A polymer composition that contains a polyaryletherketone and a plurality of reinforcing fibers is provided. The reinforcing fibers have an aspect ratio of from about 1.5 to about 10, which is defined as the cross-sectional width of the fibers divided by the cross-sectional thickness of the fibers.

The present invention relates to the use of coating compositions, comprising shaped transition metal, especially silver, particles and a binder, wherein the ratio of pigment to binder is preferably such that the resulting coating shows an angle dependent color change, for the production of security elements and holograms. When the coating compositions of the present invention are used in coating a hologram the obtained products show a an angle dependent color change (flip/flop effect), different colors in reflection and transmission, an extremely bright OVD image and extremely strong rainbow effect, high purity and contrast.

The present invention provides an excellent electrically conductive paste which is applicable or printable and stretchable and which ca realize an electrically conductive membrane having high electrical conductivity. An electrically conductive paste wherein a conductive, filler (B) is uniformly dispersed in a resin (A) characterized in that the resin (A) is a rubber (A1) containing sulfur atom and/or a rubber (A2) containing nitrile group, and that the conductive filler (B) is metal powder (B1) having an average particle diameter of 0.5 to 10 μm and a conductive material (B2) having a group selected from mercapto group, amino group and nitrite group on its surface and having an aspect ratio of 10 to 10,000. Instead of having said group on the surface, the conductive filler (B) may be subjected to a surface treatment with a rubber containing sulfide bond and/or nitrite group. Also, the conductive filler (B) may be metal nanowire.

This invention relates to a thermally expandable fire-resistant resin composition comprising a resin component in an amount of 100 parts by weight, thermally expandable graphite in an amount of 3 to 300 parts by weight, and an inorganic filler in an amount of 2 to 200 parts by weight, wherein the thermally expandable graphite has an average aspect ratio of 20 or more.

Provided are a thermal conductive silicone composition having a favorable heat dissipation property; and a semiconductor device using such composition. The thermal conductive silicone composition contains: (A) an organopolysiloxane that has a kinetic viscosity of 10 to 100,000 mm.sup.2/s at 25° C., and is represented by the following average composition formula (1)

R.sup.1.sub.aSiO.sub.(4-a)/2  (1) wherein R.sup.1 represents a hydrogen atom, a saturated or unsaturated monovalent hydrocarbon group having 1 to 18 carbon atoms or a hydroxy group, and a represents a number satisfying 1.8≤a≤2.2; (B) a silver powder having a tap density of not lower than 3.0 g/cm.sup.3, a specific surface area of not larger than 2.0 m.sup.2/g and an aspect ratio of 1 to 30; (C) an elemental gallium and/or gallium alloy having a melting point of 0 to 70° C. and being present at a mass ratio [Component (C)/{Component (B)+Component (C)}] of 0.001 to 0.1; and (D) a catalyst.

A polytetrafluoroethylene resin composition comprising 67 to 75 volume %, preferably 69 to 72 volume %, of a polytetrafluoroethylene resin and 33 to 25 volume %, preferably 31 to 28 volume %, of a filler having an average particle diameter of 45 to 80 μm, preferably 50 to 75 μm. The seal ring obtained from the polytetrafluoroethylene resin composition of the present invention can prevent the cut cross-sections of the seal ring abutting portion from being pressed by oil pressure and fixing to each other. Therefore, the seal ring is effectively used as an oil seal ring used as a sealing material applied to vehicle CVTs and power steering devices.

The present invention relates to a composite material obtained by in situ polymerization of a thermoplastic resin with additives with a fibrous material. More particularly the present invention relates to a polymeric composite material obtained by in-situ polymerization of a thermoplastic (meth)acrylic resin and a fibrous material utilizing additive technologies to improve properties such as surface properties, and its use, and processes for making such a composite material and manufactured mechanical or structured part or article comprising this polymeric composite material.

Provided is a resin composition having electrical conductivity and low water absorbency. The resin composition comprises a carbon fiber and a thermoplastic resin, the carbon fiber having a relative intensity ratio (I.sub.D/I.sub.G) of the peak intensity I.sub.D in a wavenumber range of 1,320 cm.sup.−1 to 1,370 cm.sup.−1 to the peak intensity I.sub.G in a wavenumber range of 1,560 cm.sup.−1 to 1,600 cm.sup.−1 of 0.6 or less in the Raman spectrum measured by microscopic Raman spectroscopy, the resin composition having a surface resistance value in a range of 1×10.sup.2 Ω to 1×10.sup.12 Ω.

A polymer composition comprising: (a) from 50% by volume to 99% by volume, preferably from 70% by volume to 95% by volume, of at least one homopolymer or copolymer of ethylene; (b) from 1% by volume to 50% by volume, preferably from 5% by volume to 30% by volume, of at least two fillers having different thermal conductivity; (c) from 100 ppm to 4000 ppm, preferably from 200 ppm to 3500 ppm of at least one fluoropolymer; the sum of (a)+(b) being 100. Said polymer composition can be used as a phase change material (PCM), in particular for thermal energy storage (TES), more in particular for the storage of solar energy.

A thermoplastic resin composition that contains, based on 100 mass parts for a total of (A) and (B), at least 20 mass parts but less than 50 mass parts of (A) a polyalkylene terephthalate resin and more than 50 mass parts and not more than 80 mass parts of (B) a polystyrene resin or a rubber-reinforced polystyrene resin, wherein an intrinsic viscosity (IV.sub.A) of the polyalkylene terephthalate resin (A) is 0.3 to 0.8 dl/g and a melt viscosity (η.sub.B) of the polystyrene resin or rubber-reinforced polystyrene resin (B) at 250° C. and 912 sec.sup.−1 is at least 80 Pa.Math.sec.