The present invention relates to a two-component putty comprising (1) a base component and (2) a curing component, wherein the base component comprises: a polycarbonate diol having a hydroxyl number in the range of from 50 to 500 mg KOH/g; a further resin component having a hydroxyl number of at least 300 mg KOH/g; and an inorganic filler, wherein the curing component comprises a polyisocyanate, and wherein the amount of the inorganic filler is in the range of from 35 wt % to 60 wt %, based on the total weight of the putty, the putty contains less than 5 wt % of organic solvent, and the viscosity of the putty is in the range of from 30,000 mPa.Math.s to 250,000 mPa.Math.s. The present invention also relates to a method for coating a substrate by applying such putty and allowing the applied putty to cure. The invention further relates to a coated substrate obtainable by such method and the use of such two-component putty for improving erosion resistance of a substrate.

The present invention relates to a two-component putty comprising (1) a base component and (2) a curing component, wherein the base component comprises: a polycarbonate diol having a hydroxyl number in the range of from 50 to 500 mg KOH/g; a further resin component having a hydroxyl number of at least 300 mg KOH/g; and an inorganic filler, wherein the curing component comprises a polyisocyanate, and wherein the amount of the inorganic filler is in the range of from 35 wt % to 60 wt %, based on the total weight of the putty, the putty contains less than 5 wt % of organic solvent, and the viscosity of the putty is in the range of from 30,000 mPa.Math.s to 250,000 mPa.Math.s. The present invention also relates to a method for coating a substrate by applying such putty and allowing the applied putty to cure. The invention further relates to a coated substrate obtainable by such method and the use of such two-component putty for improving erosion resistance of a substrate.

A relevant technological challenge is the low cost and abundant materials development for silicon surface passivation for applications in optoelectronic devices, in particular in solar cells by scalable industrial methods. In the present invention, a new hybrid material comprising PEDOT:PSS and transparent conducting oxide nanostructures is developed and a method is proposed to fabricate the composite material that passivates well the silicon surface to be used by means of a thin composite film of thickness below 200 nm.

A multi-purpose putty product usable as a lamp fuel, first aid medication, water proofing agent, water sealant, and UV responsive marker is shown and described. The putty component may include waxes, oils, pine gum rosin, powdered metallic thermite fuel, and cotton fibers. Optionally, the putty may include a colorant and plant essential oil as an odorant. The putty may be provided in kit form, with a receptacle and closure, and a tool enabling putty product in the receptacle to be exposed and held erect for service as a wick while burning.

A filler for a concrete structure is provided. The filler includes an organic-inorganic composite hydrogel (A). The organic-inorganic composite hydrogel (A) has a three-dimensional network structure that includes a polymer of a water-soluble organic monomer and includes a water-swellable clay mineral. The filler has a water pressure resistance of 0.2 MPa or greater. The filler for a concrete structure has excellent workability and various excellent physical properties in terms of, for example, adhesion to wet surfaces and resistance to water pressure. Accordingly, the filler is suitable for use as a filler for joints and cracks of concrete structural objects.

A filler for a concrete structure is provided. The filler includes an organic-inorganic composite hydrogel (A). The organic-inorganic composite hydrogel (A) has a three-dimensional network structure that includes a polymer of a water-soluble organic monomer and includes a water-swellable clay mineral. The filler has a water pressure resistance of 0.2 MPa or greater. The filler for a concrete structure has excellent workability and various excellent physical properties in terms of, for example, adhesion to wet surfaces and resistance to water pressure. Accordingly, the filler is suitable for use as a filler for joints and cracks of concrete structural objects.

A composition for producing a putty. The composition includes a binder component with 40 to 95 wt.-% of an epoxy resin based on a total mass of the binder component, a hardener component with 5 to 70 wt.-% of an NH-group-containing compound relative to a total mass of the hardener component, and 0.1 to 15 wt.-% of synthetic hollow bodies based on a total mass of the putty. The synthetic hollow bodies have a density of 0.005 to 0.8 g/cm.sup.3.

A composition for producing a putty. The composition includes a binder component with 40 to 95 wt.-% of an epoxy resin based on a total mass of the binder component, a hardener component with 5 to 70 wt.-% of an NH-group-containing compound relative to a total mass of the hardener component, and 0.1 to 15 wt.-% of synthetic hollow bodies based on a total mass of the putty. The synthetic hollow bodies have a density of 0.005 to 0.8 g/cm.sup.3.

The composition includes a liquid polyester resin comprising at least one ,-unsaturated ester group, a tertiary amine accelerator, and up to five percent by weight of a reactive diluent having a flash point up to 150 C. A method of repairing a damaged surface using the composition is also described.

The composition includes a liquid polyester resin comprising at least one ,-unsaturated ester group, a tertiary amine accelerator, and up to five percent by weight of a reactive diluent having a flash point up to 150 C. A method of repairing a damaged surface using the composition is also described.