There is provided a water-based resin composition that contains a polymer (A) containing, as essential raw materials, a hydrogenated polybutadiene (a1) with an iodine value in the range of 5 to 25, a monomer (a2) with an acid group, and a monomer (a3) with a hydroxy group, a basic compound (B), and an aqueous medium (C), wherein the hydrogenated polybutadiene (a1) constitutes 4% to 38% by mass of the raw materials of the polymer (A), and the polymer (A) has an acid value in the range of 10 to 65 mgKOH/g. A water-based resin composition of the present invention has high storage stability and forms a coating film with good physical properties, such as high adhesiveness to various substrates and high blocking resistance, and is therefore suitably used in a water-based paint.

A laminated sheet with a cover material, an adhesive cover tape, and an electronic component packaging container molded. A laminated sheet having a surface layer on both sides of a substrate layer, and the substrate layer includes 30 to 70 mass % of a component mentioned below, 70 to 30 mass % of a component mentioned below, and 0 to 30 mass % of a recycled material of the laminated sheet to the total mass of the substrate layer. The component is a rubber modified (meth)acrylic acid ester-vinyl aromatic hydrocarbon copolymer having a conjugated diene rubber component content of 5 to 15 mass %. The component is a vinyl aromatic hydrocarbon-conjugated diene block copolymer containing 15 to 30 mass % of monomeric units derived from conjugated dienes. The component is at least one polymer selected from the group consisting of a vinyl aromatic hydrocarbon polymer and a rubber modified vinyl aromatic hydrocarbon polymer.

Provided is a thermoplastic resin composition which includes: a graft copolymer prepared by graft-polymerizing an aromatic vinyl-based monomer and a vinyl cyan-based monomer onto an acrylic rubber polymer having an average particle diameter of 50.0 to 90.0 nm; a matrix copolymer including a C.sub.1-C.sub.3 alkyl (meth)acrylate-based monomer unit, an aromatic vinyl-based monomer unit and a vinyl cyan-based monomer unit; and an additive including a polymer including a C.sub.1-C.sub.3 alkyl (meth)acrylate-based monomer unit, specifically, a thermoplastic resin composition which has improved properties in terms of elongation, processability, weather resistance, colorability, hardness, chemical resistance, scratch resistance, a whitening phenomenon, surface gloss and appearance quality while having excellent basic properties.

Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively prevent moisture or oxygen added to an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.

Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.

The substrate for adhesive tape is thin in thickness and can also suppress repelling of a water-borne primer when the primer is being coated. The substrate for adhesive tape includes 25 to 75 parts by mass of a plasticizer and 5 to 40 parts by mass of an inorganic filler with respect to 100 parts by mass of polyvinyl chloride resin having a mean degree of polymerization of 1200 to 1800; wherein the inorganic filler has a mean particle size of 0.05 to 0.8 m; and the substrate has a thickness of 40 to 80 m.

Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.

This disclosure relates to a dielectric film-forming composition that includes at least one cyclized polydiene resin, and one or both of at least one reactive functional compound and at least one catalyst.

This disclosure relates to a dielectric film-forming composition that includes at least one cyclized polydiene resin, and one or both of at least one reactive functional compound and at least one catalyst.

Aqueous matte coating compositions and methods for applying aqueous matte coating compositions to substrates are disclosed. The compositions comprise (a) from 10 to 65 wt % of a first acrylic bead having a calculated glass transition temperature (Tg) of from 30 to 10 C. and an average diameter particle of from 0.1 to 2 m, (b) from 20 to 80 wt % of a second acrylic bead having a calculated Tg of from 60 to 0 C. and an average particle diameter of from 0.5 to 30 optionally (c) from 10 to 30 wt % of a polymer binder having an average particle diameter of 0.03 to 0.5 and (d) a slip additive. In some embodiments, the slip additive comprises a silicone emulsion and a wax dispersion. In some embodiments, the slip additive comprises a polyurethane dispersion. Methods for applying aqueous matte coating compositions are also disclosed.