A circuit board includes an insulating made by a low dielectric resin composition includes a low dielectric resin containing acid anhydride, an epoxy resin, polyphenylene ether resin with vinyl and active esters, maleic acid liquid polybutadiene, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained.

A circuit board includes an insulating made by a low dielectric resin composition includes a low dielectric resin containing acid anhydride, an epoxy resin, polyphenylene ether resin with vinyl and active esters, maleic acid liquid polybutadiene, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained.

Provided is a thermoplastic resin composition [X] for reduction of squeaking noises containing a rubber-reinforced vinyl resin [A] obtained by polymerizing a vinyl monomer [b1] in the presence of an ethylene-α-olefin rubber polymer [a1] having Tm (melting point) of 0° C. or higher, wherein an amount of silicon contained in the thermoplastic resin composition [X] is 0.15% by mass or less based on 100% by mass of the thermoplastic resin composition [X]. According to the present invention, a structure can be provided, which is characterized in that squeaking noises that are generated when members rub against each other is remarkably reduced, that an effect of reducing squeaking noises is maintained without deterioration even when placed under high temperature for a long time, and that impact resistance and molded appearance are superior.

Provided is a thermoplastic resin composition [X] for reduction of squeaking noises containing a rubber-reinforced vinyl resin [A] obtained by polymerizing a vinyl monomer [b1] in the presence of an ethylene-α-olefin rubber polymer [a1] having Tm (melting point) of 0° C. or higher, wherein an amount of silicon contained in the thermoplastic resin composition [X] is 0.15% by mass or less based on 100% by mass of the thermoplastic resin composition [X]. According to the present invention, a structure can be provided, which is characterized in that squeaking noises that are generated when members rub against each other is remarkably reduced, that an effect of reducing squeaking noises is maintained without deterioration even when placed under high temperature for a long time, and that impact resistance and molded appearance are superior.

The present invention provides a polyformaldehyde composite material, in parts by weight, including the following components: 70 to 95 parts of a polyformaldehyde; 5 to 20 parts of a SEBS; wherein, the SEBS is acid modified or amine modified. Due to modification by acid or amine, and presence of a polystyrene segment, a compatibility of the SEBS with the polyformaldehyde reduces because of a steric hindrance effect, which reduces an ability of a POM molecular chain to arrange regularly. When injection molded into a product or template, an incompatibility of the material itself will form a micro-rough effect on a surface of the material. When an incident light reaches the micro-rough surface, a reflection direction of the light will change and thus a diffuse reflection occurs, and a low-gloss material is obtained.

The present invention provides a polyformaldehyde composite material, in parts by weight, including the following components: 70 to 95 parts of a polyformaldehyde; 5 to 20 parts of a SEBS; wherein, the SEBS is acid modified or amine modified. Due to modification by acid or amine, and presence of a polystyrene segment, a compatibility of the SEBS with the polyformaldehyde reduces because of a steric hindrance effect, which reduces an ability of a POM molecular chain to arrange regularly. When injection molded into a product or template, an incompatibility of the material itself will form a micro-rough effect on a surface of the material. When an incident light reaches the micro-rough surface, a reflection direction of the light will change and thus a diffuse reflection occurs, and a low-gloss material is obtained.

A binder composition for a non-aqueous secondary battery electrode contains a particulate polymer A and a particulate polymer B. The particulate polymer A is a block copolymer including an aromatic vinyl monomer unit and an aliphatic conjugated diene monomer unit having a carbon number of 4 or more. The particulate polymer B is a random copolymer including a (meth)acrylic acid ester monomer unit in a proportion of not less than 20.0 mass % and not more than 80.0 mass %.

A thermoplastic polyolefin (TPO) powder is provided. The TPO powder includes an olefin-block copolymer (OBC), polypropylene copolymer, an adhesion promoter, a sulfur-free stabilizer additive, a composition including a non-migratory hindered amine light stabilizers (HALS) and a color pigment, and talc. A TPO material formed from the TPO powder and methods of making the TPO powder and TPO material are also provided.

A thermoplastic polyolefin (TPO) powder is provided. The TPO powder includes an olefin-block copolymer (OBC), polypropylene copolymer, an adhesion promoter, a sulfur-free stabilizer additive, a composition including a non-migratory hindered amine light stabilizers (HALS) and a color pigment, and talc. A TPO material formed from the TPO powder and methods of making the TPO powder and TPO material are also provided.

Thermoplastic moulding composition consisting of (A) 51 to 69.9 wt % of polyamide elastomer; (B) 15 to 38 wt % of ethylene-α-olefin copolymer; (C) 3 to 25 wt % of polyamide selected from the group consisting of: PA6, PA66, PA6/66, PA610, PA612, PA614, PA616, PA6/610, PA66/610 or mixtures thereof; (D) 0.1 to 2.0 wt % of heat stabilizers based on copper and/or iodide, organic stabilizers or a mixture thereof; (E) 0 to 5.0 wt % of additives, different from (A) to (D);
where the sum of (A) to (E) makes 100 wt % of the total moulding composition, and with the proviso that the sum of (B) and (C) is in the range from 30 to 48 wt % based on the total moulding composition.