The present invention relates to a composition comprising scattering particles. In particular the present invention relates to polymeric composition comprising scattering particles for lightning applications or light guides. The invention also relates to a process for manufacturing such a polymeric composition comprising scattering particles for lightning applications or light guides. More particularly the present invention relates to a polymeric (meth) acrylic composition comprising inorganic scattering particles for lightning applications or light guides.

The present invention relates to polyamide molding compounds which contain the following components (A) to (C) or consist of these components: (A) 50 to 98% by weight of at least one amorphous or microcrystalline specific polyamide; (B) 2 to 40% by weight of at least one semi-crystalline polyamide which is selected from the group consisting of PA 616, PA 516, PA 1016 and mixtures thereof; and (C) 0 to 16% by weight of at least one additive; the constituent amounts of the components (A) to (C) adding up to 100% by weight. The present invention also relates to molded articles made of these polyamide molding compounds and the use thereof.

Provided are a bacterial nanocellulose transparent film, a manufacturing method thereof, and a packaging material including a food packaging material or an electronic product packaging material using the same capable of newly manufacturing a bacterial nanocellulose transparent film with an oxygen barrier property, a moisture barrier property, or a UV barrier property by performing electron beam irradiation and a film process on bacterial cellulose.

Provided is a curable resin composition having developability and resolution improved without degrading the heat resistance and the chemical resistance, furthermore, a curable resin composition that is useful as a PID material for optical uses or a material for optical sensor protective films and enables the formation of a cured product having both higher transparency and excellent heat resistance, a dry film containing the curable resin composition, a cured product thereof and a printed wiring board including the cured product. A curable resin composition containing (A) an amide-imide resin, (B) a compound having an ethylenic double bond and (C) a photopolymerization initiator, wherein the amide-imide resin (A) is a reaction product of an isocyanurate-type polyisocyanate synthesized from an isocyanate having an aliphatic structure and a tricarboxylic acid anhydride and has a number-average molecular weight of 500 to 1000.

The aim of the present invention is to provide a copolymerized polyester resin for solving the problem of die staining and foreign matter adhesion to the film etc. in the continuous production of the film etc.; and the problem of recycling property of the copolymerized polyester. This copolymerized polyester resin contains dicarboxylic acid and did as constituting components, wherein the copolymerized polyester resin contains terephthalic acid as a main component of a dicarboxylic acid component, and contains ethylene glycol as a main component of a diol component, wherein a content of diethylene glycol is from 7 to 30% by mole and a content of triethylene glycol is from 0.05 to 2% by mole when a total amount of the whole diol component is taken as 100% by mole, wherein a content of a cyclic dimer consisting of terephthalic acid and diethylene glycol is 7000 ppm or less, and wherein a content of a cyclic dimer consisting of terephthalic acid, diethylene glycol and triethylene glycol is 200 ppm or less.

A polyimide precursor solution is disclosed, and a colorless transparent polyimide film manufactured from the polyimide precursor solution. The polyimide precursor solution has diamines, a first dianhydride represented by biphenyl dianhydride, a second dianhydride represented by rigid alicyclic dianhydride, a third dianhydride represented by non-alicyclic dianhydrides and organic solvent. The colorless polyimide films have a modulus of 4.5 GPa or higher, a glass-transition temperature (T.sub.g) of 370° C. or higher, and a yellow index of 3.0 or lower. These polyimide films can be used as substrates for thin film transistor (TFT), touch sensor panel (TSP), and cover window applications in flexible display such as organic light-emitting diode (OLED), flexible liquid crystal display (LCD) and other fields.

The invention provides a polyolefin-based resin film formed from a polypropylene-based resin composition and containing, in a total of 100 parts by weight of the polypropylene-based resin composition, 20-95 parts by weight of a propylene-α olefin random copolymer containing a metallocene-based olefin polymerization catalyst; 0-75 parts by weight of a propylene-α olefin random copolymer containing a Ziegler-Natta-based olefin polymerization catalyst; and 5-15 parts by weight of at least one type of an elastomer selected from the group consisting of an ethylene-butene copolymer elastomer, a propylene-butene copolymer elastomer, and an ethylene-propylene copolymer elastomer, wherein a heat shrinkage ratio in a direction in which a heat shrinkage ratio is larger among a longitudinal direction and a width direction of the polyolefin-based resin film is 1-10%, and an orientation coefficient ΔNx in an x-axis direction calculated from a refractive index of the polyolefin-based resin film is 0.0130-0.0250.

A transparent polyimide mixture is disclosed. The transparent polyimide mixture includes a transparent polyimide, an additive, and a solvent. A molecular chain of the transparent polyimide includes an active hydrogen atom. The additive includes a carbodiimide group. An equivalent ratio of the active hydrogen atom and the carbodiimide group is in a range of 1:0.8 to 1:1.2. A method for preparing the transparent polyimide mixture, a transparent polyimide film, and a method for preparing a transparent polyimide film are also disclosed.

The present disclosure relates to a method of selecting a polymer solution (also referred to as a “dope solution”) that is prepared by dissolving a polymer in a solvent in order to cast a film and may provide excellent optical and mechanical properties of the film, a polymer solution prepared using the selected solvent, and a film produced using the polymer solution. In addition, one embodiment is to provide a method of selecting a solvent for a polyamideimide-based or polyimide-based polymer for providing a polymer solution (dope solution) that may provide excellent optical properties of a film and may provide excellent physical properties of a film for an optical device or a display device by improving long-term storage stability of the polymer solution for producing a film.

Described herein are compositions comprising an actinically-crosslinkable polysiloxane-polyglycerol block copolymers, methods of making and use thereof, and devices comprising the compositions described herein. Disclosed herein are compositions comprising an actinically-crosslinkable polysiloxane-polyglycerol block copolymer derived from: a polysiloxane prepolymer comprising a polyglycerol side chain, the polyglycerol side chain comprising an ethylenically unsaturated group covalently linked thereto, wherein the ethylenically unsaturated group is actinically curable.