A sealing film which seals between a metal first base and a second base, the sealing film including: a first adhesive layer that mainly contains an acid-modified polyolefin and adheres to the first base; a second adhesive layer that mainly contains a polyolefin and adheres to the second base; and a base material layer provided between the first adhesive layer and the second adhesive layer, in which the base material layer contains (A), (B), and (C), a ratio [(A)/(B)+(C)] is 90/10 to 20/80, a content percentage of (B) with respect to a total amount of (A), (B), and (C) is 5% by mass or more and 70% by mass or less, and a content percentage of (C) with respect to the total amount of (A), (B), and (C) is 5% by mass or more and 70% by mass or less.

A plasticizer may be suitable for resins and contain an amorphous propylenic polymer having a weight-average molecular weight (Mw), measured according to a GPC method, in a range of from 5,000 to 30,000 and having a molecular weight distribution (Mw/Mn) of 3.0 or less. The amorphous propylenic polymer may be a propylene homopolymer

The present invention provides a UV curable composition, a UV curable adhesive film and a UV curable adhesive tape. The UV curable composition comprises, based on the total weight thereof as 100 wt %: 25 to 60 wt % of an ethylene-vinyl acetate copolymer; 20 to 60 wt % of an epoxy resin; 5 to 20 wt % of glass bubbles; 0.3 to 8 wt % of a hydroxy-containing compound; and 0.5 to 5 wt % of a photoinitiator. According to the technical solution of the present invention, cohesive failure can be achieved in the cured adhesive film by the addition of glass bubbles into the UV curable system. The UV curable product provided in the present invention can achieve a good balance among the initial adhesivity, structural strength after curing, odorlessness or low odor, and other performance.

A resin composition containing: a thermoplastic resin (A) that does not contain a polar group; a thermoplastic resin (B) that contains a polar group; an ethylene-vinyl alcohol copolymer (C) having an ethylene content of 20 to 60 mol %; an aliphatic carboxylic acid (D) having 3 or more carbon atoms; and an aliphatic carboxylic acid metal salt (E) that is a metal salt of the aliphatic carboxylic acid (D), wherein a metal species of (E) is at least one selected from the group consisting of elements belonging to the fourth period d-block in the long periodic table, the content of (A) is 66 to 99 wt. % with respect to the total sum of contents of the resin composition, and the content of (C) is 0.1 to 25 wt. % with respect to the total sum of the contents of the resin composition.

This invention relates to a biodegradable polymer composition which is particularly suitable for use in the manufacture of articles having a high heat deflection temperature (HDT) by injection moulding and thermoforming.

There is provided a co-injection molded multilayer structure comprising a barrier layer and outer layers laminated to contact with the barrier layer on its both sides, wherein the barrier layer is made of a resin composition (X) comprising an ethylene-vinyl alcohol copolymer (A) and an alkali metal salt (B) of a higher fatty acid, having a melting point of 250° C. or lower; the ethylene-vinyl alcohol copolymer (A) has an ethylene unit content of 20 to 60 mol % and a saponification degree of 90% or more, and a content of the alkali metal salt (B) in the barrier layer is 50 to 1500 ppm in terms of metal atoms; and the outer layers are made of a resin composition (Y) comprising an unmodified high-density polyethylene (F) and a maleic anhydride-modified polyethylene (G), and a maleic anhydride modification rate relative to the whole resin composition (Y) is 0.005 to 0.1 wt %. This co-injection molded multilayer structure has excellent adhesiveness, so that its oxygen barrier performance can be maintained even after being subjected to an impact due to falling or the like.

A method for manufacturing a closure constructed for being inserted and securely retained in a portal-forming neck of a product-retaining container is provided. Such method may include intimately combining a plurality of particles comprising cork and having a specified particle size distribution with a plastic material including one or more thermoplastic polymers, optionally in combination with other constituent(s) to form a composition, heating the composition to form a melt, extruding or molding a closure precursor from the melt to provide a specified water content range, and optionally cutting and/or finishing the closure precursor. A composition for use in manufacturing a closure for a product-retaining container includes a plurality of particles comprising cork and having a specified particle size distribution with a plastic material including one or more thermoplastic polymer, optionally in combination with other constituent(s). Methods for producing particulate material, cork composite material, and additional methods for producing closures are also provided.

A polyamide resin composition and a molded article manufactured using the same. The polyamide resin composition includes: about 15 wt % to about 49 wt % of an aromatic polyamide resin including a repeat unit represented by Formula 1 and a repeat unit represented by Formula 2 as defined in the specification; about 1 wt % to about 30 wt % of a polyamide resin having a glass transition temperature of about 40° C. to about 120° C.; about 1 wt % to about 20 wt % of an olefin-based copolymer; and about 30 wt % to about 50 wt % of calcium carbonate. The polyamide resin composition and the molded article produced using the same can have good properties in terms of plating adhesion, impact resistance, thermal resistance, fluidity, and/or appearance, and the like.

A soft polyolefin resin composition and an article molded therefrom are provided. The polyolefin resin includes: (A) 50 to 95% by weight of an ethylene-propylene block copolymer obtained by polymerization of a propylene homopolymer or an ethylene-propylene random copolymer with an ethylene-propylene rubber copolymer in stages in reactors; (B) 4.8 to 40% by weight of an ethylene-α-olefin rubber copolymer; and (C) 0.2 to 10% by weight of a copolymer of ethylene and a polar monomer, based on the total weight of components (A) to (C). The glass transition temperature of the rubber component in the ethylene-propylene block copolymer appears at −60 to −40° C. when measured by a dynamic mechanical analyzer, the melt index of the polyolefin resin composition measured at 230° C. under a load of 2.16 kg is 0.5 to 20 g/10 minutes, and the glass transition temperature of the rubber component in the polyolefin resin composition appears at −60 to −40° C. when measured by a dynamic mechanical analyzer.

A resin composition includes 100 parts by weight of a maleimide resin; 20 parts by weight to 60 parts by weight of a benzoxazine resin; 5 parts by weight to 40 parts by weight of an epoxy resin; 120 parts by weight to 240 parts by weight of silica including spherical silica having a sediment volume of less than or equal to 0.4 mL/g and a particle size distribution D50 of less than or equal to 1.0 μm; and 0.5 part by weight to 1.6 parts by weight of an imidazole compound having a long-chain alkyl group, wherein the imidazole compound having a long-chain alkyl group includes octylimidazole, undecylimidazole, heptadecylimidazole or a combination thereof. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including glass transition temperature, ratio of thermal expansion, copper foil peeling strength, thermal resistance after moisture absorption, dissipation factor, amount of resin cluster and appearance of cooper-free circuit board.