. The composition exhibits good storage stability and good bonding properties when used to bond low surface energy substrates.

Curable acrylate or methacrylate compositions

A curable composition based on a curable acrylate or methacrylate component; an organoborane initiator component; a vinyl ether component; and an activator for the organoborane component. The composition exhibits good storage stability and good bonding properties when used to bond low surface energy substrates.

Polycarbonate resin molding material

Provided is a polycarbonate resin molding material, including an aromatic polycarbonate resin (A), in which the polycarbonate resin molding material has: a content of o-hydroxyacetophenone measured by a predetermined method (1) of 1 ppm by mass or less; and a YI value measured by a predetermined method (2) of 1.21 or less.

Polycarbonate resin molding material

Provided is a polycarbonate resin molding material, including an aromatic polycarbonate resin (A), in which the polycarbonate resin molding material has: a content of o-hydroxyacetophenone measured by a predetermined method (1) of 1 ppm by mass or less; and a YI value measured by a predetermined method (2) of 1.21 or less.

DICHROIC DYE COMPOUND, POLARIZING FILM, AND USES THEREOF
20170226071 · 2017-08-10 ·

A compound having a maximum absorption in a wavelength range of 350 nm to 550 nm that functions as a dichroic dye is provided. In particular, a compound represented by formula (1) is provided. In the compound of formula (1), R.sup.1 represents an alkyl group having 1 to 20 carbon atoms or the like; R.sup.2 represents an acyl group having 1 to 20 carbon atoms or the like; R.sup.3 represents a hydrogen atom or the like; and Y represents a group of formula (Y1). In the formula (Y1), * represents a bonding site with N, or a group of formula (Y2). In the formula (Y2), * represents a bonding site with N; P.sup.1 and P.sup.2 each independently represent —S— or the like; and Q.sup.1 and Q.sup.2 each independently represent ═N— or the like.

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