A thermosetting resin composition contains an epoxy resin, a curing accelerator, a compound having a (meth) acryloyl group, and a compound having an acidic functional group and a weight average molecular weight of 1000 or more. The thermosetting resin composition may further contain a phosphorus-based flame retardant, organic spherical beads, and the like. The thermosetting resin composition preferably substantially does not contain a photopolymerization initiator and a thermal polymerization initiator. The thermosetting resin composition can be used, for example, for forming a cured film on a flexible printed wiring board.

A thermosetting resin composition contains an epoxy resin, a curing accelerator, a compound having a (meth) acryloyl group, and a compound having an acidic functional group and a weight average molecular weight of 1000 or more. The thermosetting resin composition may further contain a phosphorus-based flame retardant, organic spherical beads, and the like. The thermosetting resin composition preferably substantially does not contain a photopolymerization initiator and a thermal polymerization initiator. The thermosetting resin composition can be used, for example, for forming a cured film on a flexible printed wiring board.

Provided are: a composition for powder coating materials, which enables the achievement of a cured film that has excellent thin film smoothness, electrical insulation properties and thermal conductivity; and a coated article. The present invention relates to: a composition for powder coating materials, which contains (A) a thermally conductive filler having an average circularity of 0.92 or more, (B) a thermosetting resin and (C) a curing agent; and a coated article, the surface of which is provided with a cured film that is formed from this composition for powder coating materials. The present invention also relates to a composition for powder coating materials, which additionally contains (D) a dispersant.

Provided are: a composition for powder coating materials, which enables the achievement of a cured film that has excellent thin film smoothness, electrical insulation properties and thermal conductivity; and a coated article. The present invention relates to: a composition for powder coating materials, which contains (A) a thermally conductive filler having an average circularity of 0.92 or more, (B) a thermosetting resin and (C) a curing agent; and a coated article, the surface of which is provided with a cured film that is formed from this composition for powder coating materials. The present invention also relates to a composition for powder coating materials, which additionally contains (D) a dispersant.

An adduct AD obtained from the reaction of at least one novolak glycidyl ether containing an average of 2.5 to 4 epoxy groups per molecule with an amine mixture including bis(6-aminohexyl)amine and at least one amine A1 other than bis(6-aminohexyl)amine that has at least one primary amino group. Preferably, the amine mixture is a technical grade quality of bis(6-aminohexyl)amine that contains 25% to 82% by weight of bis(6-aminohexyl)amine. The adduct AD is preparable in a simple manner and without the use of solvents, and enables low-odor, low-toxicity and low-viscosity hardeners that can be processed and stored even under cold conditions. Epoxy resin compositions cured therewith very rapidly build up high binding forces and high strengths under ambient outdoor temperatures, even on substrates that are difficult to bond.

An adduct AD obtained from the reaction of at least one novolak glycidyl ether containing an average of 2.5 to 4 epoxy groups per molecule with an amine mixture including bis(6-aminohexyl)amine and at least one amine A1 other than bis(6-aminohexyl)amine that has at least one primary amino group. Preferably, the amine mixture is a technical grade quality of bis(6-aminohexyl)amine that contains 25% to 82% by weight of bis(6-aminohexyl)amine. The adduct AD is preparable in a simple manner and without the use of solvents, and enables low-odor, low-toxicity and low-viscosity hardeners that can be processed and stored even under cold conditions. Epoxy resin compositions cured therewith very rapidly build up high binding forces and high strengths under ambient outdoor temperatures, even on substrates that are difficult to bond.

The embodiments described herein generally relate to methods and chemical compositions of phenolic epoxy systems. In one embodiment, a composition comprising a phenolic epoxy resin system includes an epoxy resin component and an alkoxylated phenol-aldehyde novolac resin.

The embodiments described herein generally relate to methods and chemical compositions of phenolic epoxy systems. In one embodiment, a composition comprising a phenolic epoxy resin system includes an epoxy resin component and an alkoxylated phenol-aldehyde novolac resin.

The embodiments described herein generally relate to methods and chemical compositions of phenolic epoxy systems. In one embodiment, a composition comprising a phenolic epoxy resin system includes an epoxy resin component and an alkoxylated phenol-aldehyde novolac resin.

An epoxy resin composition comprising an epoxy resin, a curing agent, (A) a carboxyl-containing benzotriazole derivative, and (B) an alkoxysilyl-containing aminoalkylsilane derivative is suited for encapsulating semiconductor devices. The sum of (A)+(B) is 0.5-5.0 pbw per 100 pbw of the sum of the epoxy resin and the curing agent, and a molar ratio (A)/(B) is 0.5-1.5. The composition is free of sulfur and highly adhesive to metal substrates.