Object of the present invention is to provide halogen-free highly flame retardant styrene impact modified polymers able to perform V0 classification on thin items, according to international standard UL-94.

The present invention relates to halogen-free flame retardant compositions essentially comprising polyamide polymers (preferred is PA6), at least an Hypophosphorous acid metal salt (preferred is Aluminum hypophosphite), at least an organic phosphinate metal salt (preferred is Aluminum Di Ethyl Phosphinate), at least a Nitrogen based flame retardant agent (preferred is Melamine Cyanurate), at least an organic polyhydric polymer (preferred is EVOH) and optionally further conventional components. Such compositions are highly flame retarded at low thickness and have high Glow Wire temperature resistance.

The present invention pertains to a fluorine-free composition for treating textile articles being water repellant, sol resistant and stain resistant, especially carpets comprising a first composition comprising an aqueous silicone emulsion, an aqueous dispersion of a silane quaternary ammonium salt and water and a second composition comprising a soil repellency component that is an aqueous dispersion of colloidal organosiloxane copolymers.

The present invention discloses a halogen-free epoxy resin composition having low dielectric loss, comprises: (A) 100 parts by weight of an epoxy resin; (B) 10-30 parts by weight of a DOPO modified curing agent; (C) 1-10 parts by weight of benzoxazine resin; (D) 60-90 parts by weight of an active ester compound; (E) 20-50 parts by weight of a flame retardant; and (F) 0.5-10 parts by weight of a curing accelerator. The halogen-free epoxy resin composition uses active ester as a curing agent of the epoxy resin to ensure that the hardening product has characteristics such as low dielectric constant (Dk), low dielectric loss (Df), high heat resistance, low water absorption, flame retardant and halogen-free. The halogen-free epoxy resin composition of the present invention is used for manufacturing semi-cured prepregs or resin-coated films, and is applied toward manufacturing metal clad laminates and printed circuit boards.

An insulated wire includes a conductor, and an insulation layer covering an outer periphery of the conductor. The insulation layer includes a halogen-free flame-retardant resin composition including a base polymer, not less than 1 part by mass and not more than 10 parts by mass of an amorphous silica and not less than 10 parts by mass and not more than 150 parts by mass of a halogen-free flame retardant relative to 100 parts by mass of the base polymer. The base polymer includes not less than 50 parts by mass and not more than 90 parts by mass of either an ethylene-vinyl acetate copolymer or an ethylene-butene copolymer and not less than 10 parts by mass and not more than 50 parts by mass of a low-density polyethylene.

The technology discloses a halogen-free resin composition and a prepreg and a laminate used for a printed circuit. The resin composition comprises: alkyl phenol epoxy resin; benzoxazine resin, alkyl phenol novolac curing agent, and phosphorus-containing flame retardant. The alkyl phenol epoxy resin has many alkyl branched chains in its molecular structure, making the composition have excellent dielectric properties, a higher glass transition temperature, low water absorption, and good heat resistance. Mixing benzoxazine resin into the composition can further reduce dielectric constant, dielectric loss value and water absorption of the cured product. With an alkyl phenol novolac curing agent, the molecular structure will have many alkyls, excellent dielectric properties and low water absorption. A prepreg and a laminate used for printed circuit prepared using the resin composition have low dielectric constants, dielectric loss factors, and water absorption, high dimensional stability, high thermal resistance and good flame retardancy, processability and chemical resistance.

Provided in the present invention are a halogen-free epoxy resin composition, prepreg and laminate using the same, the halogen-free epoxy resin composition comprising: (A) a halogen-free epoxy resin; (B) a crosslinking agent; and (C) a phosphorous-containing phenolic resin, the phosphorous-containing phenolic resin being formed by a synthesis of phenol and formaldehyde with dicyclopentadiene phenol, and being substituted by 9,10-dihydro-9-oxa-10-phosphapheanthrene-10-oxide or a derivative thereof. The prepreg and laminate prepared from the halogen-free epoxy resin composition have a high heat resistance, a low dielectric constant, a low dielectric loss factor and a low water absorption rate, and achieve halogen-free flame retardance.

The invention relates to a polymer compound for a PVC-free sealing system for container closures, which is equipped with at least one oxygen-consuming compound, in which the Shore D hardness of the polymer compound is at least 20 and the polymer compound has a melt flow index (190 C., 5 kg) of at least 5.

The present invention relates to a halogen-free resin composition and a prepreg and a laminated board prepared therefrom. The halogen-free resin composition contains the following components in parts by weight: 50-100 parts of an epoxy resin; 20-70 parts of benzoxazine; 5-40 parts of a polyphenyl ether; 5-40 parts of allyl benzene-maleic anhydride; 10-60 parts of a halogen-free flame retardant; 0.2-5 parts of a curing accelerator, and 20-100 parts of a filler. The prepreg and laminated board prepared from the halogen-free resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance, cohesiveness and moisture resistance, etc., and are suitable for use in a halogen-free high multilayer circuit board.

Object of the present invention is to provide halogen-free highly flame retardant styrene impact modified polymers able to perform V0 classification on thin items, according to international standard UL-94.