A hardmask composition, a hardmask layer, and a method of forming patterns, the composition including a solvent; and a polymer that includes a substituted biphenylene structural unit, wherein one phenylene of the biphenylene of the substituted biphenylene structural unit is substituted with at least one of a hydroxy-substituted C6 to C30 aryl group, and a hydroxy-substituted C3 to C30 heteroaryl group.

A hardmask composition, a hardmask layer, and a method of forming patterns, the composition including a solvent; and a polymer that includes a substituted biphenylene structural unit, wherein one phenylene of the biphenylene of the substituted biphenylene structural unit is substituted with at least one of a hydroxy-substituted C6 to C30 aryl group, and a hydroxy-substituted C3 to C30 heteroaryl group.

The present invention provides with an electron-accepting compound having a structure of the following formula (1): ##STR00001##

The present invention provides with an electron-accepting compound having a structure of the following formula (1): ##STR00001##

A method of forming a resist pattern, including forming a resist composition using a resist film; exposing the resist film; and alkali-developing the exposed resist film to form a positive-tone resist pattern, wherein the resist composition includes a first resin component and a second resin component which satisfies a specific relationship DR.sub.MIX<DR.sub.P1 and DR.sub.MIX<DR.sub.P2, wherein DR.sub.P1 is the dissolution rate of the first resin component (P1) in an alkali developing solution, DR.sub.P2 is the dissolution rate of the second resin component (P2) in an alkali developing solution, and DR.sub.MIX is the dissolution rate of a mixed resin of the first resin component (P1) and the second resin component (P2).

A method of forming a resist pattern, including forming a resist composition using a resist film; exposing the resist film; and alkali-developing the exposed resist film to form a positive-tone resist pattern, wherein the resist composition includes a first resin component and a second resin component which satisfies a specific relationship DR.sub.MIX<DR.sub.P1 and DR.sub.MIX<DR.sub.P2, wherein DR.sub.P1 is the dissolution rate of the first resin component (P1) in an alkali developing solution, DR.sub.P2 is the dissolution rate of the second resin component (P2) in an alkali developing solution, and DR.sub.MIX is the dissolution rate of a mixed resin of the first resin component (P1) and the second resin component (P2).

A method for manufacturing a three-dimensional (3D) object with an additive manufacturing system, comprising a step consisting in printing layers of the 3D object from the part material comprising a polymeric component comprising, based on the total weight of the polymeric component: from 5 to 95 wt. % of at least one polymer (P1) comprising at least 50 mol. % of recurring units (R1) consisting of an arylene group comprising at least one benzene ring, each recurring unit (R1) being bound to each other through C—C bonds, wherein the recurring units (R1) are such that, based on the total number of moles of recurring units (R1):less than 90 mol. % are rigid rod-forming arylene units (R1-a), and at least 10 mol. % are kink-forming arylene units (R1-b), and from 5 to 95 wt. % of at least one polymer (P2), having a glass transition temperature (Tg) between 140° C. and 265° C., and no melting peak, as measured by differential scanning calorimetry (DSC) according to ASTM D3418.

A method for manufacturing a three-dimensional (3D) object with an additive manufacturing system, comprising a step consisting in printing layers of the 3D object from the part material comprising a polymeric component comprising, based on the total weight of the polymeric component: from 5 to 95 wt. % of at least one polymer (P1) comprising at least 50 mol. % of recurring units (R1) consisting of an arylene group comprising at least one benzene ring, each recurring unit (R1) being bound to each other through C—C bonds, wherein the recurring units (R1) are such that, based on the total number of moles of recurring units (R1):less than 90 mol. % are rigid rod-forming arylene units (R1-a), and at least 10 mol. % are kink-forming arylene units (R1-b), and from 5 to 95 wt. % of at least one polymer (P2), having a glass transition temperature (Tg) between 140° C. and 265° C., and no melting peak, as measured by differential scanning calorimetry (DSC) according to ASTM D3418.

There are provided a naphthol resin and an epoxy resin that impart characteristics such as high heat resistance, a low dielectric loss tangent, and a low coefficient of thermal expansion (CTE), and an epoxy resin composition including the naphthol resin or the epoxy resin as an essential component, and cured products thereof. A naphthol resin which is represented by the following formula: ##STR00001##
where R.sup.1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and n represents the number of repetitions and is a number of 2 to 10, and in which, in terms of area ratio in GPC measurement, a ratio of components for which n=6 or more is 15% or more, and a ratio of components for which n=1 in GPC is 30% or less, and a hydroxy group equivalent is 260 to 400 g/eq.

A method for synthesizing a poly(phenylene) with high ion selectivity comprises dissolving an alkyl halide poly(phenylene) in a polar aprotic solvent to form a nonaqueous solution and adding an anhydrous nucleophile to the nonaqueous solution to replace the halide of the alkyl halide poly(phenylene) with a cationic group of the nucleophile. The poly(phenylene) can be used in anion exchange membranes.