Patent classifications
C08L2205/14
Ethylene vinyl alcohol copolymer resin composition as well as films and multi-layer structures thereof
The instant disclosure relates to ethylene vinyl alcohol copolymer resin composition and/or pellets thereof including one or more fluorine-containing micro-particles. The ethylene vinyl alcohol copolymer resin composition and/or pellets thereof may have a boron content of 10 to 450 ppm. EVOH films formed from the EVOH may have a Charpy impact strength of at least 2.5 KJ/m.sup.2 according to ISO 179-1 at 23 C. and an elongation at break of at least 18.2% according to ISO 527-2 at 23 C.
Thermoplastic Polymer Particles and Methods of Production and Uses Thereof
Thermoplastic polymer particles can be produced that comprise a thermoplastic polymer and an emulsion stabilizer (e.g., nanoparticles and/or surfactant) associated with an outer surface of the particles. The nanoparticles may be embedded in the outer surface of the particles. Melt emulsification can be used to produce said particles. For example, a method may include: mixing a mixture comprising a thermoplastic polymer, an carrier fluid that is immiscible with the thermoplastic polymer, and the emulsion stabilizer at a temperature greater than a melting point or softening temperature of the thermoplastic polymer and at a shear rate sufficiently high to disperse the thermoplastic polymer in the carrier fluid; cooling the mixture to below the melting point or softening temperature of the thermoplastic polymer to form the thermoplastic polymer particles; and separating the thermoplastic polymer particles from the carrier fluid.
Circuit Board for Use at 5G Frequencies
A laminate for use in a circuit board is provided. The laminate comprises a conductive layer and a film positioned adjacent to the conductive layer. The film comprises a polymer composition that includes a liquid crystalline polymer and a hydrophobic material. The polymer composition exhibits a dielectric constant of about 5 or less and dissipation factor of about 0.05 or less at a frequency of 10 GHz.
Feed Material For Three-Dimensional Printing Containing A Polyoxymethylene Polymer
A polymer composition containing a polyoxymethylene polymer having low shrinkage characteristics and/or an expanded processing window is disclosed. The polymer composition is particularly well suited for use in three-dimensional printing systems, such as printers that use filament fusion technology. The polymer composition, for instance, can be a feed material in the form of a filament or polymeric pellets. The feed material can be placed in a printer cartridge for insertion into a three-dimensional printing system. In accordance with the present disclosure, a polyoxymethylene polymer is combined with one or more dimensional stabilizing agents for dramatically improving the processing characteristics of the polymer.
SPIDER-SILK-LIKE POLYMER FIBER, PREPARATION METHOD THEREFOR AND USE THEREOF
The invention relates to a spider-silk-like polymer fiber in the technical field of chemical bionics, a preparation method therefor and the use thereof. The spider-silk-like polymer fiber comprises a matrix polymer and a particle additive dispersed therein, wherein the particles have an average particle size of 0.1-1000 microns, and the polymer fiber has a spider-silk-like microstructure comprising a fiber body and spaced spindle knot structural units on the fiber body, wherein the spindle knot structural units comprise the particles, and the radial height of the spindle knot structural units is greater than the diameter of the fiber body. The preparation method of the polymer fiber of the invention does not require greatly modifying the existing spinning processes, and the equipment does not need to be changed, the process is simple, and the cost is low. The obtained spider-silk-like polymer fiber can realize the directional movement of water droplets on the surface of the fiber, thereby having a water gathering function and can be used for preparing water gathering materials.
Fluorocarbon resin composition and prepreg and copper foil substrate using the same
A fluorocarbon resin composition is applicable to produce high-frequency circuit boards including a polytetrafluoroethylene resin; a fluorine-containing copolymer such as poly fluoroalkoxy and fluorinated ethylene propylene; low molecular-weight PTFE micro-powders and inorganic powders; in particular the temperature of pressing copper foil substrates is lowered from 350 C. to 250 C. via a lowering temperature rate of 1 to 4 C./min to improve the crystallinity of the fluorocarbon resin composition as well as improve the copper foil substrate with a high thermal conductivity and a wide range of dielectric constant.
Polymer having a small average particle size
The present invention relates to a polymer comprising: (a) polymeric units derived from vinyl chloride, vinyl acetate, styrene, methyl methacrylate, acrylonitrile, or combinations thereof; and (b) polymeric units derived from one or more compounds according to formula I: wherein: R1 is CH.sub.3 or H; R2 is a moiety comprising 1-20 carbon atoms; and n is an integer from 1-10; wherein the polymer has an average particle size of 10-80 m expressed as D.sub.50 determined in accordance with ISO 9276-2 (2014); and a porosity of 0.20 ml/g as determined as the quantity of di(2-ethylhexyl)phthalate in ml absorbed by 1 g of polymer upon subjecting the polymer at 23 C. to vacuum, submerging in di(2-ethylhexyl)phthalate for 10 min, and subsequently centrifuging at 2000 rpm for 45 min. Such polymer may be used as viscosity reducing agent in PVC plastisol compositions.
THIN FILM FLUOPOLYMER COMPOSITE CMP POLISHING METHOD
The invention provides a polymer-polymer composite polishing method comprising a polishing layer having a polishing surface for polishing or planarizing a substrate. The method includes attaching a polymer-polymer composite having a polishing layer and a polymeric matrix. The polymer matrix has fluoropolymer particles embedded in the polymeric matrix. Then a cationic particle slurry is applied to the polymer-polymer composite polishing pad. Conditioning the polymer-polymer composite polishing pad with an abrasive cuts the polymer-polymer composite polishing pad; and rubbing the cut polymer-polymer composite polishing pad against the substrate forms the polishing surface. The polishing surface has a fluorine concentration measured in atomic percent at a penetration depth of 1 to 10 nm of at least ten percent higher than the bulk fluorine concentration measured with at a penetration depth of 1 to 10 m to polish or planarize the substrate.
Halogenated wax grafted to low molecular weight polymer
A wax-polymer compound includes (a) a polymer component that is a polymerized unsaturated monomer, optionally copolymerized with a vinyl-aromatic monomer, and (b) a halogenated hydrocarbon wax component. The polymer component is grafted to the halogenated hydrocarbon wax component, and the wax-polymer compound has a number average molecular weight of about 1,000 to about 100,000. A method of making the wax-polymer compound and a coated silica particle are also disclosed.
MATTE FINISH FOR PLASTICS
Compositions and methods for producing a matte finish for plastics are disclosed herein. An exemplary thermoplastic article having a matte, printable surface is made of a thermoplastic resin and a thermoplastic additive composition having cross-linked silicone microparticles in a carrier resin. The composition can have 2.5% to 7.5% cross-linked silicone microparticles in a carrier resin, for example polyethylene terephthalate (PET). The cross-linked silicone microparticles have a particle size of about 2 m to about 15 m. The disclosed thermoplastic article can have a surface texture that is soft and smooth and a gloss level of less than 15 gloss units.