Patent classifications
C09D181/02
CHALCOGENIDE HYBRID ORGANIC/INORGANIC POLYMERS FILMS AND COATINGS AND THE USE THEREOF
The present invention provides certain CHIP films and coatings, as well as the preparation and uses thereof. Chalcogenide hybrid organic/inorganic polymers or CHIPs may be suitable for use in antireflection coatings for use with infrared optics, for example as applied to lenses for infrared cameras. The coatings may be applied with spin coating and have a thickness related to the quarter wavelength of the desired infrared wavelengths.
AQUEOUS SOLUTION FOR SURFACE TREATMENT, METHOD FOR PRODUCING SURFACE-TREATED ALLOY, AND COMPOSITE AND METHOD FOR PRODUCING THE SAME
An aqueous solution for surface treatment, for treating a surface of an alloy, the aqueous solution comprising: a copper compound at a copper ion concentration of 20000 ppm or more and 50000 ppm or less; a heterocyclic nitrogen compound at a concentration of 200 ppm or more and 3000 ppm or less; and a halide ion at a concentration of 2000 ppm or more and 70000 ppm or less.
AQUEOUS SOLUTION FOR SURFACE TREATMENT, METHOD FOR PRODUCING SURFACE-TREATED ALLOY, AND COMPOSITE AND METHOD FOR PRODUCING THE SAME
An aqueous solution for surface treatment, for treating a surface of an alloy, the aqueous solution comprising: a copper compound at a copper ion concentration of 20000 ppm or more and 50000 ppm or less; a heterocyclic nitrogen compound at a concentration of 200 ppm or more and 3000 ppm or less; and a halide ion at a concentration of 2000 ppm or more and 70000 ppm or less.
Curable Compositions Containing 1,1-Di-Activated Vinyl Compounds and Related Coatings and Processes
Curable compositions comprising 1,1-di-activated vinyl compounds are provided herein. Also provided are coatings formed from 1,1-di-activated vinyl compounds. Also provided are processes for coating substrates and articles. Curable compositions including 1,1-di-activated vinyl compounds that function as crosslinking agents are described.
Curable Compositions Containing 1,1-Di-Activated Vinyl Compounds and Related Coatings and Processes
Curable compositions comprising 1,1-di-activated vinyl compounds are provided herein. Also provided are coatings formed from 1,1-di-activated vinyl compounds. Also provided are processes for coating substrates and articles. Curable compositions including 1,1-di-activated vinyl compounds that function as crosslinking agents are described.
COMPOSITION INCLUDING AMINO-FUNCTIONAL SILANES AND METHOD OF APPLYING A SEALANT TO A SUBSTRATE
The composition includes a first amino-functional silane including an amino group and a silane group, in which the amino group and the silane group are connected by an organic linking group, and a second amino-functional silane including a secondary or tertiary amino group and least two independently selected silane groups, in which the secondary or tertiary amino group is connected to each of the two independently selected silane groups by organic linking groups. The first amino-functional silane can be a polyamino-functional silane having at least two amino groups and a silane group in which at least one of the amino groups and the silane group are connected by an organic linking group. The composition can include a photoluminescent compound exhibiting photoluminescence at an excitation wavelength above 400 nanometers. Use of the composition as an adhesion promoter and a method including applying the composition to a substrate surface are also disclosed.
ECO-FRIENDLY ADHESIVE COATING AGENT COMPOSITION FOR STEEL PIPE USING INTERMEDIATE FOR STRUCTURAL ADHESIVE
Disclosed is an eco-friendly adhesive coating agent composition having high adhesion properties and fast-curing properties by using a thiol-modified epoxy intermediate. The composition includes: a main material including 25 to 40 parts by weight of polyoxypropyleneamine, 20 to 30 parts by weight of a cross-linking agent, 10 to 30 parts by weight of the thiol-modified epoxy intermediate, 10 to 20 parts by weight of an inorganic filler, 5 to 10 parts by weight of a pigment, and 2 to 5 parts by weight of an additive; and a curing agent including 60 to 80 parts by weight of a rubber-modified epoxy resin, 20 to 40 parts by weight of a polyol, 10 to 30 parts by weight of the thiol-modified epoxy intermediate, and 4 to 10 parts by weight of an additive, with respect to 100 parts by weight of an isocyanate mixture.
POWDERED MATERIAL (P) CONTAINING POLY(ARYLENE SULFIDE) (PAS) POLYMER AND ITS USE FOR ADDITIVE MANUFACTURING
The present invention relates to a powdered material (M) containing at least one poly(arylene sulfide) (PAS) polymer, comprising recurring units p, q and r according of formula (I) wherein n.sub.p, n.sub.q and n.sub.r are respectively the mole % of each recurring units p, q and r; recurring units p, q and r are arranged in blocks, in alternation or randomly; 2≤(n.sub.q+n.sub.r)/(n.sub.p+n.sub.q+n.sub.r)≤9; nq is ≥0% and nr is ≥0%; j is zero or an integer varying between 1 and 4; R.sup.1 is selected from the group consisting of halogen atoms, C.sub.1-C.sub.12 alkyl groups, C.sub.7-C.sub.24 alkylaryl groups, C.sub.7-C.sub.24 aralkyl groups, C.sub.6-C.sub.24 arylene groups, C.sub.1-C.sub.12 alkoxy groups, and C.sub.6-C.sub.18 aryloxy groups.
##STR00001##
POWDERED MATERIAL (P) CONTAINING POLY(ARYLENE SULFIDE) (PAS) POLYMER AND ITS USE FOR ADDITIVE MANUFACTURING
The present invention relates to a powdered material (M) containing at least one poly(arylene sulfide) (PAS) polymer, comprising recurring units p, q and r according of formula (I) wherein n.sub.p, n.sub.q and n.sub.r are respectively the mole % of each recurring units p, q and r; recurring units p, q and r are arranged in blocks, in alternation or randomly; 2≤(n.sub.q+n.sub.r)/(n.sub.p+n.sub.q+n.sub.r)≤9; nq is ≥0% and nr is ≥0%; j is zero or an integer varying between 1 and 4; R.sup.1 is selected from the group consisting of halogen atoms, C.sub.1-C.sub.12 alkyl groups, C.sub.7-C.sub.24 alkylaryl groups, C.sub.7-C.sub.24 aralkyl groups, C.sub.6-C.sub.24 arylene groups, C.sub.1-C.sub.12 alkoxy groups, and C.sub.6-C.sub.18 aryloxy groups.
##STR00001##
Thermally Conductive Thermoplastics for Selective Laser Sintering
The present disclosure relates to selective laser sintering printing and thermally conductive polymers used therein. Also described are processes for forming an article using selective laser sintering techniques.