A curable epoxy composition comprising an epoxy compound (A), active ester compound (B), and triazine structure-containing phenol resin (C), wherein the epoxy compound (A) includes a polyvalent epoxy compound (A-1) which has an alicyclic condensed polyvalent structure in a ratio of content of 30 wt % or more is provided.

A curable epoxy composition comprising an epoxy compound (A), active ester compound (B), and triazine structure-containing phenol resin (C), wherein the epoxy compound (A) includes a polyvalent epoxy compound (A-1) which has an alicyclic condensed polyvalent structure in a ratio of content of 30 wt % or more is provided.

Provided is a curable composition for a polymer electrolyte, including: a component (A): a radical polymerizable compound having a (meth)acryloyl group, a component (B): a compound having, in one molecule, an epoxy group and a skeleton of at least one selected from the group consisting of polybutadiene, polyisoprene, hydrogenated polybutadiene, and hydrogenated polyisoprene, and a component (C): a radical polymerization initiator, in which a content of each of the components (A) to (C) based on the entire composition is as follows, the component (A): from 30 to 98.9% by mass the component (B): from 1 to 40% by mass, and the component (C): from 0.1 to 15% by mass.

Provided is a curable composition for a polymer electrolyte, including: a component (A): a radical polymerizable compound having a (meth)acryloyl group, a component (B): a compound having, in one molecule, an epoxy group and a skeleton of at least one selected from the group consisting of polybutadiene, polyisoprene, hydrogenated polybutadiene, and hydrogenated polyisoprene, and a component (C): a radical polymerization initiator, in which a content of each of the components (A) to (C) based on the entire composition is as follows, the component (A): from 30 to 98.9% by mass the component (B): from 1 to 40% by mass, and the component (C): from 0.1 to 15% by mass.

A resin composition including: a magnetic fluid that includes magnetic particles, a dispersant, and a dispersion medium; and a resin or precursor thereof that includes, in a molecule thereof, at least one partial structure selected from the group consisting of a diene skeleton, a silicone skeleton, a urethane skeleton, a 4- to 7-membered ring lactone skeleton, an alkyl group having from 6 to 30 carbon atoms and an alkylene group having from 6 to 30 carbon atoms, a production method thereof, a resin composition molded body obtained by using the resin composition, and a production method thereof.

A rubber composition is based on at least one predominant elastomer comprising epoxide functional groups, silica as predominant reinforcing filler, an agent for covering the silica, and a system for crosslinking the elastomer comprising an imidazole and a polycarboxylic acid of general formula (I): ##STR00001##
and an imidazole of general formula (II): ##STR00002##

A rubber composition is based on at least one predominant elastomer comprising epoxide functional groups, silica as predominant reinforcing filler, an agent for covering the silica, and a system for crosslinking the elastomer comprising an imidazole and a polycarboxylic acid of general formula (I): ##STR00001##
and an imidazole of general formula (II): ##STR00002##

Disclosed is a resin composition, comprising the following components: (A) 100 parts by weight of an epoxy resin; (B) 10 to 60 parts by weight of a diamino diphenyl ether type benzoxazine resin having a softening point of 40 C. to 140 C.; (C) 10 to 40 parts by weight of a co-hardener; and (D) 10 to 40 parts by weight of a flame retardant which comprises (d1) a high melting point flame retardant with a melting point of greater than 260 C. or (d2) a metal phosphinate flame retardant, wherein the metal is selected from Group IIIA elements. Also disclosed is an article of manufacture obtained from the resin composition and a use thereof. Accordingly, the demands of high frequency application can be met, and a balance of low thermal expansion, high thermal resistance and low warpage in the system can be struck.

The present invention relates to a halogen-free epoxy resin composition, a prepreg, a laminate and a printed circuit board containing the same. The halogen-free epoxy resin composition comprises an epoxy resin and a curing agent. Taking the total equivalent amount of the epoxy groups in the epoxy resin as 1, the active groups in the curing agent which react with the epoxy groups have an equivalent amount of 0.5-0.95. By controlling the equivalent ratio of the epoxy groups in the epoxy resin to the active groups in the curing agent to be 0.5-0.95, the present invention ensures the Df value stability of prepregs under different curing temperature conditions while maintaining a low dielectric constant and a low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

The present invention relates to a halogen-free epoxy resin composition, a prepreg, a laminate and a printed circuit board containing the same. The halogen-free epoxy resin composition comprises an epoxy resin and a curing agent. Taking the total equivalent amount of the epoxy groups in the epoxy resin as 1, the active groups in the curing agent which react with the epoxy groups have an equivalent amount of 0.5-0.95. By controlling the equivalent ratio of the epoxy groups in the epoxy resin to the active groups in the curing agent to be 0.5-0.95, the present invention ensures the Df value stability of prepregs under different curing temperature conditions while maintaining a low dielectric constant and a low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.