C08K5/56

High performance plastic magnetic materials and preparation method thereof

The invention discloses a high performance plastic magnetic material, comprising a low surface energy layer, a magnetic layer and a printable layer, wherein the magnetic layer and the printable layer are arranged successively on a first side of the low surface energy layer; the low surface energy layer is an organic silicon pressure sensitive adhesive layer. The invention further discloses a preparation method, comprising the following steps: pretreating a magnetic powder with a coupling agent; mixing the pretreated magnetic powder with matrix components and auxiliaries to gain a mixture; extrusion compositing the gained mixture with a printable layer to gain composite paper having the printable layer and a magnetic layer; and applying a low surface energy layer on a side of the magnetic layer, opposite the printable layer. As no UV layer and no adhesive residue, the material of the invention is environmentally friendly and highly reliable.

High performance plastic magnetic materials and preparation method thereof

The invention discloses a high performance plastic magnetic material, comprising a low surface energy layer, a magnetic layer and a printable layer, wherein the magnetic layer and the printable layer are arranged successively on a first side of the low surface energy layer; the low surface energy layer is an organic silicon pressure sensitive adhesive layer. The invention further discloses a preparation method, comprising the following steps: pretreating a magnetic powder with a coupling agent; mixing the pretreated magnetic powder with matrix components and auxiliaries to gain a mixture; extrusion compositing the gained mixture with a printable layer to gain composite paper having the printable layer and a magnetic layer; and applying a low surface energy layer on a side of the magnetic layer, opposite the printable layer. As no UV layer and no adhesive residue, the material of the invention is environmentally friendly and highly reliable.

WAVELENGTH SELECTIVE ABSORPTION FILTER, POLARIZING PLATE, ORGANIC ELECTROLUMINESCENT DISPLAY DEVICE, AND LIQUID CRYSTAL DISPLAY DEVICE
20230026009 · 2023-01-26 · ·

Provided are a wavelength selective absorption filter containing a resin and a dye A, which has a main absorption wavelength band in the wavelength selective absorption filter at a wavelength of 400 to 450 nm, and a dye C, which has a main absorption wavelength band in the wavelength selective absorption filter at a wavelength of 560 to 600 nm, each of which has a main absorption wavelength band in a different wavelength range, as well as a polarizing plate and an organic electroluminescent display device or liquid crystal display device, which include the wavelength selective absorption filter. However, the dye A and the dye C do not have fluorescence.

WAVELENGTH SELECTIVE ABSORPTION FILTER, POLARIZING PLATE, ORGANIC ELECTROLUMINESCENT DISPLAY DEVICE, AND LIQUID CRYSTAL DISPLAY DEVICE
20230026009 · 2023-01-26 · ·

Provided are a wavelength selective absorption filter containing a resin and a dye A, which has a main absorption wavelength band in the wavelength selective absorption filter at a wavelength of 400 to 450 nm, and a dye C, which has a main absorption wavelength band in the wavelength selective absorption filter at a wavelength of 560 to 600 nm, each of which has a main absorption wavelength band in a different wavelength range, as well as a polarizing plate and an organic electroluminescent display device or liquid crystal display device, which include the wavelength selective absorption filter. However, the dye A and the dye C do not have fluorescence.

Addition-curing silicone resin for producing heat-shielding film, method for forming heat-shielding film on inner surface of combustion chamber of engine by means of addition-curing silicone resin, heat-shielding film, and heat shielding method for reducing or preventing heat dissipation from combustion chamber of engine to outside by means of heat-shielding film

In a heat-shielding film formed of addition-curing silicone resin containing organopolysiloxane, organopolysiloxane includes the combination of a plurality of units including at least a R.sup.1SiO.sub.3/2 unit (a T unit), a R.sup.2R.sup.3SiO.sub.2/2 unit (a D unit), and a R.sup.4R.sup.5R.sup.6SiO.sub.1/2 unit (a M unit) (in each unit, R.sup.1 to R.sup.6 is aliphatic hydrocarbon or hydrogen), and the molar ratio of the T unit, the D unit, and the M unit among all structural units is T:33.3 mol % to 71.4 mol %, D:11.1 mol % to 42.9 mol %, and M:7.0 mol % to 42.9 mol %.

