The invention provides a compound of the formula:

##STR00001##

wherein Ar is selected from the group consisting of aryl, monosubstituted aryl and poly-substituted aryl, heteroaryl, monosubstituted heteroaryl and polysubstituted heteroaryl; Ar is selected from the group consisting of aryl, monosubstituted aryl and polysubstituted aryl, heteroaryl, monosubstituted heteroaryl and polysubstituted heteroaryl; R is an alkylene radical having 2-20 carbon atoms; and n=1-20. The compounds of the invention are used with polymer resins to enhance their gas barrier properties.

The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.

A coating composition comprising a polymer, such as a copolymer comprising alkylene monomers and unsaturated acid monomers, and at least one phyllosilicate, a product coated with said composition, a method of making said coating compositions and a method of making said coated products.

Polyesters compositions comprising gas barrier enhancing additives and containers comprising such polyester compositions are provided herein. Also provided are methods for preparing polyester containers comprising said gas barrier enhancing additives. The polyester containers of the present invention exhibit decreased permeability to gases thereby providing improved shelf-life.

The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.

The present invention aims to provide a polysiloxane composition which exhibits high heat and light resistance, and excellent gas-barrier properties. The polysiloxane composition of the present invention includes: (A) a modified polyhedral polysiloxane which is obtained by modifying (a) an alkenyl group-containing polyhedral polysiloxane compound with (b) a hydrosilyl group-containing compound; and (B) an organopolysiloxane containing at least two alkenyl groups in a molecule, wherein the polysiloxane composition after curing has a water vapor permeability of not more than 30 g/m.sup.2/24 h, and the polysiloxane composition includes (B1) an aryl group-containing organopolysiloxane as the organopolysiloxane (B), and/or (C) a component which is (C1) an organosilicon compound that contains one alkenyl or hydrosilyl group in a molecule, or (C2) a cyclic olefin compound that contains one carbon-carbon double bond in a molecule.

An electronic component has an organic member between two transparent substrates, in which outer peripheral portions of the two transparent substrates are bonded by a sealing material containing low melting glass. The low melting glass contains vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of oxides. The sealing material is formed of a sealing material paste which contains the low melting glass, a resin binder and a solvent, the low melting glass containing vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of the oxides. Thereby, thermal damages to an organic element or an organic material contained in the electronic component can be reduced and an electronic component having a glass bonding layer of high reliability can be produced efficiently.

V.sub.2O.sub.5+TeO.sub.2+Fe.sub.2O.sub.3+P.sub.2O.sub.590 (mass %)(1)

V.sub.2O.sub.5>TeO.sub.2>Fe.sub.2O.sub.3>P.sub.2O.sub.5 (mass %)(2)

A method for preparing a cellulose dispersion includes oxidizing cellulose; preparing cellulose nanofibers by defibrating the oxidized cellulose; and adding a water-soluble polymer and inorganic particles to the dispersion containing the cellulose nanofibers.

An object of the present invention is to provide a polyhedral polysiloxane composition that has high heat resistance and high light resistance, is excellent in gas-barrier properties and thermal shock resistance, and exhibits good handleability when used to encapsulate an optical semiconductor device. The polyhedral polysiloxane composition of the present invention is characterized by including a modified polyhedral polysiloxane which is obtained by hydrosilylation of an alkenyl group-containing polyhedral polysiloxane compound (a) and a hydrosilyl group-containing compound (b) and has a structure derived from an organic silicon compound (a) having one alkenyl group per molecule.

The present invention aims to provide a polysiloxane composition which exhibits high heat and light resistance, and excellent gas-barrier properties. The polysiloxane composition of the present invention includes: (A) a modified polyhedral polysiloxane which is obtained by modifying (a) an alkenyl group-containing polyhedral polysiloxane compound with (b) a hydrosilyl group-containing compound; and (B) an organopolysiloxane containing at least two alkenyl groups in a molecule, wherein the polysiloxane composition after curing has a water vapor permeability of not more than 30 g/m.sup.2/24 h, and the polysiloxane composition includes (B1) an aryl group-containing organopolysiloxane as the organopolysiloxane (B), and/or (C) a component which is (C1) an organosilicon compound that contains one alkenyl or hydrosilyl group in a molecule, or (C2) a cyclic olefin compound that contains one carbon-carbon double bond in a molecule.