Provides is a resin film containing a poly(3-hydroxyalkanoate) resin component. A tensile modulus of the resin film is from 500 to 2000 MPa. A swelling degree of the resin film, as measured by immersion of the resin film in methyl ethyl ketone for two hours, is from 1 to 5. Preferably, the poly(3-hydroxyalkanoate) resin component is a mixture of at least two poly(3-hydroxyalkanoate) resins differing in types and/or contents of constituent monomers.

For example, a triazine ring-containing polymer containing a repeating unit structure represented by Formula (24) below,

##STR00001## wherein R.sup.102 represents a crosslinking group.

A polyamic acid solution includes a dianhydride and a diamine. The dianhydride includes pyromellitic dianhydride, the diamine includes a benzimidazole, the molar ratio of dianhydride monomer to diamine monomer is in a range of from 0.85:1 to 0.99:1, and the polyamic acid solution has a solids content in a range of from 10 to 25 weight percent and a viscosity in a range of from 300 to 3000 poise.

A resin composition includes a polyphenylene ether resin of Formula (1) and an additive. The additive may include maleimide resin, unsaturated C═C double bond-containing crosslinking agent, polyolefin, flame retardant, filler, curing accelerator, or a combination thereof. An article is made from the resin composition. The article includes a prepreg, a resin film, a laminate or a printed circuit board and achieves improvements in one or more properties including comparative tracking index, breakdown voltage, dissipation factor and copper foil peeling strength.

##STR00001##

The present invention relates to a composition for an encapsulant film including an ethylene/alpha-olefin copolymer having high volume resistance and light transmittance, and an encapsulant film using the same.

The disclosure relates to light barrier compositions, methods of making the compositions, articles prepared from the compositions, and methods of making the articles. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.

Articles comprising a surface or porous substrate and having on said surface or porous substrate a coating comprising microfibrillated cellulose or nanocellulose, methods of applying a coating comprising microfibrillated cellulose or nanocellulose to a surface or porous substrate, compositions comprising microfibrillated cellulose or nanocellulose, and the use of such compositions in methods of preparing an antimicrobial surface coating, and improving filtration efficiency and preparing an antimicrobial surface and/or antiviral surface coating.

An encapsulation for an implantable medical device is provided defined by a blend of high molecular weight polyisobutylene and low molecular weight polyisobutylene solution to provide desirable stretchability and elastic properties without sacrificing water resistance properties of the encapsulation. The encapsulation material is flexible thus allowing the medical device to possess tissue matching flexibility and retain long-term normal function free from liquid infiltration.

A thermoplastic elastomer composition possessing a good combination of elastic recovery, tear strength at 25° C., stress relaxation and reduced (improved) anisotropy, which is based on a hydrogenated block copolymer (A), a thermoplastic resin (B), a rubber softener (C) and a polyolefin elastomer (D), of specified types and proportions, and which is suitable for use in a variety of film and sheet applications.

A resin composition includes 100 parts by weight of a maleimide resin; 20 parts by weight to 60 parts by weight of a benzoxazine resin; 5 parts by weight to 40 parts by weight of an epoxy resin; 120 parts by weight to 240 parts by weight of silica including spherical silica having a sediment volume of less than or equal to 0.4 mL/g and a particle size distribution D50 of less than or equal to 1.0 μm; and 0.5 part by weight to 1.6 parts by weight of an imidazole compound having a long-chain alkyl group, wherein the imidazole compound having a long-chain alkyl group includes octylimidazole, undecylimidazole, heptadecylimidazole or a combination thereof. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including glass transition temperature, ratio of thermal expansion, copper foil peeling strength, thermal resistance after moisture absorption, dissipation factor, amount of resin cluster and appearance of cooper-free circuit board.