Provided are a composition for an acoustic lens, containing the following components (A) to (D), an acoustic lens, an acoustic wave probe, an ultrasound probe, an acoustic wave measurement apparatus, an ultrasound diagnostic apparatus, a photoacoustic wave measurement apparatus, an ultrasonic endoscope, and a method for manufacturing an acoustic wave probe: (A) a linear polysiloxane having a vinyl group, (B) a linear polysiloxane having two or more SiH groups in a molecular chain, (C) a polysiloxane resin, and (D) zinc oxide particles having an average primary particle diameter of more than 10 nm and less than 300 nm, and surface-treated with at least one surface treatment agent of a silane compound, an aluminum alkoxide compound, a zirconium alkoxide compound, or a titanium alkoxide compound, provided that the silane compound has at least one of a hydroxy group or an alkoxy group, directly bonded to a silicon atom.

An addition curable type silicone resin composition includes (a) an organopolysiloxane having an alkenyl group bonded to a silicon atom, (b) an organopolysiloxane represented by the formula, (R.sup.1R.sup.2.sub.2SiO.sub.1/2).sub.m(R.sup.1R.sup.2SiO.sub.2/2).sub.n(R.sup.2.sub.2SiO.sub.2/2).sub.p(R.sup.1SiO.sub.3/2).sub.q(R.sup.2(OR.sup.3)SiO.sub.2/2).sub.r(SiO.sub.4/2).sub.s, (c) an organohydrogen polysiloxane represented by R.sup.4.sub.aH.sub.bSiO.sub.(4-a-b)/2), (d) a platinum group metal catalyst, and (e) a polyorganometallosiloxane containing an SiOCe bond, and an SiOTi bond, and contents of Ce and Ti of which are each 50 to 5,000 ppm, which cures by heating. According to this constitution, it is provided an addition curable type silicone resin composition which can provide a cured product excellent in transparency, and less change in hardness and weight loss under high temperature conditions.

A curable composition contains: (a) 15 to 73 weight-percent of a vinyl functional M-capped aryl silsesquioxane resin: (b) 0.5 to 5 weight-percent of a vinyl functional disiloxane: (c) 2 to 25 wt % of a silicon-hydride functional M-capped silsesquioxane resin; and (d) 1 to 10 weight parts per million weight parts of platinum from a platinum hydrosilylation catalyst: wherein the sum of the concentration of (a) and (b) is at least 35 weight-percent: weight-percent values are relative to weight of curable composition; and the curable composition is free of acetylenic alcohol hydrosilylation inhibitors.

A conductive resin composition has low-temperature curability and is excellent in resistance stability during stretching. A conductive resin composition contains: (A) a polyorganosiloxane having an alkenyl group, (B) a polyorganosiloxane having a specific structure, (C) a conductive particle, (D) a compound having a hydrosilyl group, and (E) a hydrosilylation catalyst.
The content of the component (B) is 6 to 50 parts by mass based on 100 parts by mass of the component (A).

Provided is a composition that exhibits curing characteristics and can be cured by exposure to high energy conditions (i.e., photo-activatable) and optionally by exposure to non-photoactivatable conditions (e.g., condensation curing and/or at elevated temperatures). The present compositions are suitable for use as a potting compound in electronic applications and can be used as a material to fill space in and around electronic components. The compositions also display excellent adhesion to a variety of substrates. Also provided are methods of curing and using the compositions in various applications.

A process including contacting one or more monomers, at least one catalyst system, and a condensing agent including a majority of 2,2-dimethylpropane under polymerizable conditions to produce a polyolefin polymer is provided.

A thermally conductive silicone gel composition of the present invention includes the following A to F: (A) an organopolysiloxane having two alkenyl groups per molecule; (B) an organohydrogenpolysiloxane having two SiH groups per molecule; (C) an organohydrogenpolysiloxane having three or more SiH groups per molecule; (D) at least one compound selected from the group consisting of D1 and D2: (D1) an organopolysiloxane having one alkenyl group per molecule and (D2) an organohydrogenpolysiloxane having one SiH group per molecule; (E) a platinum catalyst; and (F) a thermally conductive filler in an amount of 100 to 600 vol % with respect to 100 vol % of the total amount of the A to E. The components A to F are cured. With this configuration, the thermally conductive silicone gel composition can reduce oil bleeding, even though the composition is a gel cured product.

Provided are methods for extending the life of in-service electrical cable having polymeric insulation, comprising injecting into the cable a dielectric gel formulation containing: (a) SiH endblocked polydiorganosiloxane (H(R.sub.2SiO).sub.x(R.sub.2Si)H); (b) polydiorganosiloxane endblocked with unsaturated carbon-carbon functionality; (c) hydrosilylation catalyst suitable to cure (a) and (b); and (d) at least one organoalkoxysilane functional additive (e.g., anti-oxidant-based alkoxysilane, voltage stabilizer-based alkoxysilane, hindered amine light stabilizer (HALS)-based alkoxylsilane, UV absorber-based alkoxysilane, etc.), wherein (a) and (b) are cured post-injection into a non-flowable gel, and wherein (d) diffuses into the insulation. The methods may further comprise a hydrolysis/condensation catalyst compatible with the hydrosilylation catalyst so as not to interfere with the cure of (a), (b) and (c), and/or be compatible with optional siloxane crosslinkers, and/or with optional hydrosilylation inhibitors.

A thermally insulating matrix includes a silicone phase and a glass filler having a thermal conductivity of less than about 0.1 W/mK. The silicone phase is prepared by combining: Component (A)a polyorganosiloxane containing two silicon-bonded terminal alkenyl groups per molecule and having a molecular weight ranging from about 15,000 g/mole to about 70,000 g/mole and a kinematic viscosity ranging from about 250 cSt to about 15,000 cSt at 25 C.; Component (B)trimethylsiloxane terminated (methylhydrosiloxane-dimethylsiloxane) copolymer, containing from about 15% to about 50% methylhydrosiloxane; and a catalyst for a hydrosilylation reaction between Component (A) and Component (B). The matrix includes at least about 50 wt. % of the silicone phase, based on the total weight of the matrix.

The present disclosure relates to a polyethylene composition comprising copolymers of ethylene with 1-alkenes, or mixtures of ethylene homopolymers and said copolymers of ethylene with 1-alkenes, wherein the polyethylene composition has a molar mass distribution width (MWD) M.sub.w/M.sub.n of from 7 to 15, a density of from 0.942 to 0.954 g/cm.sup.3, a weight average molar mass M.sub.w of from 20,000 g/mol to 500,000 g/mol, a MIE of from 1.0 to 3.0 g/10 min, a MIF of from 100 to 200 g/10 min, and a ratio MIF/MIE of from 40 to 50.