An inkjet ink is provided. The inkjet ink includes a modified high-performance engineering plastic, a polar solvent, and a wetting agent. Additionally, a 3D printing method and a 3D printing object are provided. The modified high-performance engineering plastic includes modified polyphenylene sulfide, modified polyether-ether-ketone, modified polyether sulfone, modified polyphenylsulfone, or modified polysulfone.

An inkjet ink is provided. The inkjet ink includes a modified high-performance engineering plastic, a polar solvent, and a wetting agent. Additionally, a 3D printing method and a 3D printing object are provided. The modified high-performance engineering plastic includes modified polyphenylene sulfide, modified polyether-ether-ketone, modified polyether sulfone, modified polyphenylsulfone, or modified polysulfone.

A foam molding composition from which a foam molded body and a foamed electric wire can be produced having excellent heat resistance, a small average cell size, a high foaming ratio, and good outer diameter stability. The foam molding composition includes a resin (A) having a pyrolysis temperature of 330° C. or higher and at least one compound (B) selected from phosphoric acid esters and salts thereof and phosphoric acid ester complex compounds. Also disclosed is a foam molded body obtained from the foam molding composition, an electric wire including a core wire and a covering material covering the core wire obtained from the foam molding composition, and a method for producing the foam molded body.

A foam molding composition from which a foam molded body and a foamed electric wire can be produced having excellent heat resistance, a small average cell size, a high foaming ratio, and good outer diameter stability. The foam molding composition includes a resin (A) having a pyrolysis temperature of 330° C. or higher and at least one compound (B) selected from phosphoric acid esters and salts thereof and phosphoric acid ester complex compounds. Also disclosed is a foam molded body obtained from the foam molding composition, an electric wire including a core wire and a covering material covering the core wire obtained from the foam molding composition, and a method for producing the foam molded body.

A frequently-touched surface for use by multiple users includes a surface protected by a laminate structure. The laminate structure includes a self-sterilizing sulfonated polymeric outer layer, sulfonated to a certain % to kill at least 95% microbes within 30 minutes of contact. The self-sterilizing sulfonated polymer layer can be applied to the frequently touched surface by any of coating, lamination, and spraying. The sulfonated polymer in embodiment is selected from perfluorosulfonic acid polymers, polystyrene sulfonates, sulfonated block copolymers, sulfonated polyolefins, sulfonated polyimides, sulfonated polyamides, sulfonated polyesters, sulfonated polysulfones, sulfonated polyketones, sulfonated poly(arylene ether), and mixtures thereof. The sulfonated polymer has a degree of sulfonation of at least 10%.

Compositions comprising thiol-terminated sulfur-containing prepolymers, curing agents reactive with the thiol-terminated sulfur-containing prepolymers, and ionic liquid catalysts, useful in aerospace sealant applications are disclosed. The use of ionic liquid catalysts provides curable sealant compositions having an extended working time and a rapid cure rate.

Compositions comprising thiol-terminated sulfur-containing prepolymers, curing agents reactive with the thiol-terminated sulfur-containing prepolymers, and ionic liquid catalysts, useful in aerospace sealant applications are disclosed. The use of ionic liquid catalysts provides curable sealant compositions having an extended working time and a rapid cure rate.

A method for producing a coating film-forming composition for lithography, including a step for passing a liquid through a filter cartridge. The filter cartridge is obtained by layering more than one type of filtration base fabrics or winding same around a hollow inner tube, wherein: the fabrics are non-woven fabrics in which metal-adsorbing groups are chemically bonded to polyolefin fibers; the fabrics contain non-woven fabric layers A and B; layer A is configured from polyolefin fibers to which sulfonic acid groups are chemically bonded as metal-adsorbing groups; and layer B is configured from polyolefin fibers to which at least one type selected from among amino groups, N-methyl-D-glucamine groups, iminodiacetic acid groups, iminodiethanol groups, amidoxime groups, phosphoric acid groups, carboxylic acid groups and ethylenediamine triacetic acid groups chemically bonded as metal-adsorbing groups. Thus, the amount of metal impurities that are the cause of minute defects on a wafer can be reduced.

A method for producing a coating film-forming composition for lithography, including a step for passing a liquid through a filter cartridge. The filter cartridge is obtained by layering more than one type of filtration base fabrics or winding same around a hollow inner tube, wherein: the fabrics are non-woven fabrics in which metal-adsorbing groups are chemically bonded to polyolefin fibers; the fabrics contain non-woven fabric layers A and B; layer A is configured from polyolefin fibers to which sulfonic acid groups are chemically bonded as metal-adsorbing groups; and layer B is configured from polyolefin fibers to which at least one type selected from among amino groups, N-methyl-D-glucamine groups, iminodiacetic acid groups, iminodiethanol groups, amidoxime groups, phosphoric acid groups, carboxylic acid groups and ethylenediamine triacetic acid groups chemically bonded as metal-adsorbing groups. Thus, the amount of metal impurities that are the cause of minute defects on a wafer can be reduced.

The present disclosure provides methods of coating a substrate. A method includes depositing a conductive coating including an electrically conductive material over the substrate to form a conductive layer having a sheet resistivity of about 10 Ω/□ to about 1000 Ω/□. The method includes depositing an anti-icing layer comprising nanomaterials over the conductive layer to form a coating system.