Addition-curing silicone resin for producing heat-shielding film, method for forming heat-shielding film on inner surface of combustion chamber of engine by means of addition-curing silicone resin, heat-shielding film, and heat shielding method for reducing or preventing heat dissipation from combustion chamber of engine to outside by means of heat-shielding film

In a heat-shielding film formed of addition-curing silicone resin containing organopolysiloxane, organopolysiloxane includes the combination of a plurality of units including at least a R.sup.1SiO.sub.3/2 unit (a T unit), a R.sup.2R.sup.3SiO.sub.2/2 unit (a D unit), and a R.sup.4R.sup.5R.sup.6SiO.sub.1/2 unit (a M unit) (in each unit, R.sup.1 to R.sup.6 is aliphatic hydrocarbon or hydrogen), and the molar ratio of the T unit, the D unit, and the M unit among all structural units is T:33.3 mol % to 71.4 mol %, D:11.1 mol % to 42.9 mol %, and M:7.0 mol % to 42.9 mol %.

CURABLE SILICONE-(METH)ACRYLATE COMPOSITION AND METHODS FOR ITS PREPARATION AND USE
20230227700 · 2023-07-20 ·

A curable silicone-(meth)acrylate pressure sensitive composition is curable via hydrosilylation reaction to form a silicone-(meth)acrylate pressure sensitive adhesive with an initial adhesion. When the silicone-(meth)acrylate pressure sensitive adhesive is exposed to actinic radiation, the resulting silicone-(meth)acrylate adhesive has a subsequent adhesion, which is higher than the initial adhesion.

CURABLE SILICONE-(METH)ACRYLATE COMPOSITION AND METHODS FOR ITS PREPARATION AND USE
20230227700 · 2023-07-20 ·

A curable silicone-(meth)acrylate pressure sensitive composition is curable via hydrosilylation reaction to form a silicone-(meth)acrylate pressure sensitive adhesive with an initial adhesion. When the silicone-(meth)acrylate pressure sensitive adhesive is exposed to actinic radiation, the resulting silicone-(meth)acrylate adhesive has a subsequent adhesion, which is higher than the initial adhesion.

THERMOPLASTIC AND THERMOSET FOAM NUCLEATION ADDITIVE AND FOAMED MATERIAL

A thermoplastic and thermoset foam nucleation additive, which is added to a foamed material, includes a gas absorbent and a nano-compound, wherein the nano-compound and the gas absorbent are mixed to form the thermoplastic and thermoset foam nucleation additive. The gas absorbent includes a central structure and a short chain structure, wherein a first chemical bond is formed between the short chain structure and the central structure. The nano-compound includes a base structure and a long chain structure, wherein a second chemical bond is formed between the long chain structure and the base structure. A number of carbon atoms in the short chain structure is not less than 8, and a molecular weight of the long chain structure is higher than 10000 g/mole.

THERMOPLASTIC AND THERMOSET FOAM NUCLEATION ADDITIVE AND FOAMED MATERIAL

A thermoplastic and thermoset foam nucleation additive, which is added to a foamed material, includes a gas absorbent and a nano-compound, wherein the nano-compound and the gas absorbent are mixed to form the thermoplastic and thermoset foam nucleation additive. The gas absorbent includes a central structure and a short chain structure, wherein a first chemical bond is formed between the short chain structure and the central structure. The nano-compound includes a base structure and a long chain structure, wherein a second chemical bond is formed between the long chain structure and the base structure. A number of carbon atoms in the short chain structure is not less than 8, and a molecular weight of the long chain structure is higher than 10000 g/mole.