A polydiorganosiloxane having both a silicon bonded aliphatically unsaturated group and a silicon bonded poly(meth)acrylate polymer or copolymer, and method for preparation of this polydiorganosiloxane are disclosed. The method preserves the aliphatically unsaturated groups when grafting the poly(meth)acrylate to the polydiorganosiloxane. This polydiorganosiloxane is useful in hydrosilylation reaction curable compositions, such as pressure sensitive adhesive compositions.

A polydiorganosiloxane having both a silicon bonded aliphatically unsaturated group and a silicon bonded poly(meth)acrylate polymer or copolymer, and method for preparation of this polydiorganosiloxane are disclosed. The method preserves the aliphatically unsaturated groups when grafting the poly(meth)acrylate to the polydiorganosiloxane. This polydiorganosiloxane is useful in hydrosilylation reaction curable compositions, such as pressure sensitive adhesive compositions.

Film-forming polymers that contain covalently-attached or non-covalently bound light-filtering, e.g., UV-absorbing, compounds and their use as a skin-protectant coating, such as a sunscreen, are disclosed.

Film-forming polymers that contain covalently-attached or non-covalently bound light-filtering, e.g., UV-absorbing, compounds and their use as a skin-protectant coating, such as a sunscreen, are disclosed.

Provided is: a multicomponent curable thermally conductive silicone gel composition which has a high thermal conductivity, has excellent gap-filling ability and repairability, and has superior storage stability; a thermally conductive member comprising the composition; and a heat dissipating structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane; (C) a catalyst for hydrosilylation reaction; (D) a thermally conductive filler; (E) a silane-coupling agent or a hydrolysis condensation product thereof; and (F) a specific organopolysiloxane having a hydrolyzable silyl group at one end thereof. The thermally conductive silicone gel composition includes (I) a liquid composition that includes components (A), (C), (D), (E), and (F), but does not include component (B) and (II) a liquid composition that includes components (B), (D), (E), and (F), but does not include component (C) which are individually stored.

Provided is: a multicomponent curable thermally conductive silicone gel composition which has a high thermal conductivity, has excellent gap-filling ability and repairability, and has superior storage stability; a thermally conductive member comprising the composition; and a heat dissipating structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane; (C) a catalyst for hydrosilylation reaction; (D) a thermally conductive filler; (E) a silane-coupling agent or a hydrolysis condensation product thereof; and (F) a specific organopolysiloxane having a hydrolyzable silyl group at one end thereof. The thermally conductive silicone gel composition includes (I) a liquid composition that includes components (A), (C), (D), (E), and (F), but does not include component (B) and (II) a liquid composition that includes components (B), (D), (E), and (F), but does not include component (C) which are individually stored.

An electronic component, or a precursor thereof, that comprises a curable organopolysiloxane composition or a cured product thereof is disclosed. The curable organopolysiloxane composition is generally curable through a hydrosilylation reaction and can be applied to at least one area by a microdroplet application device. The curable organopolysiloxane composition has a viscosity of no more than 2.0 Pa.Math.s at a strain rate of 1,000 (1/s), and a viscosity at a strain rate of 0.1 (1/s) being a value no less than 50.0 times the viscosity at a strain rate of 1,000 (1/s). In particular, the area of application generally is a substantially circular area that fits within a frame no more than 1000 μm in diameter, a linear area no more than 1000 μm in line width, or a pattern configured from a combination of these areas.

An electronic component, or a precursor thereof, that comprises a curable organopolysiloxane composition or a cured product thereof is disclosed. The curable organopolysiloxane composition is generally curable through a hydrosilylation reaction and can be applied to at least one area by a microdroplet application device. The curable organopolysiloxane composition has a viscosity of no more than 2.0 Pa.Math.s at a strain rate of 1,000 (1/s), and a viscosity at a strain rate of 0.1 (1/s) being a value no less than 50.0 times the viscosity at a strain rate of 1,000 (1/s). In particular, the area of application generally is a substantially circular area that fits within a frame no more than 1000 μm in diameter, a linear area no more than 1000 μm in line width, or a pattern configured from a combination of these areas.

A non-curable thermally conductive material contains: (a) a matrix material containing: (i) 90 to 98 wt % of a non-functional non-crosslinked organosiloxane fluid having a dynamic viscosity of 50 to 350 centiStokes; and (ii) 2 to less than 10 wt % of a crosslinked hydrosilylation reaction product of an alkenyl terminated polydiorganosiloxane having a degree of polymerization greater than 300 and an organohydrogensiloxane crosslinker with 2 or more SiH groups per molecule where the molar ratio of SiH groups to alkenyl groups is 0.5 to 2.0; (b) greater than 80 wt % to less than 95 wt % thermally conductive filler dispersed throughout the matrix material; and (c) treating agents selected from alkyltrialkoxy silanes where the alkyl contains one to 14 carbon atoms and monotrialkoxy terminated diorganopolysiloxanes having a degree of polymerization of 20 to 110 and the alkoxy groups each contain one to 12 carbon atoms dispersed in the matrix material.

A non-curable thermally conductive material contains: (a) a matrix material containing: (i) 90 to 98 wt % of a non-functional non-crosslinked organosiloxane fluid having a dynamic viscosity of 50 to 350 centiStokes; and (ii) 2 to less than 10 wt % of a crosslinked hydrosilylation reaction product of an alkenyl terminated polydiorganosiloxane having a degree of polymerization greater than 300 and an organohydrogensiloxane crosslinker with 2 or more SiH groups per molecule where the molar ratio of SiH groups to alkenyl groups is 0.5 to 2.0; (b) greater than 80 wt % to less than 95 wt % thermally conductive filler dispersed throughout the matrix material; and (c) treating agents selected from alkyltrialkoxy silanes where the alkyl contains one to 14 carbon atoms and monotrialkoxy terminated diorganopolysiloxanes having a degree of polymerization of 20 to 110 and the alkoxy groups each contain one to 12 carbon atoms dispersed in the matrix material.