A curable photosensitive resin composition which can be cured at a relatively low temperature, has excellent developability and adhesion to a support, and a cured product that realizes low dielectric constant properties. A curable photosensitive resin composition containing a polyimide resin (A) which is a reaction product of monomer groups containing an aromatic tetracarboxylic anhydride (a1) and a diamine (a2) containing a dimer diamine, maleimides (B), and a polyfunctional polymerizable compound (C) having two or more ethylenic double bonds other than the component (A) and the component (B), a cured product, a photosensitive element, a resist pattern, a method of producing a resist pattern, a semiconductor device and an electronic device.

The present invention relates to a raw material for a bio-3D printing support and, more specifically, to a novel type bio-3D printing support material for tissue engineering, a method for manufacturing a three-dimensional support by using the same, and a 3D-printing three-dimensional support manufactured thereby, the raw material: being non-toxic and implementing excellent biocompatibility and cell adhesion since a raw material for a tissue engineering support (scaffold) produced by bio-3D printing technology, a specific fatty acid and a fatty alcohol (phase change material) derived from a natural source having a low melting point and a low molecular weight are used; and, in particular, allowing a phase change to easily occur at a temperature similar to body temperature such that a process is simplified and cells or growth factors can be mixed.

The present invention relates to a raw material for a bio-3D printing support and, more specifically, to a novel type bio-3D printing support material for tissue engineering, a method for manufacturing a three-dimensional support by using the same, and a 3D-printing three-dimensional support manufactured thereby, the raw material: being non-toxic and implementing excellent biocompatibility and cell adhesion since a raw material for a tissue engineering support (scaffold) produced by bio-3D printing technology, a specific fatty acid and a fatty alcohol (phase change material) derived from a natural source having a low melting point and a low molecular weight are used; and, in particular, allowing a phase change to easily occur at a temperature similar to body temperature such that a process is simplified and cells or growth factors can be mixed.

A resin composition includes (A) a polyolefin epoxy resin, (B) an epoxy resin having a condensed polycyclic aromatic hydrocarbon, (C) a nitrogen-containing novolak resin, and (D) an inorganic filler, in which an epoxy equivalent of the (A) component is 200 g/eq. or more, a nitrogen content in the (C) component is 13% by mass or more and/or the (C) component has a cresol novolak structure, and a content of the (D) component is 60% by mass or more on the basis of 100% by mass of non-volatile components in the resin composition.

A resin composition includes (A) a polyolefin epoxy resin, (B) an epoxy resin having a condensed polycyclic aromatic hydrocarbon, (C) a nitrogen-containing novolak resin, and (D) an inorganic filler, in which an epoxy equivalent of the (A) component is 200 g/eq. or more, a nitrogen content in the (C) component is 13% by mass or more and/or the (C) component has a cresol novolak structure, and a content of the (D) component is 60% by mass or more on the basis of 100% by mass of non-volatile components in the resin composition.

An adhesive composition, and a coverlay film and a printed circuit board that include the adhesive composition are disclosed. The adhesive composition includes: (a) an epoxy resin; and (b) a binder resin including epoxidized polybutadiene rubber and at least two kinds of rubber. The adhesive composition can form an adhesive layer superb in terms of adhesiveness, fluidity, filling properties (landfilling), migration resistance, heat resistance, flame retardancy, low elongation, and flexibility.

An adhesive composition, and a coverlay film and a printed circuit board that include the adhesive composition are disclosed. The adhesive composition includes: (a) an epoxy resin; and (b) a binder resin including epoxidized polybutadiene rubber and at least two kinds of rubber. The adhesive composition can form an adhesive layer superb in terms of adhesiveness, fluidity, filling properties (landfilling), migration resistance, heat resistance, flame retardancy, low elongation, and flexibility.

Provided is a resin composition, a molded body of which is an electromagnetic wave absorber. An imaginary part (ε″) of a complex dielectric constant at 25° C. and 10 GHz and a volume resistivity (ρv) at 25° C. of the molded body satisfy the relational expression (1) below, and the imaginary part (ε″) is greater than 1.25. 20<(log ρv)×ε″<600 (1)

Provided is a resin composition, a molded body of which is an electromagnetic wave absorber. An imaginary part (ε″) of a complex dielectric constant at 25° C. and 10 GHz and a volume resistivity (ρv) at 25° C. of the molded body satisfy the relational expression (1) below, and the imaginary part (ε″) is greater than 1.25. 20<(log ρv)×ε″<600 (1)

The present invention relates to a halogen-free epoxy resin composition, a prepreg, a laminate and a printed circuit board containing the same. The halogen-free epoxy resin composition comprises an epoxy resin and a curing agent. Taking the total equivalent amount of the epoxy groups in the epoxy resin as 1, the active groups in the curing agent which react with the epoxy groups have an equivalent amount of 0.5-0.95. By controlling the equivalent ratio of the epoxy groups in the epoxy resin to the active groups in the curing agent to be 0.5-0.95, the present invention ensures the Df value stability of prepregs under different curing temperature conditions while maintaining a low dielectric constant and a low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.