Provided is a cured product of a resin composition including a (meth)acrylate compound and a compound having at least one thiol group, wherein the content of the compound having at least one thiol group in the cured product is 30 mass % or less, and wherein the cured product has a secondary dispersion characteristic of 0.65 or more.

Provided is a cured product of a resin composition including a (meth)acrylate compound and a compound having at least one thiol group, wherein the content of the compound having at least one thiol group in the cured product is 30 mass % or less, and wherein the cured product has a secondary dispersion characteristic of 0.65 or more.

Provided is an electrophotographic belt having an endless shape including a base layer, wherein the base layer includes a polyimide film containing polyimide serving as a binder resin and a carbon nanotube, wherein the polyimide has an imidization ratio of 80% or more, wherein the carbon nanotube has at least one resin selected from the group consisting of: polyphenylsulfone; polysulfone; and polyethersulfone present on at least part of a surface thereof. The base layer has a tensile strength of 200 MPa or more in each of a peripheral direction thereof and a direction perpendicular to the peripheral direction.

Provided is an electrophotographic belt having an endless shape including a base layer, wherein the base layer includes a polyimide film containing polyimide serving as a binder resin and a carbon nanotube, wherein the polyimide has an imidization ratio of 80% or more, wherein the carbon nanotube has at least one resin selected from the group consisting of: polyphenylsulfone; polysulfone; and polyethersulfone present on at least part of a surface thereof. The base layer has a tensile strength of 200 MPa or more in each of a peripheral direction thereof and a direction perpendicular to the peripheral direction.

An epoxy resin composition including components (A), (B), (C) and (D); wherein a content of the component (A) is 60 to 90 parts by mass, and a content of the component (B) is 10 to 40 parts by mass, with respect to epoxy resins; the epoxy resin composition has a characteristic that, when cured and formed into a cured product, the cured product has a glass transition temperature of 200° C. or higher; and a viscosity at 100° C. of the resin composition is 5 to 35 Pa.Math.s, wherein Component (A) is an aromatic epoxy resin having at least 3 glycidyl groups in one molecule, Component (B) is an aromatic epoxy resin having two glycidyl groups in one molecule, Component (C) is an aromatic polysulfone resin having a reduced viscosity of 0.18 to 0.30 dl/g; and Component (D) is an aromatic amine compound.

An epoxy resin composition including components (A), (B), (C) and (D); wherein a content of the component (A) is 60 to 90 parts by mass, and a content of the component (B) is 10 to 40 parts by mass, with respect to epoxy resins; the epoxy resin composition has a characteristic that, when cured and formed into a cured product, the cured product has a glass transition temperature of 200° C. or higher; and a viscosity at 100° C. of the resin composition is 5 to 35 Pa.Math.s, wherein Component (A) is an aromatic epoxy resin having at least 3 glycidyl groups in one molecule, Component (B) is an aromatic epoxy resin having two glycidyl groups in one molecule, Component (C) is an aromatic polysulfone resin having a reduced viscosity of 0.18 to 0.30 dl/g; and Component (D) is an aromatic amine compound.

An epoxy resin composition including components (A), (B), (C) and (D); wherein a content of the component (A) is 60 to 90 parts by mass, and a content of the component (B) is 10 to 40 parts by mass, with respect to epoxy resins; the epoxy resin composition has a characteristic that, when cured and formed into a cured product, the cured product has a glass transition temperature of 200° C. or higher; and a viscosity at 100° C. of the resin composition is 5 to 35 Pa.Math.s, wherein Component (A) is an aromatic epoxy resin having at least 3 glycidyl groups in one molecule, Component (B) is an aromatic epoxy resin having two glycidyl groups in one molecule, Component (C) is an aromatic polysulfone resin having a reduced viscosity of 0.18 to 0.30 dl/g; and Component (D) is an aromatic amine compound.

The invention provides a composition that can provide a film exhibiting excellent adhesion to a substrate and having excellent non-stickiness. The composition contains a fluororesin, a heat-resistant resin, water, and a solvent having a boiling point of 205° C. or higher.

The invention provides a composition that can provide a film exhibiting excellent adhesion to a substrate and having excellent non-stickiness. The composition contains a fluororesin, a heat-resistant resin, water, and a solvent having a boiling point of 205° C. or higher.

A semicrystalline polyphenylsulfone, has the structure Formula (I) wherein n and R are defined herein. The semicrystalline polyphenylsulfone, which exhibits a crystalline melting point in a range of 215 to 270° C., can be prepared from amorphous polyphenylsulfone using a solvent-induced crystallization method. An additive manufacturing method utilizing particles of the semicrystalline polyphenylsulfone is described. ##STR00001##