Provided is a hydrosilylation reactive composition that has a sufficient pot life at room temperature, that can be cured at low temperature by exposure to high energy radiation, and that produces a stable semi-cured product during the curing process, and to provide a semi-cured product and a cured product obtained using this hydrosilylation reactive composition. The composition comprises: (A) a compound containing at least one aliphatically unsaturated monovalent hydrocarbon group in the molecule; (B) a compound containing at least two hydrogen atoms bonded to silicon atoms in the molecule; (C) a first hydrosilylation catalyst exhibiting activity in the composition without exposure to high energy radiation; and (D) a second hydrosilylation catalyst not exhibiting activity unless exposed to high energy radiation, and exhibiting activity in the composition by exposure to high energy radiation.

Provided is a hydrosilylation reactive composition that has a sufficient pot life at room temperature, that can be cured at low temperature by exposure to high energy radiation, and that produces a stable semi-cured product during the curing process, and to provide a semi-cured product and a cured product obtained using this hydrosilylation reactive composition. The composition comprises: (A) a compound containing at least one aliphatically unsaturated monovalent hydrocarbon group in the molecule; (B) a compound containing at least two hydrogen atoms bonded to silicon atoms in the molecule; (C) a first hydrosilylation catalyst exhibiting activity in the composition without exposure to high energy radiation; and (D) a second hydrosilylation catalyst not exhibiting activity unless exposed to high energy radiation, and exhibiting activity in the composition by exposure to high energy radiation.

Provided is a silicone composition that has high thermal conductivity and favorable adhesion. A silicone composition that contains (A) 50-99.9 parts by mass of an organopolysiloxane that has at least two aliphatic unsaturated hydrocarbon groups per molecule thereof and has a kinematic viscosity of 60-100,000 mm.sup.2/s at 25° C., (B) 0.1-50 parts by mass of a silicone resin that has at least one aliphatic unsaturated hydrocarbon group per molecule thereof (provided that the total of components (A) and (B) is 100 parts by mass), (C) an organohydrogen polysiloxane, (D) 0.01-10.0 parts by mass of an organic peroxide that has a ten-hour half-life temperature of at least 40° C. per 100 total parts by mass of components (A) and (B), and (E) 100-3,000 parts by mass of a thermally conductive filler that has a thermal conductivity of at least 10 W/(m.Math.° C.) per 100 total parts by mass of components (A) and (B).

Provided is a silicone composition that has high thermal conductivity and favorable adhesion. A silicone composition that contains (A) 50-99.9 parts by mass of an organopolysiloxane that has at least two aliphatic unsaturated hydrocarbon groups per molecule thereof and has a kinematic viscosity of 60-100,000 mm.sup.2/s at 25° C., (B) 0.1-50 parts by mass of a silicone resin that has at least one aliphatic unsaturated hydrocarbon group per molecule thereof (provided that the total of components (A) and (B) is 100 parts by mass), (C) an organohydrogen polysiloxane, (D) 0.01-10.0 parts by mass of an organic peroxide that has a ten-hour half-life temperature of at least 40° C. per 100 total parts by mass of components (A) and (B), and (E) 100-3,000 parts by mass of a thermally conductive filler that has a thermal conductivity of at least 10 W/(m.Math.° C.) per 100 total parts by mass of components (A) and (B).

The invention comprises a butyl acetate-silicone formulation comprising (A) an organopolysiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule, (B) an organosilicon compound containing an average of at least two silicon-bonded hydrogen atoms per molecule; (C) a hydrosilylation catalyst; and a coating effective amount of (D) butyl acetate. The invention also comprises related silicone formulations made by removing a portion, or all, of (D) butyl acetate therefrom, and related cured products, methods, articles and devices.

The invention comprises a butyl acetate-silicone formulation comprising (A) an organopolysiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule, (B) an organosilicon compound containing an average of at least two silicon-bonded hydrogen atoms per molecule; (C) a hydrosilylation catalyst; and a coating effective amount of (D) butyl acetate. The invention also comprises related silicone formulations made by removing a portion, or all, of (D) butyl acetate therefrom, and related cured products, methods, articles and devices.

A weather resistant matte silicone coating special for EMAS, comprising: 80˜130 parts by weight of α,ω-dihydroxypolydimethylsiloxane; 0.5˜10 parts by weight of a linear polydimethylsiloxane with terminal hydroxyl group; 1˜10 parts by weight of fumed silica; 10˜50 parts by weight of precipitated silica; 1˜5 parts by weight of color masterbatch; 0.9˜5 parts by weight of organotin chelate catalyst; crosslinking agent, comprising 1.5˜7 parts by weight of methyltri(methylethylketoximino)silane, 1.5˜7 parts by weight of vinyltri(methylethylketoximino)silane, and 1˜7 parts by weight of aminopropyltriethoxysilane; 1.5˜6 parts by weight of delustering agent; and 250˜350 parts by weight of a solvent. The coating has the properties of low viscosity, high flow, relatively fast curing, moderate strength, good adhesion, good mattness, being environmentally friendly and the like.

A weather resistant matte silicone coating special for EMAS, comprising: 80˜130 parts by weight of α,ω-dihydroxypolydimethylsiloxane; 0.5˜10 parts by weight of a linear polydimethylsiloxane with terminal hydroxyl group; 1˜10 parts by weight of fumed silica; 10˜50 parts by weight of precipitated silica; 1˜5 parts by weight of color masterbatch; 0.9˜5 parts by weight of organotin chelate catalyst; crosslinking agent, comprising 1.5˜7 parts by weight of methyltri(methylethylketoximino)silane, 1.5˜7 parts by weight of vinyltri(methylethylketoximino)silane, and 1˜7 parts by weight of aminopropyltriethoxysilane; 1.5˜6 parts by weight of delustering agent; and 250˜350 parts by weight of a solvent. The coating has the properties of low viscosity, high flow, relatively fast curing, moderate strength, good adhesion, good mattness, being environmentally friendly and the like.

Methods of making luminescent perovskite-polymer composites are provided and structures using the same. Perovskite-polymer composites made by the method described herein are provided. The perovskite-polymer composite is useful in many applications including downconverters for backlight units (BLU) of liquid crystal displays (LCDs), as well as for and could be used for light emitting devices, lasers or as active absorber or passive luminescent concentrators for solar photovoltaic applications.

Methods of making luminescent perovskite-polymer composites are provided and structures using the same. Perovskite-polymer composites made by the method described herein are provided. The perovskite-polymer composite is useful in many applications including downconverters for backlight units (BLU) of liquid crystal displays (LCDs), as well as for and could be used for light emitting devices, lasers or as active absorber or passive luminescent concentrators for solar photovoltaic applications.