Methods of forming a ceramic-polymer composite powders comprise: superheating a mixture of polymer, solvent, and ceramic, to dissolve the polymer in the solvent; agitating the superheated mixture while substantially maintaining the mixture at an elevated temperature and pressure; and cooling the mixture to cause the polymer to precipitate on the particles of the ceramic and thereby form a plurality of the present polymer-ceramic core-shell particles. Methods of molding a part comprise subjecting a powder of the present polymer-ceramic core-shell particles that substantially fills a mold to a first pressure while the powder is at or above a first temperature above a melting temperature (T.sub.m) of the polymer. The ceramic can be selected from the group of ceramics consisting of: Al.sub.2O.sub.3, Fe.sub.2O.sub.3, ZnO, ZrO.sub.2, and SiO.sub.2. The polymer can be selected from the group of polymers consisting of: PC copolymers, polyetherimide (PEI), polyetherimide (PEI) copolymers, polyphenylsulfone (PPSU), polyarylethersulfone (PAES), and polyether sulfones (PES).

Methods of forming a ceramic-polymer composite powders comprise: superheating a mixture of polymer, solvent, and ceramic, to dissolve the polymer in the solvent; agitating the superheated mixture while substantially maintaining the mixture at an elevated temperature and pressure; and cooling the mixture to cause the polymer to precipitate on the particles of the ceramic and thereby form a plurality of the present polymer-ceramic core-shell particles. Methods of molding a part comprise subjecting a powder of the present polymer-ceramic core-shell particles that substantially fills a mold to a first pressure while the powder is at or above a first temperature above a melting temperature (T.sub.m) of the polymer. The ceramic can be selected from the group of ceramics consisting of: Al.sub.2O.sub.3, Fe.sub.2O.sub.3, ZnO, ZrO.sub.2, and SiO.sub.2. The polymer can be selected from the group of polymers consisting of: PC copolymers, polyetherimide (PEI), polyetherimide (PEI) copolymers, polyphenylsulfone (PPSU), polyarylethersulfone (PAES), and polyether sulfones (PES).

Articles include a substrate, such as a semiconductor wafer, having a backside and a backside film layer deposited on the backside of the substrate, wherein the backside film layer includes a polymer. The backside film layer mitigates bowing or warpage of the substrate which may occur when one or more frontside film layers are deposited on the frontside of the substrate. To form the backside film layer, a film composition including the polymer, optionally wetting agent, and optionally solvent may be deposited on the backside of the substrate.

Articles include a substrate, such as a semiconductor wafer, having a backside and a backside film layer deposited on the backside of the substrate, wherein the backside film layer includes a polymer. The backside film layer mitigates bowing or warpage of the substrate which may occur when one or more frontside film layers are deposited on the frontside of the substrate. To form the backside film layer, a film composition including the polymer, optionally wetting agent, and optionally solvent may be deposited on the backside of the substrate.

Antibacterial thermoplastic substrate and its uses, the substrate including at least one thermoplastic and at least one framework silicate, the framework silicate containing at least one antibiotic metal and/or antibiotic metal ion and the substrate having a silicate layer on at least a portion of the outer surface. The substrate is suitable for use as semi-finished products in the automotive industry, in mechanical engineering, in apparatus construction, for chemical plants, in tool manufacturing, in the pharmaceutical, food, and packaging industries, in the electrical and electronics sector, in sanitary and furniture manufacturing, in the water treatment and drinking water industry, in sealing materials such as silicone seals in bathrooms, in the manufacture of cosmetics and writing instruments, in the oil and gas industry, in medical products, and/or in construction products.

Antibacterial thermoplastic substrate and its uses, the substrate including at least one thermoplastic and at least one framework silicate, the framework silicate containing at least one antibiotic metal and/or antibiotic metal ion and the substrate having a silicate layer on at least a portion of the outer surface. The substrate is suitable for use as semi-finished products in the automotive industry, in mechanical engineering, in apparatus construction, for chemical plants, in tool manufacturing, in the pharmaceutical, food, and packaging industries, in the electrical and electronics sector, in sanitary and furniture manufacturing, in the water treatment and drinking water industry, in sealing materials such as silicone seals in bathrooms, in the manufacture of cosmetics and writing instruments, in the oil and gas industry, in medical products, and/or in construction products.

Disclosed herein are ionomer blends and high temperature polymer electrolyte membranes for use in electrochemical cells. The ionomer blends include a mixture of polyphosphonic acids and polysulfonic acids. The high temperature polymer electrolyte membranes include crosslinked polymeric networks.

Disclosed herein are ionomer blends and high temperature polymer electrolyte membranes for use in electrochemical cells. The ionomer blends include a mixture of polyphosphonic acids and polysulfonic acids. The high temperature polymer electrolyte membranes include crosslinked polymeric networks.

A semiconducting tape for a power or signal carrying cable or a conductor assembly thereof is described herein. The semiconducting tape may include a nonwoven sheet and a semiconductive composition disposed on the nonwoven sheet. The semiconductive composition may include a resin or a polymer and a conductive material disposed in the resin or the polymer. The nonwoven sheet may include a first plurality of fibers and a second plurality of fibers, wherein the first plurality of fibers is different than the second plurality of fibers. The semiconducting tape may have a penetration resistance of less than 5% or a penetration resistance of about 400 Newtons (N) or greater.

A semiconducting tape for a power or signal carrying cable or a conductor assembly thereof is described herein. The semiconducting tape may include a nonwoven sheet and a semiconductive composition disposed on the nonwoven sheet. The semiconductive composition may include a resin or a polymer and a conductive material disposed in the resin or the polymer. The nonwoven sheet may include a first plurality of fibers and a second plurality of fibers, wherein the first plurality of fibers is different than the second plurality of fibers. The semiconducting tape may have a penetration resistance of less than 5% or a penetration resistance of about 400 Newtons (N) or greater.