A device substrate is provided with an increased light transmittance that is a resin film resistant to thermal decomposition in high temperature processes, along with a production method for a device substrate, a device, and a production method for a device, where a resin composition designed to produce a resin film to be used as a substrate for a display device or light receiving device, comprises (a) a resin that has a repeating unit as represented by the chemical formula (1) or (2) as a primary component and (b) a chemical compound as represented by the chemical formula (3) and/or a condensation product thereof,

##STR00001##

wherein in the chemical formulae (1) and (2), X, Y, R.sup.1 and R.sup.2 are defined, and

Si(OR.sup.11).sub.n(R.sup.12).sub.4-n  (3)

wherein in the chemical formula (3), R.sup.11 and R.sup.12 are as defined.

The invention relates to a nontacky film-forming polymer composition (cover material), and tacky hot melt adhesives in the form of pellets which are coated with the polymer composition and producible by coextruding the hot melt adhesive and the cover material. The film-forming composition comprises 5 to 40% by weight of at least one Fischer-Tropsch wax having a melting point of >95° C. and 30 to 70% by weight of at least one metallocene-catalyzed polyolefin having a softening point of >95° C. and a melt flow index (MFI) (230° C., 2.16 kg) of ≦1000 and ≧300 g/10 minutes. The invention further relates to suitable uses for such hot melt adhesives, methods for their use, and products containing these adhesives.

A resin composition that is transparent and excellent in weather resistance and heat resistance, and a molded article thereof are provided. According to the present invention, a transparent and highly heat-resistant resin composition, comprising: an aromatic vinyl-(meth) acrylic acid ester-unsaturated dicarboxylic acid anhydride copolymer (A); and an ultraviolet absorbing agent (B); wherein an amount of a residual unsaturated dicarboxylic acid anhydride monomer contained in the copolymer (A) is 100 ppm or less, and a content of the ultraviolet absorbing agent (B) with respect to a total amount of (A) and (B) is 0.03 to 1.0 mass %, is provided. The composition may further comprise a methacrylic resin (C) in addition to (A) and (B).

A resin composition includes an acrylic resin and a graft copolymer having a gel content of 65% to 84%, wherein the graft copolymer is a multistage-polymerized graft copolymer obtained by a multistage polymerization including the polymerization stages (I) to (III). In the polymerization stage (I), a first monomer mixture and a polyfunctional monomer are polymerized in a presence of a primary alkyl mercaptan-based chain transfer agent and/or a secondary alkyl mercaptan-based chain transfer agent to obtain a first hard polymer. In the polymerization stage (II), a second monomer mixture and a polyfunctional monomer are poloymerized to obtain a soft polymer. In the polymerization stage (III), a third monomer mixture and a polyfunctional monomer are polymerized to obtain a second hard polymer.

The present invention relates to a transparent thermoplastic resin. More particularly, the present invention relates to a transparent thermoplastic resin, including a random copolymerization block prepared by polymerizing 50 to 80% by weight of an aromatic vinyl compound, 10 to 30% by weight of a vinyl cyanide compound, and 0 to 15% by weight of (meth)acrylic acid alkyl ester; and an aromatic vinyl compound block prepared by polymerizing 1 to 10% by weight of an aromatic vinyl compound, a transparent thermoplastic resin composition including the transparent thermoplastic resin, and methods of preparing the aromatic vinyl compound and transparent thermoplastic resin.

New C2C3 random copolymer composition, which shows improved sealing behaviour due to low sealing initiation temperature (SIT) and high hot tack force. In addition, the inventive composition shows an excellent sterilization behaviour, i.e. retention of low haze level after sterilization. The present invention is furthermore related to the manufacture of said copolymer composition and to its use.

The present disclosure provides methods of improving adhesion of a non-di-(2-ethylhexyl)phthalate (DEHP) plasticized polyvinyl chloride (PVC) to an acrylic-based polymer or an ABS-based polymer. Such methods may comprise blending the acrylic-based polymer or ABS-based polymer with an impact modifier so that a rubber content in the acrylic-based polymer or ABS-based polymer is greater than 12% (w/w). Also provided are components of a device (e.g., a medical device) made by the disclosed methods.

The present invention relates to a heat-crosslinkable adhesive composition comprising: —from 20% to 84% by weight of composition (A); —from 15% to 79% by weight of a compatible tackifying resin (B), —from 0.01% to 5% by weight of a crosslinking catalyst (C). The invention also relates to a self-adhesive item obtained by preheating said composition, coating on a support layer, then crosslinking by heating.

Embodiments of a polyethylene polymer blend having a melt index (I.sub.2)<2 g/10 min are provided, wherein the polyethylene polymer blend comprises at least about 50% by wt. of at least one high density polyethylene resin (HDPE) having a density ≧0.950 g/cm3, a melt index (I.sub.2)<4 g/10 min; a melt flow ratio (I.sub.10/I.sub.2)≦9, and a molecular weight distribution (MWD) of about 2 to about 5; and further comprises about 1% to about 20% by wt. of at least one low density polyethylene resin (LDPE) having a density ≦0.930 g/cm3, a melt index (I.sub.2) of about 0.1 to about 10 g/min, and an MWD>3.

A curable resin composition contains a polycarbonate resin and a styrenic monomer, the polycarbonate resin comprising a terminal structure that has an unsaturated group represented by the following Formula (1):

##STR00001## and a constitutional unit represented by the following Formula (2):

##STR00002##