This tire laminate comprises a film of a thermoplastic resin composition and a layer of a rubber composition laminated over said film, and is characterized in that the rubber composition contains at least one type of rubber component, a condensate of formaldehyde and the compound represented by formula (1) (R.sup.1 to R.sup.5 in the formula are defined in the specification), at least one type of methylene donor and a vulcanizing agent, and in that there are 0.5-20 parts by mass of the condensate per total 100 parts by mass of the at least one type of rubber component, there are 0.25-200 parts by mass of the at least one type of methylene donor per total 100 parts by mass of the at least one type of rubber component, the mass ratio of the at least one type of methylene donor and the condensate is 0.5:1-10:1, and, based on the total amount of the at least one type of rubber component, the at least one type of rubber component includes 4-40 parts by mass of a nitrile rubber that includes a carboxylic group in at least one side chain or terminal. This tire laminate exhibits improved adhesive strength between the film of the thermoplastic resin composition and the layer of the rubber composition.

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A modified novolak phenolic resin is obtained by reacting a novolak phenolic resin containing at least 50 wt % of p-cresol with a crosslinker. This method increases the molecular weight of the existing novolak phenolic resin containing at least 50 wt % of p-cresol to such a level that the resulting modified novolak phenolic resin has heat resistance enough for the photoresist application.

A modified novolak phenolic resin is obtained by reacting a novolak phenolic resin containing at least 50 wt % of p-cresol with a crosslinker. This method increases the molecular weight of the existing novolak phenolic resin containing at least 50 wt % of p-cresol to such a level that the resulting modified novolak phenolic resin has heat resistance enough for the photoresist application.

A thermosetting resin composition according to the present invention contains: purified lignin obtained by treating a herbaceous biomass as a raw material under the following conditions in a first solvent that is a mixed solvent of water and at least one type of alcohol selected from aliphatic alcohols having 4 to 8 carbon atoms, subsequently removing the alcohol from the alcohol phase that is separated at the temperature at which the first solvent separates into two phases to give lignin, adding a second solvent that is an organic solvent alone or a mixed solvent of the organic solvent and water to the resultant lignin, and removing the second solvent from the solution in which the lignin is dissolved in the second solvent; and a lignin-reactive compound that has a functional group capable of reacting with the purified lignin. Condition A: the concentration of the raw material to be charged into the mixed solvent is 1% by mass or more and 50% by mass or less. Condition B: the treatment temperature is 100° C. or higher and 350° C. or lower. Condition C: the treatment time is 0.1 hours or more and 10 hours or less.

A thermosetting resin composition according to the present invention contains: purified lignin obtained by treating a herbaceous biomass as a raw material under the following conditions in a first solvent that is a mixed solvent of water and at least one type of alcohol selected from aliphatic alcohols having 4 to 8 carbon atoms, subsequently removing the alcohol from the alcohol phase that is separated at the temperature at which the first solvent separates into two phases to give lignin, adding a second solvent that is an organic solvent alone or a mixed solvent of the organic solvent and water to the resultant lignin, and removing the second solvent from the solution in which the lignin is dissolved in the second solvent; and a lignin-reactive compound that has a functional group capable of reacting with the purified lignin. Condition A: the concentration of the raw material to be charged into the mixed solvent is 1% by mass or more and 50% by mass or less. Condition B: the treatment temperature is 100° C. or higher and 350° C. or lower. Condition C: the treatment time is 0.1 hours or more and 10 hours or less.

A thermosetting resin composition according to the present invention contains: purified lignin obtained by treating a herbaceous biomass as a raw material under the following conditions in a first solvent that is a mixed solvent of water and at least one type of alcohol selected from aliphatic alcohols having 4 to 8 carbon atoms, subsequently removing the alcohol from the alcohol phase that is separated at the temperature at which the first solvent separates into two phases to give lignin, adding a second solvent that is an organic solvent alone or a mixed solvent of the organic solvent and water to the resultant lignin, and removing the second solvent from the solution in which the lignin is dissolved in the second solvent; and a lignin-reactive compound that has a functional group capable of reacting with the purified lignin. Condition A: the concentration of the raw material to be charged into the mixed solvent is 1% by mass or more and 50% by mass or less. Condition B: the treatment temperature is 100° C. or higher and 350° C. or lower. Condition C: the treatment time is 0.1 hours or more and 10 hours or less.

A fiber reinforced thermoplastic resin molded article includes (A) carbon fibers, (B) graphite and (C) a thermoplastic resin, wherein the carbon fibers (A), the graphite (B) and the thermoplastic resin (C) are contained in amounts of 1 to 30 parts by weight, 1 to 40 parts by weight and 30 to 98 parts by weight, respectively, relative to 100 parts by weight, of the carbon fibers (A), the graphite (B) and the thermoplastic resin (C), the weight average fiber length of the carbon fibers (A) is 0.3 to 3 mm and the specific gravity of the molded article is 1.1 to 1.9 g/cm.sup.3. The fiber reinforced thermoplastic resin molded article has excellent bending strength and heat conductivity.

The present invention relates to an adhesive formulation in the form of an aqueous dispersion with a solids content of 10 to 40% by weight relative to the adhesive formulation, for the treatment of reinforcing inserts for the production of reinforced polymer products, 100% by weight of the solids containing a) 1 to 20% by weight of a bisphenol A epoxy novolak, b) 0 to 20% by weight of an entirely or partially blocked isocyanate, c) 60 to 92% by weight of a resorcinol formaldehyde latex (RFL).

The present invention relates to an adhesive formulation in the form of an aqueous dispersion with a solids content of 10 to 40% by weight relative to the adhesive formulation, for the treatment of reinforcing inserts for the production of reinforced polymer products, 100% by weight of the solids containing a) 1 to 20% by weight of a bisphenol A epoxy novolak, b) 0 to 20% by weight of an entirely or partially blocked isocyanate, c) 60 to 92% by weight of a resorcinol formaldehyde latex (RFL).

A resin composition for semiconductor encapsulation, containing (A) an epoxy resin, (B) a phenolic resin-based curing agent, (C) an inorganic filler, and (D) amorphous carbon, wherein the amorphous carbon of the component (D) contains 30 atomic % or more of an SP.sup.3 structure and 55 atomic % or less of an SP.sup.2 structure.