Patent classifications
C09D151/04
Pressure-sensitive adhesive composition, pressure-sensitive adhesive film, and method of manufacturing organic electronic device using the same
Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.
PRESSURE SENSITIVE ADHESIVE COMPOSITION, PRESSURE SENSITIVE ADHESIVE FILM, AND METHOD OF MANUFACTURING ORGANIC ELECTRONIC DEVICE USING THE SAME
Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively prevent moisture or oxygen added to an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.
Dielectric Film-Forming Composition
This disclosure relates to a dielectric film-forming composition that includes at least one cyclized polydiene resin, and one or both of at least one reactive functional compound and at least one catalyst.
Dielectric Film-Forming Composition
This disclosure relates to a dielectric film-forming composition that includes at least one cyclized polydiene resin, and one or both of at least one reactive functional compound and at least one catalyst.
Pressure sensitive adhesive composition, pressure sensitive adhesive film, and method of manufacturing organic electronic device using the same
Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively prevent moisture or oxygen added to an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.
Curable compositions based on multistage polymers
Compositions which are curable by, for example, exposure to radiation to form useful articles such as three-dimensionally printed objects are prepared using multistage polymers, polymerizing organic substances and (meth)acrylic polymers. The multistage polymer is effective to toughen and impact modify the cured articles, yet the compositions prior to curing are relatively low in viscosity and agglomerate content even at high loadings of multistage polymer.
Curable compositions based on multistage polymers
Compositions which are curable by, for example, exposure to radiation to form useful articles such as three-dimensionally printed objects are prepared using multistage polymers, polymerizing organic substances and (meth)acrylic polymers. The multistage polymer is effective to toughen and impact modify the cured articles, yet the compositions prior to curing are relatively low in viscosity and agglomerate content even at high loadings of multistage polymer.
PRIMER COMPOSITION AND ADHESIVE TAPE
An object of the present invention is to provide a primer composition for application between the base film and the adhesive layer of an adhesive tape that can improve the adhesion between the base film and the adhesive layer of the adhesive tape and an adhesive tape prepared by using the primer composition. A primer composition, comprising 100 parts by mass (as solid matter) of a graft polymer of a natural rubber graft-polymerized with 15 to 65 mass % of methyl methacrylate and 25 to 300 parts by mass of a carboxyl group-modified acrylonitrile butadiene rubber.
PRIMER COMPOSITION AND ADHESIVE TAPE
An object of the present invention is to provide a primer composition for application between the base film and the adhesive layer of an adhesive tape that can improve the adhesion between the base film and the adhesive layer of the adhesive tape and an adhesive tape prepared by using the primer composition. A primer composition, comprising 100 parts by mass (as solid matter) of a graft polymer of a natural rubber graft-polymerized with 15 to 65 mass % of methyl methacrylate and 25 to 300 parts by mass of a carboxyl group-modified acrylonitrile butadiene rubber.
Primer composition and adhesive tape
An object of the invention is to provide a primer composition for application between the base film and the adhesive layer of an adhesive tape that can improve the adhesion between the base film and the adhesive layer of the adhesive tape and an adhesive tape prepared by using the primer composition. A primer composition, comprising 100 parts by mass (as solid matter) of a graft polymer of a natural rubber graft-polymerized with 15 to 65 mass % of methyl methacrylate and 25 to 300 parts by mass of a carboxyl group-modified acrylonitrile butadiene rubber.