The current disclosure is directed to an impact resistant material made from a novel melanin composite. It has been found that using these composites allows for the production of effective ballistic protection and blast containment materials.

A light emitting element includes a first semiconductor layer; an active layer on the first semiconductor layer; a second semiconductor layer on the active layer; an insulating film surrounding an outer peripheral surface of each of the first semiconductor layer, the active layer and the second semiconductor layer; and a polymer film including a polymer chain and on at least a portion of a surface of the insulating film.

A light emitting element includes a first semiconductor layer; an active layer on the first semiconductor layer; a second semiconductor layer on the active layer; an insulating film surrounding an outer peripheral surface of each of the first semiconductor layer, the active layer and the second semiconductor layer; and a polymer film including a polymer chain and on at least a portion of a surface of the insulating film.

A resin composition includes 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin; 15 parts by weight to 40 parts by weight of a hydrogenated styrene-butadiene-styrene triblock copolymer; 1 part by weight to 20 parts by weight of a compound of Formula (1); and 0.001 part by weight to 0.5 part by weight of a compound of Formula (2), a compound of Formula (3), a compound of Formula (4) or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board. ##STR00001##

A resin composition includes 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin; 15 parts by weight to 40 parts by weight of a hydrogenated styrene-butadiene-styrene triblock copolymer; 1 part by weight to 20 parts by weight of a compound of Formula (1); and 0.001 part by weight to 0.5 part by weight of a compound of Formula (2), a compound of Formula (3), a compound of Formula (4) or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board. ##STR00001##

The electrochemical energy conversion system include an anode, a cathode, and a proton exchange membrane disposed between the anode and the cathode. The proton exchange membrane includes a polymer having a hard block polymer, a soft block polymer, and one or more hydrophilic functional groups attached to the soft block polymer. The glass transition temperature of the hard block polymer is higher than a glass transition temperature of the soft block polymer, such that the hard block polymer is non-elastic and the soft block polymer is elastic at a desired operating temperature. The hydrophilic functional groups are attached to the soft block polymer via a thiol-ene reaction to modify double bonds in the soft block polymer. The swellable functional groups are selectively connected to the soft domains of the block copolymers, so that when the membrane swells (under hydration or gas adsorption), the stress is effectively absorbed by the soft domain and the impact on overall mechanical properties is minor, resulting in more durable membranes.

The electrochemical energy conversion system include an anode, a cathode, and a proton exchange membrane disposed between the anode and the cathode. The proton exchange membrane includes a polymer having a hard block polymer, a soft block polymer, and one or more hydrophilic functional groups attached to the soft block polymer. The glass transition temperature of the hard block polymer is higher than a glass transition temperature of the soft block polymer, such that the hard block polymer is non-elastic and the soft block polymer is elastic at a desired operating temperature. The hydrophilic functional groups are attached to the soft block polymer via a thiol-ene reaction to modify double bonds in the soft block polymer. The swellable functional groups are selectively connected to the soft domains of the block copolymers, so that when the membrane swells (under hydration or gas adsorption), the stress is effectively absorbed by the soft domain and the impact on overall mechanical properties is minor, resulting in more durable membranes.

The present disclosure relates to a curable pressure sensitive adhesive composition comprising: a) a butyl rubber component in an amount greater than 40 wt %; b) a tackifier in an amount greater than 1 wt %; c) a multifunctional crosslinking agent comprising at least two nitroso functional groups; and d) optionally, a hydrocarbon plasticizer; wherein the weight percentages are based on the total weight of the curable pressure sensitive adhesive composition. In another aspect, the present disclosure is directed to a method for protecting an electronic device or an electronic component from moisture and air permeation, wherein the method comprises the step of using a pressure sensitive adhesive composition as described above. According to still another aspect, the present disclosure is directed to the use of a pressure sensitive adhesive composition as described above for manufacturing an electronic device.

The present disclosure relates to a curable pressure sensitive adhesive composition comprising: a) a butyl rubber component in an amount greater than 40 wt %; b) a tackifier in an amount greater than 1 wt %; c) a multifunctional crosslinking agent comprising at least two nitroso functional groups; and d) optionally, a hydrocarbon plasticizer; wherein the weight percentages are based on the total weight of the curable pressure sensitive adhesive composition. In another aspect, the present disclosure is directed to a method for protecting an electronic device or an electronic component from moisture and air permeation, wherein the method comprises the step of using a pressure sensitive adhesive composition as described above. According to still another aspect, the present disclosure is directed to the use of a pressure sensitive adhesive composition as described above for manufacturing an electronic device.

Provided is a polymer of the formula: ##STR00001##
and compositions comprising the same. The polymers comprise a cyclic unsaturated group (Z.sup.3) within the siloxane polymer backbone. The polymers have been found to exhibit good thermal conductivity and may find utility in a variety of applications.