The present invention relates to a halogen-free epoxy resin composition, a prepreg, a laminate and a printed circuit board containing the same. The halogen-free epoxy resin composition comprises an epoxy resin and a curing agent. Taking the total equivalent amount of the epoxy groups in the epoxy resin as 1, the active groups in the curing agent which react with the epoxy groups have an equivalent amount of 0.5-0.95. By controlling the equivalent ratio of the epoxy groups in the epoxy resin to the active groups in the curing agent to be 0.5-0.95, the present invention ensures the Df value stability of prepregs under different curing temperature conditions while maintaining a low dielectric constant and a low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

A heat resistant thermoplastic resin composition and a molded article manufactured using the same. The heat resistant thermoplastic resin composition includes about 100 parts by weight of an aromatic vinyl compound; about 20 parts by weight to about 60 parts by weight of a polycarbonate resin; and about 30 parts by weight to about 60 parts by weight of an impact modifier. The heat resistant thermoplastic resin composition and a molded article manufactured using the same can have excellent properties in terms of impact resistance, heat resistance, and/or chemical resistance and can be eco-friendly due to low level of VOC emissions.

A heat resistant thermoplastic resin composition and a molded article manufactured using the same. The heat resistant thermoplastic resin composition includes about 100 parts by weight of an aromatic vinyl compound; about 20 parts by weight to about 60 parts by weight of a polycarbonate resin; and about 30 parts by weight to about 60 parts by weight of an impact modifier. The heat resistant thermoplastic resin composition and a molded article manufactured using the same can have excellent properties in terms of impact resistance, heat resistance, and/or chemical resistance and can be eco-friendly due to low level of VOC emissions.

The present invention relates to a styrene-based thermoplastic resin composition with improved flowability and, more specifically, a thermoplastic resin composition, which retains heat resistance and improved flowability by introducing a low-molecular weight styrene-acrylonitrile (SAN) resin into an acrylonitrile-butadiene-styrene (ABS) resin, which has enhanced heat resistance through the addition of a heat-resistant resin, and to a molded article into which the composition is molded. According to the resin composition, there can be obtained: a thermal resin composition, which has an improvement in the flowability of the heat-resistant ABS resin and retains non-deteriorating or favorable heat resistance and impact resistance; and a molded article.

The present invention relates to a styrene-based thermoplastic resin composition with improved flowability and, more specifically, a thermoplastic resin composition, which retains heat resistance and improved flowability by introducing a low-molecular weight styrene-acrylonitrile (SAN) resin into an acrylonitrile-butadiene-styrene (ABS) resin, which has enhanced heat resistance through the addition of a heat-resistant resin, and to a molded article into which the composition is molded. According to the resin composition, there can be obtained: a thermal resin composition, which has an improvement in the flowability of the heat-resistant ABS resin and retains non-deteriorating or favorable heat resistance and impact resistance; and a molded article.

The present invention relates to a halogen-free epoxy resin composition, a prepreg and a laminate containing the same. The halogen-free epoxy resin composition comprises 60 parts by weight of epoxy resin, from 15 to 28 parts by weight of benzoxazine resin, and from 10 to 20 parts by weight of styrene-maleic anhydride. The present invention discloses using from 15 to 28 parts by weight of benzoxazine resin and from 10 to 20 parts by weight of styrene-maleic anhydride to cure 60 parts by weight of epoxy resin, to ensure the Df stability of prepregs at different curing temperature conditions while maintaining low dielectric constant and low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

The present invention relates to a halogen-free epoxy resin composition, a prepreg and a laminate containing the same. The halogen-free epoxy resin composition comprises 60 parts by weight of epoxy resin, from 15 to 28 parts by weight of benzoxazine resin, and from 10 to 20 parts by weight of styrene-maleic anhydride. The present invention discloses using from 15 to 28 parts by weight of benzoxazine resin and from 10 to 20 parts by weight of styrene-maleic anhydride to cure 60 parts by weight of epoxy resin, to ensure the Df stability of prepregs at different curing temperature conditions while maintaining low dielectric constant and low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

The present invention relates to a halogen-free epoxy resin composition, a prepreg and a laminate containing the same. The halogen-free epoxy resin composition comprises 60 parts by weight of epoxy resin, from 15 to 28 parts by weight of benzoxazine resin, and from 10 to 20 parts by weight of styrene-maleic anhydride. The present invention discloses using from 15 to 28 parts by weight of benzoxazine resin and from 10 to 20 parts by weight of styrene-maleic anhydride to cure 60 parts by weight of epoxy resin, to ensure the Df stability of prepregs at different curing temperature conditions while maintaining low dielectric constant and low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

The invention is directed to a resin composition containing polycarbonate, reinforced fibers and a compatibilizer having a reactive cyclic group, a resin molded article containing polycarbonate, reinforced fibers and a compatibilizer having a reactive cyclic group, and a method for preparing a resin composition including molten kneading polycarbonate, reinforced fibers and compatibilizer having a reactive cyclic group.

The invention is directed to a resin composition containing polycarbonate, reinforced fibers and a compatibilizer having a reactive cyclic group, a resin molded article containing polycarbonate, reinforced fibers and a compatibilizer having a reactive cyclic group, and a method for preparing a resin composition including molten kneading polycarbonate, reinforced fibers and compatibilizer having a reactive cyclic group.