In an embodiment is provided a polymer that includes a plurality of N-J-N or N—C—S repeating units, wherein each J is independently a carbon atom, an alkyl group, or an aryl group; a plurality of hydrophilic groups bonded with the repeating units; and a plurality of hydrophobic groups bonded with the hydrophilic groups and the repeating units. In another embodiment is provided hydrogels of such polymers. The hydrogels may be used as delivery vehicles for various payloads. In another embodiment is provided methods of forming such polymers.

A thermosetting resin composition, which constitutes at least a part of a heat-dissipating insulating member interposed between a heat-generating body and a heat-dissipating body, includes (A) an epoxy resin, (B) a thermosetting resin (excluding epoxy resin (A)), (C) a phenoxy resin having a mesogenic structure in the molecule, (D) thermally conductive particles, and (E) an organosiloxane compound.

A thermosetting resin composition, which constitutes at least a part of a heat-dissipating insulating member interposed between a heat-generating body and a heat-dissipating body, includes (A) an epoxy resin, (B) a thermosetting resin (excluding epoxy resin (A)), (C) a phenoxy resin having a mesogenic structure in the molecule, (D) thermally conductive particles, and (E) an organosiloxane compound.

A resin composition is useful for preparing an article such as a prepreg, a resin film, a laminate or a printed circuit board. The resin composition includes a benzoxazine resin of Formula (1) and a maleimide resin. The article made from the resin composition has high thermal resistance, low dielectric properties and high dimensional stability and meets the processability requirements of printed circuit boards involving multiple lamination processes and multiple assembly operations. ##STR00001##

A resin composition is useful for preparing an article such as a prepreg, a resin film, a laminate or a printed circuit board. The resin composition includes a benzoxazine resin of Formula (1) and a maleimide resin. The article made from the resin composition has high thermal resistance, low dielectric properties and high dimensional stability and meets the processability requirements of printed circuit boards involving multiple lamination processes and multiple assembly operations. ##STR00001##

Compositions and methods for amorphous high temperature polyketone polymers incorporating 2H-benzimidazol-2-one with dihalobenzophenone and bis(halobenzoyl)benzene as comonomer units are described herein. The polyketones polymers have advantageous properties, particularly in terms of high glass transition temperatures (T.sub.g), inherently flame resistance, good mechanical properties at elevated temperature, chemical resistance and dimensional stability in wet environment. The polymers are suitable for manufacturing high temperature molded systems and other articles of manufacture via injection molding, extrusion, compression molding, coating, blow molding, thermoforming, rotational molding and additive manufacturing.

Compositions and methods for amorphous high temperature polyketone polymers incorporating 2H-benzimidazol-2-one with dihalobenzophenone and bis(halobenzoyl)benzene as comonomer units are described herein. The polyketones polymers have advantageous properties, particularly in terms of high glass transition temperatures (T.sub.g), inherently flame resistance, good mechanical properties at elevated temperature, chemical resistance and dimensional stability in wet environment. The polymers are suitable for manufacturing high temperature molded systems and other articles of manufacture via injection molding, extrusion, compression molding, coating, blow molding, thermoforming, rotational molding and additive manufacturing.

A thermosetting resin material, a prepreg, and a metal substrate are provided. The thermosetting resin material includes a resin composition and inorganic fillers. The resin composition includes: 10 wt % to 30 wt % of a polyphenylene ether resin, 40 wt % to 60 wt % of a cyanate resin, and 20 wt % to 40 wt % of a bismaleimide resin. The inorganic fillers undergo a surface modification process to have at least one of an acryl group and an ethylene group.

A thermosetting resin material, a prepreg, and a metal substrate are provided. The thermosetting resin material includes a resin composition and inorganic fillers. The resin composition includes: 10 wt % to 30 wt % of a polyphenylene ether resin, 40 wt % to 60 wt % of a cyanate resin, and 20 wt % to 40 wt % of a bismaleimide resin. The inorganic fillers undergo a surface modification process to have at least one of an acryl group and an ethylene group.

A curable resin composition including a first bismaleimide compound, a second bismaleimide compound which is different from the first bismaleimide compound, and a cyanate ester monomer. A liquid processible bismaleimide-triazine resin is provided by curing the resin composition. A method of preparing the liquid processible bismaleimide-triazine resin is also disclosed.