A curable composition containing a polymerizable compound (a), a photopolymerization initiator (b), and a solvent (c), wherein the curable composition has viscosity of not less than 2 mPa.Math.s and not more than 60 mPa.Math.s at 23 C., a content of the solvent (d) with respect to the whole curable composition is not less than 5 vol % and not more than 95 vol %, a boiling point of the solvent (d) at normal pressure is less than 250 C., and the polymerizable compound (a) contains a compound (a-1) containing not less than one aromatic ring or aromatic heterocycle, and not less than four vinyl groups directly bonding to the aromatic ring or the aromatic heterocycle.

This disclosure relates to a film layer for use in flexible metal clad laminates. The film layer comprises a thermosetting composition comprising: a copolymer of (a) a diisoalkenylarene (DIAEA) and (b) a divinylarene (DVA) containing a mixture of m-divinylarene and p-divinylarene, in a mole ratio of (a) to (b) of 15:1 to 1:15; a second polymer; a filler and optional additives. Flexible metal clad laminates made with the film further comprises a metal foil bonded to the surface of the film. The thermosetting composition containing the DIAEA-DVA copolymer provides improved thermal stability at high temperature, excellent processability, and electrical properties, e.g., Dk and Df.

This disclosure relates to a film layer for use in flexible metal clad laminates. The film layer comprises a thermosetting composition comprising: a copolymer of (a) a diisoalkenylarene (DIAEA) and (b) a divinylarene (DVA) containing a mixture of m-divinylarene and p-divinylarene, in a mole ratio of (a) to (b) of 15:1 to 1:15; a second polymer; a filler and optional additives. Flexible metal clad laminates made with the film further comprises a metal foil bonded to the surface of the film. The thermosetting composition containing the DIAEA-DVA copolymer provides improved thermal stability at high temperature, excellent processability, and electrical properties, e.g., Dk and Df.

A method for producing a perovskite material photovoltaic device, the method comprising: depositing a layer comprising a fullerene or fullerene derivative on a perovskite material; depositing a cross-linking agent on the perovskite material or the layer comprising the fullerene or fullerene derivative, wherein the cross-linking agent comprises a silane, wherein the silane is a halosilyalkane; and depositing one or more polymers on the perovskite material or the layer comprising the fullerene or fullerene derivative.