Disclosed herein are graft polymers having a copolymer backbone and polycyclic aromatic hydrocarbon branches for use as a nanofiller dispersant and methods for making the same. Also disclosed are elastomeric nanocomposite compositions comprising a halobutyl rubber matrix, nanoparticles of graphite or grapheme, and the graft polymer. Such elastomeric nanocomposite compositions are suitable as tire innerliners or innertubes.

The present invention relates to a halogen-free epoxy resin composition, a prepreg, a laminate and a printed circuit board containing the same. The halogen-free epoxy resin composition comprises an epoxy resin and a curing agent. Taking the total equivalent amount of the epoxy groups in the epoxy resin as 1, the active groups in the curing agent which react with the epoxy groups have an equivalent amount of 0.5-0.95. By controlling the equivalent ratio of the epoxy groups in the epoxy resin to the active groups in the curing agent to be 0.5-0.95, the present invention ensures the Df value stability of prepregs under different curing temperature conditions while maintaining a low dielectric constant and a low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

The disclosure herein relates to EPDM rubber compositions and membranes. More specifically, the present disclosure relates to halogen-free, fire-resistant EPDM rubber compositions and membranes, and to methods of making them. In one embodiment, the halogen-free EPDM rubber membrane is used for weatherproofing buildings, in particular as a membrane for fa?ade application.

The invention provides a high strength flame-retardant polyester material, which includes a PET resin, a nucleating agent, a flame retardant, an antioxidant, a rod-shaped filling and reinforcing material and a compatibilizer. The PET resin includes virgin pellets or environmentally-friendly recycled pellets, which can meet the demand for the introduction of recycled materials.

An electrical connector having a housing formed of a non-halogenated flame retardant polymer composition is described. The non-halogenated flame retardant polymer composition is formulated to meet flammability performance requirements while maintaining a balance of flexibility and stiffness to allow for the connector to operate properly.

Halogen-free flexible cords are disclosed. The cables include one or more conductors, each surrounded by an insulation layer and a nylon layer. The flexible cords exhibit low smoke when burned. Methods of making and using the cables are also disclosed.

This disclosure relates to halogen-free flame retardant polycarbonate/thermoplastic polyester molding compositions with improved mechanical properties and increased polyester loading level. More particularly, the disclosure relates to halogen-free polycarbonate/thermoplastic polyester resin alloys with polymeric phosphorus flame retardant additive and siloxane impact modifier. Also included are methods for preparing such compositions and articles there from.

A high-CTI and halogen-free epoxy resin composition for copper-clad plates and uses thereof is provided. The formula of the high-CTI and halogen-free epoxy resin composition for copper-clad plates comprises 100140 parts of halogen-free phosphorous epoxy resin, 1035 parts of dicyclopentadiene phenolic epoxy resin, 3260 parts of benzoxazine, 15 parts of phenolic resin, 0.050.5 parts of accelerants; and 2570 parts of fillers, by weight. The copper-clad plates, prepared according to embodiments of the present invention, can reach the requirements of high CTI (CTI500V), high heat resistance (Tg150 C., PCT, 2 h>6 min) and the level of flame retardance of UL-94 V0, and they are widely used in the electronic materials of electric machines, electric appliances, white goods and so on.

The present invention relates to a halogen-free flame retardant resin composition, a prepreg and a copper clad laminate prepared therefrom. The composition of the present invention comprises, based on the weight parts of solid components, (A) from 5 to 80 parts by weight of alkylphenol epoxy resin, (B) from 10 to 80 parts by weight of benzoxazine resin, (C) from 2 to 30 parts by weight of styrene maleic anhydride resin, (D) from 1 to 30 parts by weight of a flame retardant, and (E) from 0.5 to 100 parts by weight of an acidic filler having a pH of 2-6. The present invention further provides a prepreg and a copper clad laminate prepared from the halogen-free flame retardant resin composition. While ensuring a higher glass transition temperature and excellent moisture heat resistance, the halogen-free flame retardant resin composition of the present invention effectively improves the dielectric properties and the peel strength stability of the resin composition, and provides the prepregs and copper clad laminates with excellent comprehensive performances.

The present invention relates to a halogen-free resin composition and a prepreg and a laminated board prepared therefrom. The halogen-free resin composition contains the following components in parts by weight: 50-100 parts of an epoxy resin; 20-70 parts of benzoxazine; 5-40 parts of a polyphenyl ether; 5-40 parts of allyl benzene-maleic anhydride; 10-60 parts of a halogen-free flame retardant; 0.2-5 parts of a curing accelerator, and 20-100 parts of a filler. The prepreg and laminated board prepared from the halogen-free resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance, cohesiveness and moisture resistance, etc., and are suitable for use in a halogen-free high multilayer circuit board.