A conductive coating material is disclosed including at least (A) 100 parts by mass of a binder component including a solid epoxy resin that is a solid at normal temperature and a liquid epoxy resin that is a liquid at normal temperature, (B) 500 to 1800 parts by mass of metal particles that have a tap density of 5.3 to 6.5 g/cm.sup.3 with respect to 100 parts by mass of the binder component (A), (C) 0.3 to 40 parts by mass of a curing agent that contains at least one imidazole type curing agent with respect to 100 parts by mass of the binder component (A), and (D) 150 to 600 parts by mass of a solvent with respect to 100 parts by mass of the binder component (A).

A conductive coating material is disclosed including at least (A) 100 parts by mass of a binder component including a solid epoxy resin that is a solid at normal temperature and a liquid epoxy resin that is a liquid at normal temperature, (B) 500 to 1800 parts by mass of metal particles that have a tap density of 5.3 to 6.5 g/cm.sup.3 with respect to 100 parts by mass of the binder component (A), (C) 0.3 to 40 parts by mass of a curing agent that contains at least one imidazole type curing agent with respect to 100 parts by mass of the binder component (A), and (D) 150 to 600 parts by mass of a solvent with respect to 100 parts by mass of the binder component (A).

There is provided a novel resist underlayer film forming composition comprising a polymer having a repeating structural unit of formula (1a) and/or (1b): ##STR00001##
[wherein two R.sup.1s are each independently a C.sub.1-10 alkyl group, a C.sub.2-6 alkenyl group, an aromatic hydrocarbon group, a halogen atom, a nitro group, or an amino group, two R.sup.2s are each independently a hydrogen atom, a C.sub.1-10 alkyl group, a C.sub.2-6 alkenyl group, an acetal group, an acyl group, or a glycidyl group, R.sup.3 is an aromatic hydrocarbon group optionally having a substituent or a heterocyclic group, R.sup.4 is a hydrogen atom, a phenyl group, or a naphthyl group, two ks are each independently 0 or 1, m is an integer of 3 to 500, p is an integer of 3 to 500, X is a benzene ring, and two C(CH.sub.3).sub.2 groups bonded to the benzene ring are in a meta position or a para position], and a solvent.

Described herein is an improved process for anticorrosion pretreatment of a metallic surface including steel, galvanized steel, aluminum, an aluminum alloy, magnesium and/or a zinc-magnesium alloy, wherein the metallic surface is brought into contact with i) an acidic aqueous composition A which includes a1) at least one compound selected from the group consisting of titanium, zirconium and hafnium compounds, and with ii) an aqueous composition B which includes b1) at least one (meth)acrylate resin and b2) at least one phenol resin, where the metallic surface is brought into contact firstly with the composition A and then with the composition B and/or firstly with the composition B and then with the composition A and/or simultaneously with the composition A and the composition B.

Described herein is an improved process for anticorrosion pretreatment of a metallic surface including steel, galvanized steel, aluminum, an aluminum alloy, magnesium and/or a zinc-magnesium alloy, wherein the metallic surface is brought into contact with i) an acidic aqueous composition A which includes a1) at least one compound selected from the group consisting of titanium, zirconium and hafnium compounds, and with ii) an aqueous composition B which includes b1) at least one (meth)acrylate resin and b2) at least one phenol resin, where the metallic surface is brought into contact firstly with the composition A and then with the composition B and/or firstly with the composition B and then with the composition A and/or simultaneously with the composition A and the composition B.

There is provided a novel resist underlayer film forming composition comprising a polymer having a repeating structural unit of formula (1a) and/or (1b):

##STR00001##

[wherein two R.sup.1s are each independently a C.sub.1-10 alkyl group, a C.sub.2-6 alkenyl group, an aromatic hydrocarbon group, a halogen atom, a nitro group, or an amino group, two R.sup.2s are each independently a hydrogen atom, a C.sub.1-10 alkyl group, a C.sub.2-6 alkenyl group, an acetal group, an acyl group, or a glycidyl group, R.sup.3 is an aromatic hydrocarbon group optionally having a substituent or a heterocyclic group, R.sup.4 is a hydrogen atom, a phenyl group, or a naphthyl group, two ks are each independently 0 or 1, m is an integer of 3 to 500, p is an integer of 3 to 500, X is a benzene ring, and two C(CH.sub.3).sub.2 groups bonded to the benzene ring are in a meta position or a para position], and a solvent.

Disclosed is a coated metal pipe including a metal pipe and a multi-layered coating film that covers an outer circumferential surface of the metal pipe. The multi-layered coating film includes a chemical conversion layer and a primer layer, and these layers are provided in this order from the inside. The primer layer contains polyamide imide and at least one kind of additive component selected from polyamide, a fluorine resin, a silane coupling agent, and an epoxy resin.

Disclosed is a coated metal pipe including a metal pipe and a multi-layered coating film that covers an outer circumferential surface of the metal pipe. The multi-layered coating film includes a chemical conversion layer and a primer layer, and these layers are provided in this order from the inside. The primer layer contains polyamide imide and at least one kind of additive component selected from polyamide, a fluorine resin, a silane coupling agent, and an epoxy resin.

Coating or resin compositions substantially free of bisphenol A with excellent surface adhesion comprising a compound in an effective amount of less than 10% w/w based on the resin with the following structure:

##STR00001##

The adhesion promoters are preferably aldehyde condensation products of aromatic carboxylic acid, phosphonic acid, phosphinic acid, sulphonic acid or sulphinic acid or its corresponding ionic form.

Coating or resin compositions substantially free of bisphenol A with excellent surface adhesion comprising a compound in an effective amount of less than 10% w/w based on the resin with the following structure:

##STR00001##

The adhesion promoters are preferably aldehyde condensation products of aromatic carboxylic acid, phosphonic acid, phosphinic acid, sulphonic acid or sulphinic acid or its corresponding ionic form.